1、Designation: B813 10B813 16Standard Specification forLiquid and Paste Fluxes for Soldering of Copper andCopper Alloy Tube 1This standard is issued under the fixed designation B813; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, th
2、e year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the U.S. Department of Defense.INTRODUCTIONThis specification cov
3、ers a series of specific requirements for liquid and paste fluxes. It alsoincorporates a series of test methods that establish the procedures on how to measure these properties.The format of this specification initially defines the specification requirements followed by the specifictest methods in t
4、he order in which they are to be performed.1. Scope Scope*1.1 This specification establishes the requirements and test methods for liquid and paste fluxes for joining by soldering of copperand copper alloy tube and fittings in plumbing, heating, air conditioning, mechanical, fire sprinkler, and othe
5、r similar systems.NOTE 1This specification does not apply to fluxes intended for electronic applications.1.2 Solder fluxes are to be tested in accordance with the requirements of this specification by an independent testing laboratory.Testing, measuring equipment, and inspection facilities shall be
6、of sufficient accuracy and quality to comply with the requirementsof this specification.1.3 UnitsThe values stated in SI units are to be regarded as standard. No other units of measurement are included in thisstandard.1.4 The following hazard caveat pertains to Sections 11 19.This standard does not
7、purport to address the safety problems, ifany, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practicesand determine the applicability of regulatory limitations prior to use.2. Referenced Documents2.1 The following documents
8、of the issue in effect on the date of materials purchase form a part of this specification to the extentreferenced herein:2.2 ASTM Standards:2B32 Specification for Solder MetalB88 Specification for Seamless Copper Water TubeB88M Specification for Seamless Copper Water Tube (Metric)B152/B152M Specifi
9、cation for Copper Sheet, Strip, Plate, and Rolled BarB280 Specification for Seamless Copper Tube for Air Conditioning and Refrigeration Field ServiceB846 Terminology for Copper and Copper AlloysD130 Test Method for Corrosiveness to Copper from Petroleum Products by Copper Strip TestD1200 Test Method
10、 for Viscosity by Ford Viscosity Cup1 This specification is under the jurisdiction of Committee B05 on Copper and Copper Alloys and is the direct responsibility of Subcommittee B05.04 on Pipe and Tube.Current edition approved April 1, 2010May 1, 2016. Published April 2010May 2016. Originally approve
11、d in 1991. Last previous edition approved in 20092010 asB813 00B813 10. (2009). DOI: 10.1520/B0813-10.10.1520/B0813-16.2 For referencedASTM standards, visit theASTM website, www.astm.org, or contactASTM Customer Service at serviceastm.org. For Annual Book of ASTM Standardsvolume information, refer t
12、o the standards Document Summary page on the ASTM website.This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Becauseit may not be technically possible to adequately depict all change
13、s accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current versionof the standard as published by ASTM is to be considered the official document.*A Summary of Changes section appears at the end of this standardCopyright ASTM International, 100 Barr
14、Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States12.3 Other:1986 Amendments to the Safe Drinking Water Act33. General Requirements3.1 The flux shall be suitable for joining copper tube and fittings by soldering in the size ranges shown in Table 1 ofSpecifications B88 and B88
15、M and Tables 4 and 5 of Specification B280.3.2 The flux shall remain active over the temperature range of the soldering operation, removing and excluding oxides from themetal surfaces in the joint.3.3 The flux shall be suitable for use with all solders listed in Table 5 of Specification B32 as well
16、as the more recentlydeveloped solder alloys suitable for the applications in the scope of this specification.3.4 The flux shall allow the solder to adequately wet and spread on the surfaces being soldered.3.5 The flux residue shall be water flushable after soldering as specified in accordance with S
17、ections 7 and 9.3.6 The flux residue shall not be corrosive or toxic after soldering potable water systems.3.7 The flux shall not release toxic fumes during the soldering operation or corrosive or toxic substances into the water insideor outside the completed system.3.8 The flux shall adhere to the
18、copper and copper alloys under anticipated temperature, joint geometry, joint position, job site,and weather conditions.3.9 The flux shall not contain more than 0.2 % lead in accordance with the 1986 Amendments to the Safe Drinking Water Act.3.10 In the case of Tinning flux, if the unalloyed flux me
19、ets the requirements of this specification, then the Tinning flux shallbe deemed to meet the requirements of this specification.4. Terminology4.1 For terms related to copper and copper alloys, refer to Terminology B846 for terms specific to this standard.4.2 Definitions:4.2.1 flux, na chemically act
20、ive substance that is used to remove and exclude oxides from the joint area during heating andthat ensures that the melted solder will wet the surfaces to be joined.4.2.2 tinning flux, na flux as described in 4.2.1, containing tin alloy powder at a maximum level of 10 % by weight of flux.5. Spreadin
21、g Factor5.1 Spreading of the solder is determined by measuring the height (h) of a solder bead on a standard test sheet following thespecified heating cycle. Spread factor (SF) is calculated as follows:SF5100 1.02h! (1)where:h = the maximum height of the solder bead, mm.5.2 Aflux is considered to ha
22、ve acceptably influenced the spreading of solder on the copper surfaces when the average spreadingfactor is at least 50 (see Section 13).5.3 The spreading test shall show a balanced action by forming a regular and even solder layer.6. Aggressiveness Requirements6.1 From a standard test sheet on whic
23、h a specimen has been prepared with solder (see Section 15), the resistivity of the aqueoussolution shall be more than 100 000 cm.6.2 From a standard test sheet on which a specimen has been prepared without solder (see Section 16), the resistivity of theaqueous solution shall be more than 85 000 cm.
24、7. Corrosiveness Requirements7.1 There shall be a clear indication that in the areas of flux reaction, the sheets shall show a corrosion and residue-free surfacecomparable with the unwetted areas as determined by visual inspection in accordance with Section 17.7.2 Corrosiveness shall be reported in
25、accordance with one of the classifications listed as follows (see Test Method D130):3 Available from U.S. Government Printing Office Superintendent of Documents, 732 N. Capitol St., NW, Mail Stop: SDE, Washington, DC 20401, http:/www.access.gpo.gov. Publishing Office, 732 North Capitol Street, NW, W
26、ashington, DC 20401-0001, www.gpo.gov.B813 162Classification Description1 Slight tarnish1 Slight tarnish2 Moderate tarnish2 Moderate tarnish3 Dark tarnish3 Dark tarnish8. Viscosity Requirements8.1 The viscosity of liquid fluxes shall be less than 180 s as determined using a No. 2 Ford flow cup in ac
27、cordance with Section18.9. Residue Flushing Requirements9.1 Flushing of the residue shall be determined by weight loss.9.2 The loss of weight of each sheet shall be determined by comparing the average weight before and after the test procedure.The weight loss of the flux residue shall be more than 9
28、9 % in accordance with Section 19.% Weight Loss d!51002c 2a!b2a! 3100 (2)where:a = weight of degreased, flushing-test sheet, g;b = weight of degreased, flushing-test sheet plus the weight of applied flux, g; andc = weight of dried, flushing-test sheet after flushing, g.10. Sampling10.1 Samples of fl
29、ux taken for the purpose of the tests listed in this specification shall be selected from the stock of themanufacturer and shall be representative of the material being evaluated.11. Specimen Preparation11.1 Standard Quantity of Solder MetalA standard quantity of solder metal shall be a sample of 60
30、:40 tin-lead (Alloy GradeSn60), measuring 6.0 mm in diameter by 0.86 mm in thickness, weighing approximately 0.21 g, that has been degreased withtrichloroethylene.11.2 Standard Quantity of FluxA standard quantity of flux shall be 0.003 mL as measured by a precision pipet or othervolumetric measuring
31、 devices with equivalent precision.11.2.1 Standard Quantity of Tinning FluxA standard quantity of Tinning flux shall be the same as described in 11.2, with amaximum of 10 % tinning powder added to it.11.3 Standard Test SheetAstandard test sheet shall be a piece of copper 35 by 35 by 1 mm thick of Co
32、pper UNS No. C12200(deoxidized high residual phosphorus) produced in accordance with SpecificationsSpecification B152/B152M.11.3.1 Preparation:11.3.1.1 The sheet is abraded three times with a waterproof sand or emery paper (Grit No. 360), each time perpendicular to theprevious direction. One corner
33、of each test sheet shall be bent upwards to permit handling. It is degreased with calcium carbonatemixed with water to a paste consistency with which the test sheet is rubbed using a wad of cotton. The residue is flushed off bya strong jet of tap water. The test sheet is considered to be degreased w
34、hen it is completely moistened by water when flushed.11.3.1.2 In any of the following steps in which the test sheets must be handled, use forceps or laboratory tongs. The sheet isthen etched for 15 s in an etching solution formulated as follows:(a)Etching Solution(1-L etching solution contains 200-g
35、 chromic acid anhydride (CrO3) and 125-mL sulfuric acid (specificgravity 1.84) reagent grade, balance distilled water, diluted to 1 L.)(a) Etching Solution(1-L etching solution contains 200-g chromic acid anhydride (CrO3) and 125-mL sulfuric acid (specificgravity 1.84) reagent grade, balance distill
36、ed water, diluted to 1 L.)(b) Finally, the sheet is rinsed thoroughly with distilled water (60 to 70C), immersed in ethanol (ACS Grade), and allowedto dry.(b) Finally, the sheet is rinsed thoroughly with distilled water (60 to 70C), immersed in ethanol (ACS Grade), and allowed todry.11.4 Resistivity
37、 Test SpecimenThe resistivity test specimen is the condition of the standard test sheet on which have beendeposited standard quantities of flux and solder metal before they are placed in the oven. In the case of Tinning flux, specimenshould be prepared without tinning powder added to the base flux.1
38、1.4.1 Preparation:B813 16311.4.1.1 Remove test sheet from the liquid ethanol, allow to dry, and apply a standard quantity of flux. With a standard quantityof solder metal, spread the flux to an area of about 15 mm 15 mm in diameter.11.4.1.2 Place the test sheet with flux and solder metal in the oven
39、 where it remains for 3 min at a temperature of 275C fromthe time the solder melts. Remove the specimen and allow to cool to room temperature.11.5 Flushing-Test SheetThe flushing-test sheet is a piece of copper 100 by 100 by 1.0 mm thick of Copper UNS No. C12200(deoxidized high residual phosphorus)
40、produced in accordance with SpecificationsSpecification B152/B152M.11.5.1 Preparation:11.5.1.1 The copper sheets shall have raised edges of 3 or 4 mm 4 mm to avoid loss of flux. The sheets shall be degreased withtrichloroethylene, flushed with water, and dried at a temperature of 50C. Every sheet sh
41、all be weighed to 10-mg accuracy usinga standard laboratory balance.12. Test Methods12.1 The properties enumerated in this specification shall be determined in accordance with the test methods given in Sections13 19.13. Spreading Test13.1 ScopeThe influence of the flux on the spreading of the fluid
42、solder is indicated by the spreading factor obtained by theconditions detailed in Section 17.13.2 Apparatus:13.2.1 OvenThe performance characteristics of the oven shall be such that the temperature has an accuracy of 62.5C. Theoven shall be equipped with a sight glass for visible control of the melt
43、ing of the solder. It shall be possible to measure the oventemperature in close proximity to the test sheet. The test sheet shall be capable of being placed in the oven and removed from itexactly horizontally. To reduce cooling when the preheated test sheet is removed from the oven, it is placed on
44、a plate in an exacthorizontal position so as to be pushed in and out. The oven must be easy to heat to the preset temperature.13.2.2 Gilson Precision Pipet, 3 to 25 L.13.3 Spreading Factor Procedure:13.3.1 The spreading factor test specimen is the condition of the standard test sheet with a standard
45、 quantity of flux having beenheated to 275C for 30 s in the oven. Immediately afterwards, a standard quantity of solder metal is placed over the liquid fluxand the test specimen is replaced in the oven. In the case of Tinning flux, specimen should be prepared without tinning powderadded to the base
46、flux.13.3.2 The period for which the test sheet shall be outside the oven for application of the solder metal shall not exceed 10 s.10 s.13.3.3 Remove test sheet from the ethanol, allow to dry, and apply a standard quantity of flux. Spread the flux with a standardquantity of solder metal to an area
47、of about 15 mm in diameter and then remove the solder metal.13.3.4 Heat the test sheet with flux for 30 s in an oven at 275C. Afterwards, replace the standard quantity of solder metal thatwas used to spread the flux on the test sheet and heat the assembly for 3 min at a temperature of 275C in the ov
48、en.13.3.5 After the test specimen has cooled to room temperature and been cleaned, measure the solder height by means of a flatmicrometer three times, average the values, and calculate the spreading factor as in 5.1.13.4 CalculationAfter five tests, the highest and lowest figures are excluded. Calcu
49、late the average of the remaining three.14. Aggressiveness Test14.1 ScopeThe aggressiveness of the flux is determined by means of a resistivity test by measuring the resistivity in cm cm of an aqueous solution of the flux residue. In the case of Tinning flux, specimen should be prepared without tinning powderadded to the base flux. The conductivity cell to be used shall be kept immersed in distilled water at ambient temperature for aminimum of 24 h before use.14.2 Apparatus:14.2.1 Ohmmeter (Must Be Suitable for Use with Liquids)Cell co
