1、171 I ANNUALLY I CUSTOM HYBRID MICROCIRCUITS QML-38510-7 21 September 1989 SUPERSmINLi QML-38510-6 14 June 1989 QUALIFIED MANUFACTURERS LIST OF 1-1 ., CUSTOM HYBRID PRODUCTS QUALIFIED UNDER MILITARY SPECIFICATION MIL-M-38510, APPENDIX G CUSTOM HYBRID MICROCIRCUITS GENERAL REQUIREMENTS FOR This list
2、has been prepared for use by or for the Government in the acquisition of products covered by Specification MIL-“38510, Appendix G. Listing of a product is not intended to and does not connote endorsement of the product by the Department of Defense. This list is subject to change without notice; revi
3、sion or amendment of this list will be issued as necessary. The listing of a product does not release the supplier from compliance with the individual item specification requirements. as agent for all contacts relative to this QML is the Defense Electronics Supply Center (DESC-EQ), Dayton, OH 45444-
4、5000. . If a manufacturer desires to have test data considered for qualification, he must perform all required qualification tests; the qualification sample must be produced with DESC certified materials and manufacturing construction techniques; and he must comply with the requirements specified in
5、 Appendix G, MIL-M-38510, prior to the start of any testing. The listing of custom hybrid microcircuit materials and manufacturing construction techniques in the Qualified Manufacturers List 38510 Supplement applies only to products produced in the plant(s1 specified on the QML. Therefore, only thos
6、e products that have been manufactured, assembled, and tested within the United States and its territories, except as provided by international agreement establishing reciprocal and equivalent quality systems and procedures, can be supplied as qualified custom hybrid QML devices. Custom hybrid micro
7、circuits manufactured, assembled, and tested in accordance with MIL-M-38510, Appendix G, shall not bear the “JAN“ certification mark or the “J“ abbreviation. However, products manufactured, assemb1ed;and tested for Class S or Class B, with all the provisions of MIL-M-38510, Appendix G; MIL-STD-883,
8、Test Method 5008; MIL-STD-1772; and with DESC certified materials and manufacturing construction techniques can be represented as being compliant to appropriate product assurance levels as listed herein. The information contained in this QML reflects the actual material and manufacturing constructio
9、n techniques of the particular test sample(s1. Any product represented as being compliant shall be comprised combinatorially of a manufacturers listing from the materials and to meet the requirements of the user. The user shall be responsible for determining if the QML listing is adequate to demonst
10、rate capability for the intended application. Supplemental testing and listing can be accomplished by application and approval of DESC-EQ. Testing is not limited to those materials and manufacturing construction techniques currently listed in Attachment I, Materials and Manufacturing Construction Te
11、chniques Code Table, However, testing must be completed and approved before the product can be shipped or used in the intended application. To obtain MIL-M-38510, Appendix G, qualified custom hybrid microcircuits, the procurement document must specify that the product be manufactured to MIL-M-38510,
12、 Appendix G; and be comprised of materials and manufacturing construction techniques listed herein, Ordering data is contained in paragraph 6.1 of MIL-M-38510, except item=l shall not require the “JAN“ designator. All procurement documents shall meet the requirements of MIL-M-38510, Appendix F. . -
13、- . “ -_ - - . “ “ “ -. - I THE ACTIVITY RESPONSIBLE FOR THIS QML IS THE UNITED STATES AIR FORCE, CODE 17. The activity designated I -mnfacturingconstrithniuscoet,“as1f-t-7nMII;STl772-and-h-sfs -necessary- “- “ AMSC N/A 1 of 13 CUSTOM HYBRID MICROCIRCUITS QML-38510-7 I DISTRIBUTION STATEMENT A. Appr
14、oved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-All products using the materials and manufacturing construction techniques listed herein have been qualified under the requirements for th production
15、of custom hybrid praducts as specified in the latest affective issue. of MIL-M-38510, Appendix G. MANUFACTURER AND SvMBOLf CAGE REPQRT ASSURAHCE ADDRESS CODE NUMBER LEYEL SUBSTRATE. FABRICATION Advanced Analog Santa Clara, CA 9r505Q-2781 2270 Martin Avenue A Division Qf Intech A, 6, 11(2), 30, 43s 6
16、2, 71 B 1772-331-89 CEXA/52467 I- l, I “ I SUESTRATE ATTACH DIE AND ELEMENT ATTACH BONDING. INTERNAL %iSKF I. I . I I MANUFACTURER ANO. 1 SYMBOL/CAGE ADDRESS CODE NUMBER LEVEL SUBSTRATE FARICAlTnN Analog Devices, Inc. Wilmington, MA 01007 829 Woburn Street Micro Electronics Div. B 1172-884-87 CEW/S1
17、640 A, G, 11(2), 30 I I, I I SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL I I MANUFACTURER AND - SMBOL/CAGE ADDRESS NUMBER LEVEL SUBSTRATE FABRICATION CODE Analog Devices, Inc. Greensboro, NC 27409 7910 Triad Center Driva Computer Labs Division A, G, lltl), 30, 43, 62, 71 B 1172-037-86
18、CETW/34031 % SUBSTRATE ATTACH QIE AND ELEMENT ATTACH BCINQXNG, INTERNAL I t 2 CUSTOM HYBRID MICROCIRCUITS QML-38510-7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I .MANUFACTURER AND $YMBOL/CAGE REPORT ASSURANCE ADDRESS CODE NUMBER LEVEL SUBSTRATE
19、 FABRICATION Beckman Industrial Corp. CEXB/73138 1772-203-88 B A, G, 11 (1 1, 30, 43, 62, 71 Electronic Technologies Div. 414 Palm Street Fullerton, CA 92635 SUBSTRATE ATTACH A(2.971, V, Y, 80, 92, 104 DIE AND ELEMENT ATTACH I BONDING, INTERNAL I A(80), N(AuSi1, Z, 110, A, J(1), Z, 160, 170, 120, .1
20、40, 152 180, 181, 200, 230 A(292). P, Zs 110, 120, 140, 152 F(1601, P, 140, 150 B(1801, P, 140, 155 E(3761, P, 140, 153 z, 110, 120, z, 110, 120, z, 110, 120, MANUFACTURER AND ASSURANCE REPRT SMIIBOL/CAGE ADDRESS SUBSTRATE FABRICATION LEVEL NUMBER CODE Boeing Electronics Co. Kent, WA 98124 20403 68t
21、h Avenue, S. B 1772-740-87 CEUW/81205 I l I I SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL I l A(1121, N(AuSi1, Y, 110, 120, 140, 150, 152 A(272), P, Y, 110, 120, 140, 150, 152 B(540), P, Y, 110, 120, 140, 155 155 B(270), Q, 110, 120, 140, I I I I PRT MANUFACTURER AND ASSURANCE REPORT -
22、 SYMBOLLCAGE ADDRESS SUBSTRATE FABRICATION LEVEL NUMBER CODE Com1 i near “ Corp - “ . Fort Col1 ins, CO 80525 4800 Wheaton Avenue E:EEF- BONDING, INTERNAL DIE AND ELEMENT ATTACH. A(1.061, V, Z, 80, 92, 104 A, L, Z, 202, 210, 220 A(l), J, Y, 161, 170, A(100), P, Y, 110, 111, 120, 140, 150, 152 181, Z
23、OO, 230 . 3 CUSTOM HYBRID MICROCIRCUITS QML-38510-7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-.“. MANUFACTURER AND SYMBOL/CAGE REPORT ADDRESS CODE NUMBER CTS Microelectronfcs CEUR/23223 1772-1 576-86 1201 Cumber1 and Avenue 1772-656-87 West Laf
24、ayette, IN 47906 I SUBSTRATE ATTACH A(0,52), U, I, 82, 92, 104 90, 104 A(0.941, T(Sn-961, Z, 80, 92. 104 A(0.64, S(AU/Ge), f, 80, I IIE AND ELEMENT ATTACH A(801, N(AuSi1 , 120, 140, 150 A(470) , N(AuSi 1 120, 140, 150 A(4601, P, Y, 1 120, 140, 150, B(3601, P, Y, 1 120, 140, 155 B(3601, N(AuGe1 110,
25、120, 140, 140, 153 E(2401s 9s Ys 1 I T ASSURANCE LEVEL SUBSTRATE FABRICATION I BONDING, INTERNAL I A, J(1.0/1.2), Y, 161, D, L(0,90), 202, 210 170, 181, 200, 230 D, L(2.751, 207, 210 A, J(1.2/2.01, Y, 161, A, B(AuSn-80/201, 170, 181 , 200, 230 K(1.391, 204, 210 A, J(0.7/1,0), Y, 161 A, I(4.401, W, 2
26、, 202, 170, 181, 200, 230 21 o D, L(1.90), 202, 212, 220 B(AuSn-80/20) , K(1.391, 204, 210 I tSI PKODDCT MANUFACTURER AND SYMBOL/CAGE REPORT ASSURANCE . ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRICATION El antec, Inc , CEW0/64762 1772-030-88 B A, G, 11(1), 30, 43, 62s 71 1996 Tarob Court Milpitas, CA
27、95035 I I I I SUBSTRATE ATTACH . DIE AND ELEMENT ATTACH BONDING, INTERNAL A(1.321, T(AuSn1, I, 80, A(208), N(AuSi), I, 110, A, J(1,0), Z, 160, A, L(1.881, 202, 210, 90, 104 120, 140, 150 170, 181 , 200, 230 220 I I Tl51 Ir MANUFACTURER AND SYMBOL/CAGE REPORT ADDRESS CODE NUMBER LEVEL SUBSTRATE FABRI
28、CATION I Fi lm Microelectronics, Inc. CEYB/28751 1772-1 83-88 B 10-B Centennial Drive Peabody, MA O1960 SUBSTRATE ATTACH I DIE AND ELEMENT ATTACH I BONDING, INTERNAL I I B(3.931, V, Z, 80, 93, 104 A(302), P, 2, 110, 121, A, J(1), i!, 160, 170, 1 140. 150 I 180. 230 I A, J(4.781, 202, 210 4 CUSTOM HY
29、BRID MICROCIRCUITS QML-38510-7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-?- i I tSI Pl7UDlRl .MANUFACTURER AND ASSURANCE REPORT SYMBOL/CAGE ADDRESS SllBiTRATE FARRICATION LEVEL NUMBER CODE Garrett Canada Canada M9W 6L7 Rexdale, Ontario 40 Voyag
30、er Court A, G, 11(1), 30, 43, 62, 71 B 1772-627-87 CES0/07217 SUBSTRATE ATTACH DIE AND ELEMENT ATTACH bk%F;S:%Nb BONDING, INTERNAL c A(3.0), V, Z, 80, 92, 100 A, J(4.0), W, X, Z, A, J(1), Y, 160, 170, A(1831, P, Y, 110, 120, 140, 150 140, 150 B(270). P, Y, 110, 120, 210, 220, 230 181, 200, 230 I I 1
31、tSI MANUFACTURER AND NUMBER CODE . ADDRESS REPORT SYMBOL/CAGE . _ I General Microcircuits Billerica, MA 08121 780 Boston Road 1772-369-89 CEYC/67294 SUBSTRATE ATTACH DIE AND ELEMENT ATTACH A(1.43), V, Z, 80, 92, 104 A(1581, P, Y, 112, 120, 140, 152 A(1481, P, Y, 112, 120, B(1801, P, Y, 112, 120, 140
32、, 150 140, 155 ASSURANCE LEVEL . SUBSTRATEXABRICATION B B, G, 11(1), 40, 62, 71 BONDING, INTERNAL I StAALNiN;:IErNG I A, J(1), Y, 160, 170, 181, 230 A, I(2.05). W, X, A, J(1), Y, 161, 170 202, 210 1 tSI PRODUCT MANUFACTURER AND ASSURANCE REPORT SYMBOL/CAGE ADDRESS SUBSTRATE FABRICATION LEVEL NUMBER
33、CODE 370 West Trfmble Road San Jose, CA 95131 Hewlett-Packard I CEUS/50434 1772-729-07 B Optical Comnunication Dfv. I 1772-730-87 1/ C, G, 11(1), 62 - I I - 92, 102 U(AuGe)Y, 110, 120, 140, 150 I I I liNG l/ B,-J(-l.,5)-,-Zs BONDING, INTERNAL 181, 230 204, 205, 210, 212 T70, 181, 230 -l6QS-.l/-B(AuS
34、n),K(1 .28), Z,- A, J(1), Z, 160, 171, l/ Listing applies to the following part numbers - 8102801EC, 8302401EC, 6N140A/883B, 8767901EC, - 4N55/883B, HCPL-l900/883B. I 5 CUSTOM HYBRID MICROCIRCUITS QML-38510-7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
35、HS-,-,- ILSI PmCT SYMBOL/CAGE REPORT ASSURANCE MANUFACTURER AND ADDRESS Honeywell, Inc * CEUT/58960 1772-404-87 B A, G, 11(2), 30, 43, 64, 71 Sperry Central Mfg. 21111 North 19th Ave. Phoenix, AZ 85036 CODE NUMBER , LEVEL SUBSTRATE FABRICATION . L SUBSTRATE ATTACH DIE AND ELEMENT ATTACH A(3.01), S(A
36、UGe), Z, 80, A(266), P, Y, 110, 120, 95, 100 140, 150, 152 MANUFACTURER AND ADDRESS Honeywell , Inc. dilitary Avionics Div, 13350 U.S. Highway 19, S, Clearwater, FL 34624 SUBSTRATE ATTACH , 4(2,06), V, Y, 80, 92, 104 I BONDING, INTERNAL A, J(I), Y, 161, 170, 181, 200, 230 . A, J(1), Y, 160, 170, 181
37、, 200, 230 A, J(1.251, N, 160, 161, 170, 181, 200, 230 Pm SYMBOL/CAGE REPORT ASSURANCE CODE NUMBER LEVEL. , , SUBSTRATE FABRICATION. CEWN/09128 1772-1 71 5-86 B A, G, 11(3), 30, 43, 62s 71 A, G, 11(6), 30, 62 B, G, 13(1), 30, 40, 62, 71 DIE AND ELEMENT ,ATTACH -“-L- BONDING, INTERNAL 170, 170, 170,
38、170, 170, 170, MANUFACTURER AND SYMBOL/CAGE HUMBER REPORT rnuuulr I ASSURANCE ADDRESS CODE LEVEL SUBSTRATE FABRICATION IC31 I SUBSTRATE ATTACH, DIE. AND ELEMENT,.ATTACH BONDING, INTERNAL aA%E%W I l I I I. 6 CUSTOM HYBRID MICROCIRCUITS QML-38510-7 Provided by IHSNot for ResaleNo reproduction or netwo
39、rking permitted without license from IHS-,-,-QML-ASLO- 57 m qwwu, oooooLq L m - Its1 PRODUCT NUFAC FACTURER AND ASSURANCE REPORT SYMBOL/CAGE , SUBSTRATE FABRICATION LEVEL NUMBER CODE ADDRESS ILC Data Device Corp. A, G, 11(3), 30, 43, 62, 71 Bohemia, NY 11716 A, G, 11(5), 30, 62 105 Wilbur Place B, G
40、, 13(1), 40, 62, 71 B 1772-232-85 CEPB/19645 SUBSTRATE ATTACH stAkicIGEZ%NG BONDING, INTERNAL DIE AND ELEMENT ATTACH I 7 CUSTOM HYBRID MICROCIRCUITS QlL-38510-7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ltSl Pi MANUFACTURER AND ASSURANCE REPORT
41、 SYMBOL/CAGE ADDRESS CODE B, G, 13(1), 40, 62, 71 B 1772-686-87 CEVQ/50507 SUESTRATE FABRICATION LEVEL NUMBER Micro Networks Co, 324 Clarke Street Worcester, MA 016QF SUBSTRATE ATTACH A(3.306), V, Z, 80, 92, 102 MANUFACTURER AND ADDRESS Micra-Re1 Division Medtronlc, Inc c 2343 West 10th Place Tempe,
42、 AZ 86281 SUBSTRATE ATTACH Not Applicable DIE AND ELEMENT ATTACH SYMBOLKAGE CODE CEUZ/8K957 J 1 BONDING, INTERNAL A, J(11, Y, 160, 161, 170, 180, 181, 185, 200, 230 PRCT REPORT SUBSTRATE FABRICATION LEVEL NUMBER ASSURANCE 1772-880-87 C, G, 18(4), ii(i), 34D 62 B I I I DIE AND ELEMENT ATTACH StA%GiE%
43、:v BONDING, INTERNAL I I MANUFACTURER ANO ASSURANCE REPORT SYHEOL/CAGE ADDRESS CODE SUBSTRATE FABRICATION LEVEL NUMBER r Natlonal Semlconductor 1 CCXP/27014 1 1772-762-87 1 B 1 A, 6, 11(1I, 45, 65, 71 6900 S. Cal le Santa Cruz Tucson, AZ 85706 I I I I I SUBSTRATE ATTACH DIE ANI) ELEMENT ATTACH BONDI
44、NG. INTERNAL bkA!ik!GiE:!iw Y f I 8 CUSTOM HYBRID MICROCIRCUITS QML-38510-7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MANUFACTURER AND I L31 ADDRESS SYMBOL/CAGE NUMBER CODE REPORT Raytheon Company Microwave 200, 230 11, Y, 161, 170, 200. 230 E,
45、 K(28j, Y, 160, 170, 181, 200, 230 A, I(5.71, W, X, 202, 210 9 CUSTOM HYBRID MICROCIRCUITS QML-38510-7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ltsr PR(JUOCT MANUFACTURER AND ASSURANCE REPORT SYMBOL/CAGE . ADDRESS CODE SUBSTRATE FABRICATION LE
46、VEL NUMBER Teledyne Philbrick Bedham, MA 02026 40 Allied Drive A, G, 11(1 I, 30, 43, 62, 71 B 1772-1 196-86 CETY/29832 I I I I SUBSTRATE ATTACH DIE AND ELEMENT ATTACH BONDING, INTERNAL StAiNT,GE“G I I I A(1.37), V, 80, 92, 104 D, L (2,00), 202, 210, 220 A, J(l), 160, 170, A(200), P, Q, 110, 120, 140
47、, 152 181, 200, 230 140, 153 A, J(l), 161, 170, E(3001, Q, 110, 120, 181, 200, 230 TtS I T J MANUFACTURER AND ASSURANCE REPORT SYMBOL/CAGE ADDRESS SUBSTRATE FABRICATION LEVEL NUMBER CODE Vi tare1 Microelectronics San Diego, CA 92121 6828 Nancy Ridge Drive A, G, 11(1I, 30, 43, 62, 71 B 1772-1 38-88 C
48、EXE/66632 1“ I I I SUBSTRATE. ATTACH BONDING, INTERNAL “older 6r olymerz :onductive olymer- ionconductive EATTACH IUALIFIED es lo “ BACKING MATERIAL -. - . 90 Gold 91 Copper 92 Alumina 93 Beryl 1 i a 94 Au/NiCr 95 Pt Au 96 Pd Ag ATTACH SURFACE 100 Type A /Nickel 101 Copper 102 Ceramic Package 103 Alumina ubstrate 104 Type A :?/Nickel /Gold 105 Gol d Maximum number of levels successfully tested indicated in parenthesis next to number on QML. Largest perimeter successfully tested in inches indicated in parenthesis next to letter on ML. All adhesive and polmeric material sh
