IEC TR 62153-4-0-2007 Metallic communication cable test methods - Part 4-0 Electromagnetic compatibility (EMC) - Relationship between surface transfer impedance.pdf

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1、 IEC/TR 62153-4-0 Edition 1.0 2007-11 TECHNICAL REPORT RAPPORT TECHNIQUE Metallic communication cable test methods Part 4-0: Electromagnetic compatibility (EMC) Relationship between surface transfer impedance and screening attenuation, recommended limits Mthodes dessai des cbles mtalliques de commun

2、ication Partie 4-0: Compatibilit lectromagntique (CEM) Relation entre limpdance de transfert en surface et laffaiblissement dcran, limites recommandes IEC/TR 62153-4-0:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified

3、 no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IE

4、C copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reprodu

5、ite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des d

6、roits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commi

7、ssion (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the la

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12、blie des normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amend

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15、r dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.

16、iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TR 62153-4-0 Edition 1.0 2007-11 TECHNI

17、CAL REPORT RAPPORT TECHNIQUE Metallic communication cable test methods Part 4-0: Electromagnetic compatibility (EMC) Relationship between surface transfer impedance and screening attenuation, recommended limits Mthodes dessai des cbles mtalliques de communication Partie 4-0: Compatibilit lectromagnt

18、ique (CEM) Relation entre limpdance de transfert en surface et laffaiblissement dcran, limites recommandes INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE N ICS 33.100; 33.120.10 PRICE CODE CODE PRIX ISBN 2-8318-9363-1 2 TR 62153-4-0 IEC:2007 INTERNATIONAL ELECTR

19、OTECHNICAL COMMISSION _ METALLIC COMMUNICATION CABLE TEST METHODS Part 4-0: Electromagnetic compatibility (EMC) Relationship between surface transfer impedance and screening attenuation, recommended limits FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization fo

20、r standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publis

21、hes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may pa

22、rticipate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement

23、 between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publi

24、cations have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or f

25、or any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the correspo

26、nding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the late

27、st edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whet

28、her direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is in

29、dispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical

30、 committees is to prepare International Standards. However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62153-4-0, which

31、is a technical report, has been prepared by IEC technical committee 46: Cables, wires, waveguides, R.F. connectors, R.F. and microwave passive components and accessories. This publication cancels and replaces IEC/TR 62064, published in 1999. TR 62153-4-0 IEC:2007 3 The text of this technical report

32、is based on the following documents: Enquiry draft Report on voting 46/197/DTR 46/252/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Direc

33、tives, Part 2. A list of all parts of the IEC 62153 series, under the general title: Metallic communication cable test methods, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IE

34、C web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 4 TR 62153-4-0 IEC:2007 METALLIC COMMUNICATION CABLE TEST METHODS Part 4-0: Electromagnetic compatibility

35、 (EMC) Relationship between surface transfer impedance and screening attenuation, recommended limits 1 Scope This technical report describes important background material used during the revision of IEC 61196-1:1995, Clause 14, Guidance for surface transfer impedance and screening attenuation limits

36、 for flexible r.f. cables. In this technical report, the relationship between surface transfer impedance (Z T ) and screening attenuation (a s ) is given, also measurements of Z T and a s are provided to show the correlation of mean screening attenuation between 200 MHz and 500 MHz and Z Tat both 30

37、 MHz and 300 MHz. The sensitivity of a s to the relative velocity difference between the inner and outer system is shown. The cable data sheet should show the a svalues in a standardized form v/v = 10 % and the characteristic impedance of the outer system is 150 . It is also shown that a relative ve

38、locity difference change from 10 % to 40 % gives an improvement of 12 dB in screening attenuation. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the lates

39、t edition of the referenced document (including any amendments) applies. IEC/TR 61917, Cables, cable assemblies and connectors Introduction to electromagnetic (EMC) screening measurements 3 General At high frequencies, when the surface transfer impedance Z Tand effective transfer impedance T F TE f

40、n, Z Z Z = increase 6 dB per octave, the relationship to the screening attenuation a sis frequency independent and can be written as (see also Figure 1): n f 10 n f s log 20 T a = (1) r1 r2 2 1 o T 10 1 2 2 1 T 10 c log 20 log 20 = = Z Z Z v l v l Z Z Z(2) and TR 62153-4-0 IEC:2007 5 1 1 2 2n f n f

41、/ / Z U Z U T = (3) where l is the length of the cable under test; D 1 is the cylinder diameter; E 1is the source voltage; T n,f are the coupling transfer functions; n is for the near end and f for the far end; U 1nis the inner circuit near end voltage; U 2nis the outer circuit near end voltage; U 1

42、fis the inner circuit far end voltage; U 2fis the outer circuit far end voltage; Z 1 is the characteristic impedance of the cable; Z 2 is the impedance of the outer circuit; r1 is the cable dielectric permittivity; r2 is the permittivity of the outer circuit; c o is the velocity of light in vacuum;

43、is the radian frequency; v 1 is the propagation velocity of the inner circuit; v 2 is the propagation velocity of the outer circuit; Z F is the capacitive coupling impedance; Z T is the surface transfer impedance; f n, TE Z is the effective transfer impedance. l E 1Z 1Z 2Z 2 Z 1D 1 Z 1v 1Z 2v 2 U 1n

44、 U 2nU 2fU 1f+ 1 2 IEC 2143/07 Key 1 inner circuit, cable under test 2 outer circuit, formed by test line or cylinder or the outer environment as in the absorbing clamp method Figure 1 Concept of screening measurement set-ups 6 TR 62153-4-0 IEC:2007 When the capacitive coupling impedance Z Fis prese

45、nt (spaces in the outer conductor), Z Tshall be substituted by Z TE . “+“ sign is for the near end and “ sign for the far end. Z 1and Z 2are the impedances of the inner and outer system and v 1and v 2the corresponding velocities. Screening attenuation a sis a reliable measure of screening efficiency

46、 when the frequency is constant. This is true when Z Tor Z TE increases 6 dB/octave and the following criterion is fulfilled: r2 r1 o n f l (4) where o is the wave length in free space. At lower frequencies when l is smaller than that found from (4), the coupling attenuation is: 2 1 T F 10 n f 10 n

47、f s 2 ) ( log 20 log 20 Z Z l Z Z T A = = (5) More detailed information on the above equations is given in the IEC/TR 61917. 4 Correlation between measured screening attenuation a sand measured surface transfer impedances at 30 MHz and 300 MHz Z Tand a swere measured using the same cable constructio

48、n. Figures 2, 3 and 4 show the correlation between a s(mean value between 200 MHz and 500 MHz) and the Z Tvalues correspondingly at 30 MHz and 300 MHz. In Figure 5, typical Z Tcurves are shown. For single and double braided outer conductors, the 6 dB/octave increase is reached at 30 MHz but for foil

49、braid constructions at 30 MHz, Z Tcan still be decreasing. The effect of this can be clearly seen when comparing the test results in Figures 2, 3 and 4 for the foil-braid cables. The correlation between a sand Z T (30 MHz) is poor, but much better between a sand Z T (300 MHz). For single and double braided cables, the correlation is e

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