1、MIL-T-55659 bb 777770b 014233b 2 -.- bcL-T-55659 (EL) MILITARY SP LC IF1 CATI o: 2 Septejnber 1971 TEST FACILITIES KIT, X-994 ( )/AR (UNITS OF) 1. SCOPE . . ._ . - 1.1 This specification covers one type of Xaintenance Kit which provides facilities for troubleshooting, bench testing of communications
2、, communication system control, and direction finding equipments and is designated, Test Facilities Kit, lK-994( )/AR. (See 6.1 Nailed and Lock-corner Box, Fiberboard Boxes, Fiberboard, Corrugated, Triplewall Cellulosic Cushioning Elaterial Fiberboard ; Corrugated and Solid, Sheet Stock (Container G
3、rade), and Cut Shapes Strapping; Non-2letallic . Tape, Pressure-Sensitive Ad?iesive Tape; Pressure-Sensitive, Filament Strapping, Flat Steel Paper, (For Carton Sealing) Renin f o r c ed Preservation, Methods of Pallet, Matcrial Maiidling liardwood Pallet, faterial IlandlinF:, Wood, Post Stringer Con
4、struction, 4 way (partial) Construction, 4 way entry - FSC 6625 F“ THIS DOCUMENTCONTAINS PAGES. 7 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-,7 -_ - MIL-T-55657 66 W 9974706
5、0342337 4 I HIL-T-55659 (EL) NIL-31-13231 NIL-F-14072 N IL-S-195OO STANDARDS bf ILITARY MIL-STD-105 MIL-STD-108 MIL-STD-129 MIL-STD-147 MIL- STD-2 52 MIL-STD-454 MIL-STD-810 DRAWINGS ELECTRON IC COX.lAND SC-DL-595579 SC-DL-595580 SC-DL-595581 Marking of Electronic Items Finishes for Ground Signal Eq
6、uipmen t Semiconductor Device, (General Specification for) Sampling Procedures and Tables for Definitions of and Basic Requirement Inspection by. Attribut es for Enclosure for Electric and Electronic Equipment liarking for Shipment and Storage Palletized Unit loads; (40 in x 48 in 4 ways partial and
7、 4 way pallets) Wired Equipment, Classification of Visual and Mechanical Defects Standard General Requirements for Electronic Equipment Environmental Test Methods Test Facilities Kit, MK-994( )/AR Panel Assembly, Test Facilities Kit Cover, Test Facilities Kit, S-3202 ( ) /AR CW-986( )/AR (Copies f s
8、pecifications, standards and drawings required by suppliers in connection with specific procurement functions should be obtained from the procuring activity or as directed by the contracting officer.) 3 KEQUIRET*EENTS 3.1 Description. - The Test Facilities Kit, PX-994( )/AR is a light weight test se
9、t contained in a spray-tight combination case and provides the facilities and connections required for operational and maintenance tests for Radio Sets AN/ARC-114( ), AN/ARC-115( ), and AN/AFX-116( ), Control Communication System C-6533( )/ARC and Direction Finder Set AN/ARX- 89( ). cover is in plac
10、e. Communication System C-G533( )/ARC and an Indicator, Heading-Radio Bearing ID-1351( )/A, these units are part of the test sei. The test set operates from 115 VAC, 40G Yz ana +27.S volts dc power sources. Connector and cable assemblies, etc., are not exposed when the The test set contains provisio
11、ns for a Control, 2 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_. MIL-T-55b57 bb m 77777Ob OLI2338 b II ._ 3.2 preproduction samples for approval, if required by the invitati
12、on for bids and contract. Preproduction samples. - The contractor shall furnish three (3) (See 4.3 and 6.2) 3.3 Construction, - The equipment shall be constructed in accordance with the following data lists and drawings thereon: SC-DL-595579 SC-DL-595580 SC-DL-595581 Test Facilities Kit, EIK-994 ( )
13、 /Ali Panel Assembly, Test Facilities Kit Cover, Test Facilities Ut, SB-3202( )/AR CW-986 ( )/AR 3.4 Cleaning. - 3.4.1 Parts, - After fabrication, parts shall be cleaned in accordance with good commercial practice, or as specified in an applicable document. Cleaning processes shall have no deleterio
14、us effect. shall be removed completely before the parts are mounted on chassis, panels, etc. Corrosive material 3.4.2 Units. - After assembly, units shall be cl-eaned thoroughly and shall be free from particles of solder, flux, and other material. tion, when necessary, such cleaning shall also be pe
15、rformed before final assembly of the units. In addi- 3.5 Controls. - All movable controls shall operate properly without Controls shall not be assembled in a binding or other undue restriction. misaligned condition. 3.6 Finish, protective. - The equipment shall be given protective This includes fini
16、sh of hardware, such as handles, hinges, screws, finish in accordance with Specification MIL-F-14072 and the equipment draw- ings. etc., and ne8essary touch-up after mounting. 1 surfaces shall be semi-gloss, light gray (Film E) conforming to Specifica- tion MIL-F-14072, (See 4.4) The final paint fil
17、m on Type 3.7 Securing of parts. - 3.7.1 General. - Brackets, lugs, inserts, bolts, and other mounting arrangements shall retain items securely when subjected to specified service conditions. 3.7.2 Securing of parts by threaded fasteners; - Nylok or other screws with plastic devices and Loctite or s
18、imilar sealants shall not be subjected to temperature in excess of 250F (as during baking of paint). Loctite or similar sealants shall be applied in accordance with the manu- facturers instructions. 3.8 Marking. - 3 Copyright Communications - Electronics Command Provided by IHS under license with CR
19、AINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-T-55b57 66 H 9777906 0342337 B - MIL-T-5 5659 (EL) I I. 3.8.1 General. - Marking shall conform to Specification MIL-M-13231. .Front panel marking shall be Group I as described.in that Specification. (See 4.4) 3.
20、8.2 Visibility. - Wherever practicable, parts shall be so mounted that their identification markings will be readily visible with minimum disassembly of the equipment. 3.8.3 Serial numbers. - The following items shall be serial numbered: Test Facilities Kit Panel Assembly, Test Cover, Test Facilitie
21、s MK-994 ( )/AR Facilities Kit SB-3202( )/AR Kit CW-986 ( ) /AR 3.9 Soldering. - 3.9.1 Solder. - Solder shall conform to the equipment drawings. 3.9.2 Acid or acid salts. - No acid or acid salts shall be used in preparation for or during soldering; however, exception is permitted for preliminary tin
22、ning of electrical connections and for tinning or soldering of mechanical joints not used to complete electrical circuits, but in no case shall acid or acid salts be used where they can come in contact with insulation material. they shall be conpletely neutralized and removed imediately after use. 4
23、nere acid cr acid salts are used, as pernitted above, -3.9.3 Process. - There shall be no sharp points or rough surfaces resulting from insufficient heating. The solder shall feather 0u.t to a thin edge, indicating proper flowing and wetting actions, and shall not be crystalized, overheated, or unde
24、rheated. The minimum necessary amount of flux and solder shall be used for electrical connections, Any means employed to remove an unavoidable excess of flux shall not: incyr the risk of loose particies of flux, brush bristles, or other foreign material remaining in the equipment; flux being spread
25、over a larger area; or damage to the unit. during the soldering operation shall be undamaged and parts fastened thereto shall not have become loosened. Insulation material that has been subjected to heating , 3.10 3.10.1 Cabling. - Insulated wires shall be formed into cables except Wiring and cablin
26、g. - Wiring and cabling shall be neat and sturdy. where operation of the equipment would be adversely affected thereby or where it is physically impracticable as in the case where the resulting cables would be excessively large and would interfere with operation or maintenance. 4 Copyright Communica
27、tions - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_. MIL-T-55657 66 7797706 0342340 4 . MIL-T-55659 (EL) 3.10.2 Slack. - Wires and cables shall be as short as practical except that sufficient slack sh
28、all be provided for the following purposes: a. To prevent undue stress on cable forms, wires,.and connections, To enable parts to be removed and replaced during servicing including connections to resiliently supported parts. b. without disconnecting other .parts. C. To provide for at least two repla
29、cemenfs of the parts to which the wire or cable is connected, except where uninsulated wires are used. 3.10.3 Protection. - Wires and cables shall be so placed and protected as to avoid contact, under specified service conditions, with rough or irregular surfaces or sharp edges. 3.10.4 Support. - Wi
30、re and cable shall be properly supported and secured to prevent undue stress on the conductors and terminals and undue change in position of the wire or cable (i) during and after subjection of the equipment to specified service conditions or (ii) after service or repair of the equipment in a normal
31、 manner. 3.10.5 Clearance. - Clearance between solder connections or bare conduc- tors, on terminal boards, relays, or other parts, shall be such that no accidental contact can occur between adjacent connections when subjected to specified service conditions. . 3.10.6 Splicing. - Wires in a continuo
32、us run between two terminals shall not be spliced during the wiring operation. 3.10.7 Connect ions. - 3.19.7.1 General. - Before being soldered to terminal lugs or fixed terminals, wires shall be mechanically secured so that the connections are not dependent for strength on solder alone. soldered to
33、 fixed terminals shall be looped at least one-half turn but not more than three-quarters turn around the terminal before soldering. Bared ends of wire leads to be terminated in solder-type terminal lugs shall be tinned, silver plated, or lead-alloy coated. No varnish, lacquer, inspection paint, or o
34、ther coating shall be applied to completed electrical connections. Where practicable, wires 3.11 Semiconductors (transistors and diodes). - These electron devices (semiconductors) shall be in accordance with MIL-S-13500 and the equipment drawings. (See 4.4) 3.12 Tropicalization of materials. - Mater
35、ials shall be treated as follorJs : 5 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,- _- MIL-T-55659 66 979770b OLI23Lll b m. -c MIL-T-55659 (EL) 3.12.1 Treating materials. - Tre
36、ating materials containing a mercury- bearing fungicide shall not be used, treated material is compatible with the material or surface to be treated. Selection of treating materials shall be such that any increase in flamma- bility of treated materials will be held to the practical minimum. The cont
37、ractor shail determine that the 3.12.2 Toxicity. - Treating materials shall cause no skin irritarion or other injury to personnel handling the treated material during fabrica- tion, transportation, operation, or maintenance of the equipment, or during use of the finished items when used for the purp
38、ose intended. 3.12.3 Flexibility. - Treatment shall not affect the flexibility of treated materials, to the extent that the equipment may fail to meet specified requirements when subjected to specified service conditions. 3.12.4 Statement of treatment, - The contractor shall submit for approval, to
39、the contracting officer, a statement describing in detail the materials to be treated and the treating materials and processes that he proposes to use. (See 6.2) 3.13 Service conditions (See 4.8). - The NK-994 ( )/AR shall meet the following service conditions - where a test is referenced, meeting t
40、he test - shall be considered as compliance with the requirement: 3.13.1 Temperature (See 4.8.1). - 3.13.1.1 Operating. - Ambient temperature in the range of +lOOF to OF. the.10 temperature extreme not to exceed 72 hours, at any one time. Exposure at the high temperature extreme not to exceed 4 hour
41、s, and. at 3.13.1.2 Non-operating. - Exposure in the range of +160F to -65F; exposure at th-e high temperature extreme is not to exceed 4 hours, and at the low temperature extreme not to exceed 24 hours, at any one time. 3.13.2 Humidity (See 4.8.2). - The equipment shall meet the requirements of Pro
42、cedure 1, Method 507, of MIL-STD-810. 3.13.3 Altitude (See 4.8.3). - 3.13.3.1 Operating. - Up to 10,000 feet above sea level. .- 3.13.3.2 Non-operating. Up to 50,000 feet above sea level. 3.13.4 Spray-tight protection (See 48.4). - The equipment shall meet the Table I conditions of PIIL-STD-108 for
43、“spray-tight“ enclosure. .There shall be no evidence of moisture inside the equipment, 6 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_ MIL-T-55659 bb 7777706 OLLi23Li2 B MIL-T
44、-55659 (EL) 3.13.5 Fungus (See 4.8.5). - The unit(s) shall show no evidence of viable fungus or corrosion after being subjected to 28 days of fungus test. 3.13.6 Vibration (See 4.8.6). - The equipment shall meet the require- ments of Test Method 514-1 and Figure 514-6 (Curve AB) in MIL-STD-810. 3.13
45、,7 Shock (See.4.8.7). - The equipment shall not suffer damage or fail to operate after subjection to the requirements of Table I, as follows: TABLE I Paragraph Heading Paragraph No. Perf ormance Aft er- Test Shock; bench-handling 4.8.7.1 Shock; drop 4.8.7,2 Specified perf ormance (Note A) No physica
46、l damage. Operable (Note A). Any physi- cal damage shall be minor only. NOTE A: The equipment shall meet the requirements listed in 4.8. 3.14 Electrical requirements (See 4.9) - 3.14.1 Continuity, relay (See 4.9.1). - The resistance between the indi- cated points shall be not more than two (2) ohms
47、when dc circuit breaker CB2 is on and the switches are in position shown: CONTINUITY SWITCH and POSITION . TO - FROM - Radio Antenna Function (Si) XCVR Radio Test (S2) OFF J1-2 *Jl-E Headsets (56) TRANSMIT J1-Z .Jl-E Radio Antenna Function (Sl) XCVR Radio Test (S2) 4 J1-f Ji-j Radio Test (S2) J2-f 5
48、2- j 5 3.14.2 Continuity, connectors (See 4.9.2). - The resistance between the indicated points shall be as shown when the switches arc set to the position indicated : 7 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking
49、permitted without license from IHS-,-,- -,.- MIL-T-55657 66 W 7777706 OL423V3 T = MIL-T-55659 (EL) CONNECTORS RES I STANCE SWITCH and POSITION From To Min Max J3-C J3-d J3-e P1-EE P1-w 53-1 J3-g J3-h P1-ww J3-r J3-a J3-f J16-C J16-B J9-CT J27-A J21-A J1-M J1-W J18-A J18-A J19-A 33-2 53-2 33-2 53-2 33-2 * 53-2 53-2 53-2 53-2 33-2 33-2 J3-C 516-0 J27-B J21-B J1-P J1-P J1-M J1-W Chassis 4545 135 .O 135 .O 135.0 58
