JIS B 4455-1998 Hand-and machine-operated circular screwing dies for parallel pipe threads《平行管螺纹用手攻和机攻圆板牙》.pdf

相关资源

JIS C9901 AMD 1-2018 Methods of calculation and representation of energy efficiency standard achievement percentage of electrical and electronic appliances (Ame.pdf

JIS B8366-1-2018 Fluid power systems and components -- Cylinders 《流体动力系统和元件 液压缸 元件和识别代码 第1部分 缸径和活塞杆.pdf

JIS Z4716-2018 Measurement methods of leakage X-ray from X-ray examination rooms《X射线检查室泄漏X射线的测量方法》.pdf

JIS Z2345-4-2018 Standard test blocks for ultrasonic testing -- Part 4 Standard test blocks for angle beam ultrasonic testing《超声检测用标准试块 第4部分 斜射超声检测用标准试块》.pdf

JIS Z2345-3-2018 Standard test blocks for ultrasonic testing -- Part 3 Standard test blocks for normal ultrasonic testing《超声检测用标准试块 第3部分 普通超声检测用标准试块》.pdf

JIS Z2345-2-2018 Standard test blocks for ultrasonic testing -- Part 2 A7963 Standard Test Block《超声检测用标准试块 第2部分 A7963标准试块》.pdf

JIS Z2345-1-2018 Standard test blocks for ultrasonic testing -- Part 1 A1 Standard Test Block《超声检测用标准试块 第1部分 A1标准试块》.pdf

JIS Z2242-2018 Method for Charpy pendulum impact test of metallic materials《金属材料的摆式冲击试验方法》.pdf

JIS Z0150-2018 Packaging -- Distiribution packaging -- Graphical symbols for handling and storage of packages《包装 畸变包装 包装处理和储存用图形符号》.pdf

JIS X6302-9-2018 Identification cards -- Recording technique -- Part 9 Tactile identifier mark《识别卡 记录技术 第9部分 触式鉴别器标志》.pdf

猜你喜欢

JEDEC JEP133C-2010 Guide for the Production and Acquisition of Radiation-Hardness- Assured Multichip Modules and Hybrid Microcircuits.pdf

JEDEC JEP134-1998 Guidelines for Preparing Customer-Supplied Background Information Relating to a Semiconductor-Device Failure Analysis《顾客提供的半导体仪器失败分析背景信息指南》.pdf

JEDEC JEP136-1999 Signature Analysis《信号分析》.pdf

JEDEC JEP137B-2004 Common Flash Interface (CFI) ID Codes《公共Flash接口(CFI)代码》.pdf

JEDEC JEP138-1999 User Guidelines for IR Thermal Imaging Determination of Die Temperature《模具温度的IR热成像确定用户指南》.pdf

JEDEC JEP139-2000 Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding《老化应力松弛特征化铝互连线金属喷镀》.pdf

JEDEC JEP140-2002 Beaded Thermocouple Temperature Measurement of Semiconductor Packages《半导体珠状温度测试》.pdf

JEDEC JEP142-2002 Obtaining and Accepting Material for Use in Hybrid MCM Products《混合 MCM产品中获取和接受材料》.pdf

JEDEC JEP143C-2012 Solid-State Reliability Assessment and Qualification Methodologies.pdf