1、BSI Standards Publication BS ISO/IEC 30129:2015 Information technology Telecommunications bonding networks for buildings and other structuresBS ISO/IEC 30129:2015 BRITISH STANDARD National foreword This British Standard is the UK implementation of ISO/IEC 30129:2015. The UK participation in its prep
2、aration was entrusted to Technical Committee TCT/7/2, Telecommunications; Installation requirements: Cabling installation and UK implementation. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the nec
3、essary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2015. Published by BSI Standards Limited 2015 ISBN 978 0 580 82871 3 ICS 35.200 Compliance with a British Standard cannot confer immunity from legal obligations. This British Standar
4、d was published under the authority of the Standards Policy and Strategy Committee on 31 October 2015. Amendments/corrigenda issued since publication Date T e x t a f f e c t e dBS ISO/IEC 30129:2015 ISO/IEC 30129 Edition 1.0 2015-10 INTERNATIONAL STANDARD Information technology Telecommunications b
5、onding networks for buildings and other structures INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 35.200 ISBN 978-2-8322-2924-8 Warning! Make sure that you obtained this publication from an authorized distributor. colour insideBS ISO/IEC 30129:2015 2 ISO/IEC 30129:2015 ISO/IEC 2015 CONTENTS FOREWORD
6、. 5 INTRODUCTION . 6 1 Scope 8 2 Normative references 8 3 Terms, definitions and abbreviations . 9 3.1 Terms and definitions 9 3.2 Abbreviations 11 4 Conformance . 12 5 Overview of bonding networks . 12 6 Selection of the telecommunications bonding network approach 13 6.1 Assessment of the impact of
7、 the telecommunications bonding network on the interconnection of telecommunications equipment 13 6.2 Telecommunications bonding networks . 14 6.3 Telecommunications bonding network performance 15 6.3.1 General . 15 6.3.2 Requirements 16 6.3.3 DC resistance measurements 17 7 Common features 17 7.1 G
8、eneral . 17 7.2 Protective bonding networks . 18 7.2.1 Protective bonding network conductors (PBNCs) . 18 7.2.2 Main earthing terminal (MET) . 18 7.3 Telecommunications entrance facility (TEF) 18 7.4 Telecommunications bonding network components . 18 7.4.1 Telecommunications bonding network conducto
9、rs . 18 7.4.2 Telecommunications bonding network connections 19 7.5 Cabinets, frames and racks . 19 7.5.1 External connections to a bonding network 19 7.5.2 Rack bonding conductors. 20 7.5.3 Internal connections 21 7.6 Miscellaneous bonding connections 22 7.6.1 General . 22 7.6.2 Bonding conductors
10、for d.c. resistance control . 22 7.6.3 Bonding conductors for impedance control 22 7.7 Documentation 23 8 Dedicated telecommunications bonding network 23 8.1 General . 23 8.2 Components . 24 8.2.1 Primary bonding busbar (PBB) . 24 8.2.2 Secondary bonding busbar (SBB) 25 8.2.3 Bonding conductors for
11、d.c. resistance control . 25 8.2.4 Bonding conductors for impedance control 26 8.3 Implementation . 27 8.3.1 Primary bonding busbar (PBB) . 27 8.3.2 Secondary bonding busbar (SBB) 28 BS ISO/IEC 30129:2015 ISO/IEC 30129:2015 3 ISO/IEC 2015 8.3.3 Telecommunications bonding conductor (TBC) 28 8.3.4 Tel
12、ecommunications bonding backbone (TBB) . 29 8.3.5 Backbone bonding conductor (BBC) 29 8.3.6 Bonds to continuous conductive pathway systems . 29 8.3.7 Bonds to structural metal . 29 9 Local telecommunications bonding networks in conjunction with protective bonding networks 30 9.1 Bonding for local di
13、stribution . 30 9.1.1 Star protective bonding networks . 30 9.1.2 Ring protective bonding networks 31 9.2 Telecommunications bonding conductors 32 9.2.1 Bonding conductors for d.c. resistance control . 32 9.2.2 Bonding conductors for impedance control 32 9.3 Bonding for areas of telecommunications e
14、quipment concentration . 33 10 Local telecommunications bonding networks in conjunction with dedicated telecommunications bonding networks . 33 10.1 Bonding for areas of telecommunications equipment concentration . 33 10.1.1 Requirements 33 10.1.2 Recommendations . 33 10.1.3 Cabinets, frames and rac
15、ks . 33 10.2 Telecommunications equipment bonding conductors (TEBC) 33 10.2.1 TEBC for d.c. resistance control 33 10.2.2 TEBC for impedance control 34 10.2.3 Implementation 34 11 Mesh bonded networks 34 11.1 General . 34 11.2 Mesh bonding alternatives 35 11.2.1 Local mesh bonding (MESH-IBN) networks
16、 35 11.2.2 MESH-BN 37 11.3 Bonding conductors of a mesh bonding network 38 11.3.1 Requirements 38 11.3.2 Recommendations . 38 11.4 Bonding conductors to the mesh bonding network . 38 11.5 Supplementary bonding grid (SBG) . 39 11.6 System reference potential plane (SRPP) . 39 11.6.1 General . 39 11.6
17、.2 Access floors . 40 11.6.3 Transient suppression plate (TSP) . 41 Annex A (normative) Maintenance of telecommunications bonding network performance . 42 A.1 General . 42 A.2 Periodic activity 42 A.2.1 Schedule . 42 A.2.2 Implementation 42 A.3 Causes of performance deterioration 43 A.3.1 Galvanic c
18、orrosion . 43 A.3.2 Requirements 43 Annex B (normative) Bonding conductor cross-sectional area 44 Annex C (infomative) Alternative terminology . 45 BS ISO/IEC 30129:2015 4 ISO/IEC 30129:2015 ISO/IEC 2015 Bibliography 46 Figure 1 Schematic relationship between ISO/IEC 30129 and other relevant standar
19、ds 7 Figure 2 Schematic of telecommunications equipment distribution and associated bonding connections . 13 Figure 3 Example of three methods of equipment and rack bonding . 20 Figure 4 Example of a bond connection from a cabinet to the cabinet door 22 Figure 5 Example of bonding straps . 23 Figure
20、 6 Illustrative example of a large building . 24 Figure 7 Illustrative example of a smaller building 24 Figure 8 Schematic of PBB 25 Figure 9 Schematic of SBB 25 Figure 10 Star protective bonding and supplementary telecommunications bonding . 30 Figure 11 Example of high common impedance and large l
21、oop 30 Figure 12 Example of low common impedance and small loop . 31 Figure 13 Ring protective bonding and supplementary telecommunications bonding 31 Figure 14 MESH-BN example 32 Figure 15 Example TEBC to rack bonding conductor connection 34 Figure 16 Local mesh bonding network 36 Figure 17 A MESH-
22、IBN having a single point of connection (SPC) . 36 Figure 18 A MESH-BN with equipment cabinets, frames, racks and CBN bonded together 37 Figure 19 Example of access floor . 40 Figure 20 Example of installation details for an under floor transient suppression plate . 41 Table 1 Sensitivity of cabling
23、 media to bonding network performance 14 Table 2 Telecommunications bonding network requirements 14 Table 3 DC resistance requirements for protective bonding networks . 16 Table 4 DC resistance requirements for dedicated telecommunications bonding networks . 17 Table 5 TBB conductor sizing 26 Table
24、B.1 Bonding conductor cross-sectional areas . 44 Table C.1 Alternative terminology 45 BS ISO/IEC 30129:2015 ISO/IEC 30129:2015 5 ISO/IEC 2015 INFORMATION TECHNOLOGY TELECOMMUNICATIONS BONDING NETWORKS FOR BUILDINGS AND OTHER STRUCTURES FOREWORD 1) ISO (the International Organization for Standardizat
25、ion) and IEC (the International Electrotechnical Commission) form the specialized system for worldwide standardization. National bodies that are members of ISO or IEC participate in the development of International Standards through technical committees established by the respective organization to
26、deal with particular fields of technical activity. ISO and IEC technical committees collaborate in fields of mutual interest. Other international organizations, governmental and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information technology, ISO and
27、 IEC have established a joint technical committee, ISO/IEC JTC 1. 2) The formal decisions or agreements of IEC and ISO on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all intere
28、sted IEC National Committees and ISO member bodies. 3) IEC, ISO and ISO/IEC publications have the form of recommendations for international use and are accepted by IEC National Committees and ISO member bodies in that sense. While all reasonable efforts are made to ensure that the technical content
29、of IEC, ISO and ISO/IEC publications is accurate, IEC or ISO cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees and ISO member bodies undertake to apply IEC, ISO and ISO/
30、IEC publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any ISO, IEC or ISO/IEC publication and the corresponding national or regional publication should be clearly indicated in the latter. 5) ISO and IEC do not provide any at
31、testation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. ISO or IEC are not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the lates
32、t edition of this publication. 7) No liability shall attach to IEC or ISO or its directors, employees, servants or agents including individual experts and members of their technical committees and IEC National Committees or ISO member bodies for any personal injury, property damage or other damage o
33、f any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication of, use of, or reliance upon, this ISO/IEC publication or any other IEC, ISO or ISO/IEC publications. 8) Attention is drawn to the normative references cited in this p
34、ublication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this ISO/IEC publication may be the subject of patent rights. ISO and IEC shall not be held responsible for identifyi
35、ng any or all such patent rights. International Standard ISO/IEC 30129 was prepared by subcommittee 25: Interconnection of information technology equipment, of ISO/IEC joint technical committee 1: Information technology. This International Standard has been approved by vote of the member bodies, and
36、 the voting results may be obtained from the address given on the second title page. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to
37、be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. BS ISO/IEC 30129:2015 6 ISO/IEC 30129:2015 ISO/IEC 2015 INTRODUCTION This International Standard specifies requirements and recommendations for the design and installation of c
38、onnections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information technology (IT) and, more generally, telecommunications equipment is intended to be installed in order to a) minimise the risk to th
39、e correct function of that equipment and interconnecting cabling from electrical hazards, b) provide the telecommunications installation with a reliable signal reference which may improve immunity from electromagnetic interference (EMI). This International Standard specifies assessment criteria to d
40、etermine the relevant bonding configurations that are appropriate, enables the implementation of any bonding configurations that may be necessary by means of either the provision of a bonding network that utilises the existing protective bonding network for electrical safety, or the provision of a d
41、edicated bonding network for the telecommunications infrastructure. This standard is intended for building architects, owners and managers, designers and installers of electrical and telecommunications cabling installations. This International Standard is one of a number of documents prepared in sup
42、port of international standards and technical reports for cabling design produced by ISO/IEC JTC 1/SC 25. Figure 1 shows the inter-relationship between these standards and technical reports. Users of this standard should be familiar with all applicable cabling design and installation standards. NOTE
43、 Telecommunications infrastructure affects raw material consumption. The infrastructure design and installation methods also influence product life and sustainability of electronic equipment life cycling. These aspects of telecommunications infrastructure impact our environment. Since building life
44、cycles are typically planned for decades, technological electronic equipment upgrades are necessary. The telecommunications infrastructure design and installation process magnifies the need for sustainable infrastructures with respect to building life, electronic equipment life cycling and considera
45、tions of effects on environmental waste. Telecommunications designers are encouraged to research local building practices for a sustainable environment and conservation of fossil fuels as part of the design process. BS ISO/IEC 30129:2015 ISO/IEC 30129:2015 7 ISO/IEC 2015 Figure 1 Schematic relations
46、hip between ISO/IEC 30129 and other relevant standards ISO/IEC 11801: Information technology Generic cabling for customer premises ISO/IEC 15018: Information technology Generic cabling for homes ISO/IEC 24764: Information technology Generic cabling systems for data centres ISO/IEC 24702: Information
47、 technology Generic cabling for industrial premises ISO/IEC TR 24704: Information technology Customer premises cabling for wireless access points ISO/IEC 14709-1: Information technology Configuration of customer premises cabling for applications - Part 1: ISDN basic access ISO/IEC 14709-2: Informati
48、on technology Configuration of customer premises cabling for applications - Part 2: ISDN primary rate ISO/IEC 14763-2: Implementation and Operation of Customer Premises Cabling - Part 2: Planning and installation ISO/IEC 30129: Telecommunications bonding networks for buildings and other structures I
49、EC 61935-1: Specification for the testing of balanced and coaxial information technology cabling Part 1: Installed balanced cabling as specified in ISO/IEC 11801 and related standards IEC 61935-3: Testing of balanced and coaxial information technology cabling - Part 3: Installed cabling as specified in ISO/IEC 15018 and related standards ISO/IEC 14763-3: Implementation and Operation of customer premises cabling - Part 3: Testing of optical fibre cabling IEC BS I
