1、Designation: E1161 09 (Reapproved 2014)Standard Practice forRadiologic Examination of Semiconductors and ElectronicComponents1This standard is issued under the fixed designation E1161; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision
2、, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the U.S. Department of Defense.1. Scope1.1 This practice prov
3、ides the minimum requirements fornondestructive radiologic examination of semiconductordevices, microelectronic devices, electromagnetic devices,electronic and electrical devices, and the materials used forconstruction of these items.1.2 This practice covers the radiologic examination of theseitems
4、to detect possible defective conditions within the sealedcase, especially those resulting from sealing the lid to the case,and internal defects such as extraneous material (foreignobjects), improper interconnecting wires, voids in the dieattach material or in the glass (when sealing glass is used) o
5、rphysical damage.1.3 The values stated in inch-pound units are to be regardedas standard. No other units of measurement are included in thispractice.1.4 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this s
6、tandard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2E94 Guide for Radiographic ExaminationE431 Guide to Interpretation of Radiographs of Semicon-ductors and Related DevicesE54
7、3 Specification for Agencies Performing NondestructiveTestingE801 Practice for Controlling Quality of Radiological Ex-amination of Electronic DevicesE666 Practice for Calculating Absorbed Dose From Gammaor X RadiationE999 Guide for Controlling the Quality of Industrial Radio-graphic Film ProcessingE
8、1000 Guide for RadioscopyE1079 Practice for Calibration of Transmission Densitom-etersE1254 Guide for Storage of Radiographs and UnexposedIndustrial Radiographic FilmsE1255 Practice for RadioscopyE1316 Terminology for Nondestructive ExaminationsE1390 Specification for Illuminators Used for Viewing I
9、n-dustrial RadiographsE1411 Practice for Qualification of Radioscopic SystemsE1453 Guide for Storage of Magnetic Tape Media thatContains Analog or Digital Radioscopic DataE1475 Guide for Data Fields for Computerized Transfer ofDigital Radiological Examination DataE1742 Practice for Radiographic Exam
10、inationE1815 Test Method for Classification of Film Systems forIndustrial RadiographyE1817 Practice for Controlling Quality of Radiological Ex-amination by Using Representative Quality Indicators(RQIs)E2339 Practice for Digital Imaging and Communication inNondestructive Evaluation (DICONDE)E2597 Pra
11、ctice for Manufacturing Characterization of Digi-tal Detector Arrays2.2 ANSI Standards:3ANSI/ESD S20.20 ESDAssociation Standard for the Devel-opment of an Electrostatic Discharge Control Program forProtection of Electrical and Electronic Parts, Assembliesand Equipment (Excluding Electrically Initiat
12、ed Explo-sive Devices)1This practice is under the jurisdiction of ASTM Committee E07 on Nonde-structive Testing and is the direct responsibility of Subcommittee E07.01 onRadiology (X and Gamma) Method.Current edition approved June 1, 2014. Published July 2014. Originally approvedin 1987. Last previo
13、us edition approved in 2009 as E1161 09. DOI: 10.1520/E1161-09R14.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM web
14、site.3Available from American National Standards Institute (ANSI), 25 W. 43rd St.,4th Floor, New York, NY 10036, http:/www.ansi.org.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States12.3 ASNT Standard:4ANSI/ASNT CP-189 Standard for Quali
15、fication and Certifi-cation of Nondestructive Testing PersonnelSNT-TC-1A Personnel Qualification and Certification2.4 AIA Documents:5NAS-410 Certification and Qualification of NondestructiveTest Personnel2.5 Department of Defense (DOD) Documents:6MIL-PRF-28861 Performance SpecificationGeneralSpecifi
16、cation for Filters, Capacitors, Radio Frequency/Electromagnetic Interference SuppressionMIL-STD-202 Test Method Standard Electronic and Elec-trical Component PartsMIL-STD-202, Method 209 Radiographic InspectionMIL-STD-750 Test Method Standard Test Methods forSemiconductor DevicesMIL-STD-750, Method
17、2076 RadiographyMIL-STD-883 Test Method Standard MicrocircuitsMIL-STD-883, Method 2012 RadiographyMIL-STD-981 Design, Manufacturing and Quality Stan-dards for Custom Electromagnetic Devices for SpaceApplications2.6 Federal Standard:6FED-STD-595 Color (Requirements for Individual ColorChits)2.7 NCRP
18、Documents:NCRP 116 Limitation of Exposure to Ionizing RadiationNCRP 144 Radiation Protection for Particle AcceleratorFacilities3. Terminology3.1 DefinitionsDefinitions relating to radiologicalexamination, which appear in Terminology E1316, shall applyto the terms used in this practice.3.2 Abbreviati
19、ons:3.2.1 controlling documentation The document or stan-dard that is specified by contractual agreement and lists suchitems as the examination requirements, number of views, andacceptance criteria. Controlling documentation may be in theform of a purchase order, engineering drawing, MilitaryStandar
20、d, etc. or a combination thereof.3.2.2 device(s)For the purpose of this practice, the term“device” and “devices” shall be used to describe microcircuits,semiconductors, electromagnetic devices, electronic and elec-trical component parts. Microcircuits include such items as,monolithic, multichip and
21、hybrid microcircuits, microcircuitarrays, and the elements from which these circuits are made.Semiconductors include such items as diodes, transistors,voltage regulators, rectifiers, tunnel diodes and other relatedparts. Electromagnetic devices include such items astransformers, inductors and coils.
22、 Electronic and electricalcomponents include such items as capacitors, resistors,switches and relays. This is not an all inclusive list, therefore,the term “device” or “devices” will be used throughout thispractice to refer to the items which are the subject of theradiological examination process.3.
23、2.3 micro-bubblesA film defect where tiny bubbles inthe films emulsion create white dots on the processed radio-graph. Micro-bubbles are unacceptable when they show up inthe area of interest of a device because they can be interpretedas extraneous matter (foreign material).3.2.4 parallax error effec
24、tFor the purpose of this practice,the term “parallax error effect” will refer to a double image onthe radiograph of the devices internal features such as wires orball bonds. This is caused by the device being too far from thecentral X-ray beam where the angle of the X-rays creates adouble image on d
25、ouble emulsion film.3.2.5 pick-offAn automatic film processing artifact wheretiny spots of emulsion are “picked off” of the radiograph as itis moving through the dryer. Pick-off artifacts are unacceptablewhen they show up in the area of interest of a device becausethey can be interpreted as extraneo
26、us matter (foreign material).3.2.6 pre-capPrior to capping or encapsulation.3.3 Abbreviations:3.3.1 AWGAmerican Wire Gauge3.3.2 CEOCognizant Engineering Organization. Thecompany, government agency, or other authority responsiblefor the design, or end use, of the device(s) for which radio-logical exa
27、mination is required. This, in addition to designpersonnel, may include personnel from electrical engineering,material and process engineering, nondestructive testing (usu-ally the certified Radiographic Level 3), or quality groups, asappropriate.3.3.3 DDADigital Detector Array. DDAs are described i
28、nPractice E2597.3.3.4 DPADestructive Physical Analysis3.3.5 ESDElectrostatic Discharge3.3.6 ESDSElectrostatic Discharge Sensitive3.3.7 FDDFocal spot to Detector Distance3.3.8 FFDFocal spot to Film Distance3.3.9 FODFocal spot to Object Distance (always mea-sured to the “source side” of the object)3.3
29、.10 PINDParticle Impact Noise Detection3.3.11 RADRadiation Absorbed Dose, the dose causing100 ergs of energy to be absorbed by one gram of matter3.3.12 TLDThermoluminescence Dosimetry4. Significance and Use4.1 This practice establishes the basic minimum parametersand controls for the application of
30、radiological examination ofelectronic devices. Factors such as device handling, equipment,ESDS, materials, personnel qualification, procedure and qual-ity requirements, reporting, records and radiation sensitivityare addressed. This practice is written so it can be specified onthe engineering drawin
31、g, specification or contract. It is not a4Available fromAmerican Society for NondestructiveTesting (ASNT), P.O. Box28518, 1711 Arlingate Ln., Columbus, OH 43228-0518, http:/www.asnt.org.5Available from Aerospace Industries Association of America, Inc. (AIA), 1000Wilson Blvd., Suite 1700,Arlington,VA
32、22209-3928, http:/www.aia-aerospace.org.6Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http:/www.dodssp.daps.mil.E1161 09 (2014)2detailed how-to procedure and must be supplemented by adetailed examination technique/proc
33、edure (see 9.1).4.2 This practice does not set limits on radiation dose, butdoes list requirements to limit and document radiation dose todevices. When radiation dose limits are an issue, the requestorof radiological examinations must be cognizant of this issueand state any maximum radiation dose li
34、mitations that arerequired in the contractual agreement between the usingparties.5. Qualification5.1 Personnel QualificationIf specified in the contractualagreement, personnel performing examinations to this practiceshall be qualified in accordance with a nationally or interna-tionally recognized ND
35、T personnel qualification practice orstandard such asANSI/ANST CP-189, SNT-TC-1A, NAS-410,or similar document and certified by the employer or certifyingagency, as applicable. The practice or standard used and itsapplicable revision shall be identified in the contractual agree-ment between the using
36、 parties. When examining devices toDOD requirements (see 2.5), NAS-410 shall be the requiredstandard.5.2 Qualification of Nondestructive Testing (NDT)AgenciesWhen specified in the contractual agreement, Non-destructive Testing agencies shall be qualified and evaluated asdescribed in Practice E543.5.
37、2.1 SafetyThe NDT facility shall present no hazards tothe safety of personnel and property. NCRP 144, NCRP 116may be used as guides to ensure that radiological proceduresare performed so that personnel shall not receive a radiationdose exceeding the maximum safe limits as permitted by city,state, or
38、 national codes.6. Equipment6.1 Radiation SourceOnly X-ray generating equipmentshall be used. Such factors as focal spot size, inherent filtration,accelerating voltage and tube current shall be considered whenchoosing the proper X-ray source. The X-ray source andexposure parameters shall not cause d
39、amage to the device(s)under examination. The suitability of these exposure param-eters shall be demonstrated by attainment of the requiredradiological quality level and compliance with all other re-quirements stipulated in this practice.6.1.1 Focal SpotThe focal spot size shall be such that theradio
40、logical quality level specified in 10.3 can be achieved.6.2 Non-Film SystemsRadioscopy systems designed spe-cifically for the examination of electronic devices are generallythe alternative to film based radiography. However, DDAbasedsystems may also be used.6.2.1 The suitability of any non-film radi
41、ological systemshall be demonstrated by attainment of the required radiologi-cal quality level and compliance with all other applicablerequirements stipulated in this practice.6.2.2 When specified in the controlling documentation,non-film radioscopy systems shall be operated in accordancewith Practi
42、ce E1255 and qualified in accordance with PracticeE1411. Other types of non-film systems operaating proceduresand qualification procedures shall be agreed upon between theusing parties.6.2.3 X-ray systems shall be characterized for their radiationdose rate using a calibrated dosimeter. The dose rate
43、 shall beidentified at distances to be used during examination so safelimits can be established to ensure devices under examinationare not subject to excessive levels of radiation. Dose ratecharacterization shall be performed with and without filters(see 6.13) to establish best practices between rad
44、iologicalquality levels and total dose during examination. All exposureinformation shall be tracked and recorded in the examinationrecord (see 11.1).6.3 Film ViewersViewers used for film interpretationsshall meet the following minimum requirements:6.3.1 The light source shall have sufficient intensi
45、ty toenable viewing of film densities in the area of interest.6.3.2 Film viewers procured to or meeting the requirementsof Guide E1390 are acceptable for use.6.3.3 Low intensity film viewers such as fluorescent 14 by17-in. illuminators, shall be equipped with daylight fluorescentbulbs.6.3.4 All film
46、 viewers shall be tested for and posted with themaximum readable density in accordance with Practice E1742,Figure 2 and subsection 6.27.4.6.3.5 Film viewers shall be kept clean and viewing surfacesshall be free of scratches or other defects that will interferewith proper film interpretation.6.4 Hold
47、ing FixturesHolding fixtures shall be capable ofholding specimens in the required positions without interferingwith the accuracy or ease of image interpretation. Holdingfixtures shall not be made of materials that will createundesirable secondary radiation that will reduce image clarity.Holding fixt
48、ures shall be clean of debris that can interfere withimage interpretation by appearing on the radiograph or radio-logical image and be confused with that of any defect. Holdingfixtures shall not cause damage to the devices under examina-tion and shall be compliant with any special handling require-m
49、ents including ESD precautions.6.5 Lead-Topped TablesWhen performing filmradiography, a lead-topped table with at least 0.062 in. of leadshall be used. The lead shall be smooth, and with out anygouges or scratches that will cause undesirable image artifacts.Lead vinyl or lead rubber may be used in lieu of lead. Tape orother low density materials used to cover the lead topped tableshall not be allowed unless directly related to ESD protection.6.6 Film HoldersFilm holders and cassettes shall be lighttight. They may be flexible vinyl, plastic, or oth
