1、BRITISH STANDARD BS 123200:2001 System of quality assessment Sectional specification Rigid double-sided printed boards with plated-through holes ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123200:2001 This British Standard, having been prepared under the direc
2、tion of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to the work on this British Standard: Committee reference EPL/501 Draft for
3、 comment 01/204154 DC ISBN 0 580 38520 5 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contract Engineers Manufac
4、turers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS 123200:2001 BSI 17 December
5、 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 1 4 General requirements 1 5 Capability approval 1 6 Relevant specification 2 7 Capability test programme 2 8 Quality conformity inspection 2 9 Tes
6、t patterns and test boards 6 Bibliography 11 Figure 1 Composite test pattern (obverse) 7 Figure 2 Composite test pattern (reverse) 8 Figure 3 Examples of multiple arrangements 9 Figure 4 Examples of soldered holes 10 Table 1 Group A quality conformity inspection 3 Table 2 Group B quality conformity
7、inspection 4 Table 3 Group C quality conformity inspection 5 Table 4 Test specimen details 6BS 123200:2001 ii BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based
8、on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board
9、agreed to grant derogation from standstill to the British National Committee to publish national standards on the basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn on
10、ly if they are replaced by revised EN standards. They have been published because they are considered to be an improvement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Referenc
11、e is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electroni
12、cs industry requires standards that are subject to ongoing revision, in order to take account of new European Eco-Directives. This British Standard is a sectional specification. It should be read in conjunction with the generic specification, BS 123000, and any associated capability detail specifica
13、tion. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contrac
14、t. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages 1 to 11 and a back cover. Th
15、e BSI copyright notice displayed in this document indicates when the document was last issued.BS 123200:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspectio
16、n (lot-by-lot and periodic inspection). It is applicable for all rigid double-sided printed boards with plated-through holes, irrespective of their method of manufacture, when they are ready for the mounting of components. This British Standard is a sectional specification intended for use with the
17、IECQ system of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of thes
18、e publications do not apply. For undated references, the latest edition of the publication referred to applies. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electro
19、nics Group 11: Printed circuits. BS 6001-1:1999 (ISO 2859-1:1999), Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 6221-
20、3 (IEC 60326-3), Printed wiring boards Guide for the design and use of printed wiring boards. BS 123000:2001, System of quality assessment Generic specification Printed boards. 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11 and
21、 BS 123000 together with the following apply. 3.1 relevant specification product specification for an actual batch of printed boards, i.e. a customer detail specification as well as a capability detail specification applied to a specific material, surface finish etc., as applicable 4 General require
22、ments The following specifications for rigid double-sided printed boards with plated-through holes shall be prepared, unless a suitable capability detail specification already exists, using this British Standard as a basis: a) capability detail specifications for general use or applying to specific
23、applications; b) customer detail specifications, which shall be prepared in accordance with BS 123000:2001, 7.2. NOTE 1 BS 123200-003 is an example of a capability detail specification for rigid double-sided printed boards with plated-through holes. NOTE 2 A capability detail specification is prepar
24、ed either by an international or national body or by a manufacturer (see also BS CECC 00111-4). A customer detail specification should preferably be written by the customer and allocated a number within the customers own system. Further details are given in BS 123000 and BS CECC 00114-3. 5 Capabilit
25、y approval 5.1 Basic capability Testing shall be carried out on the composite test pattern detailed in clause 9. 5.2 Additional capability BS 123000:2001, 5.3.3 shall apply. NOTE For multiple arrangements see also clause 9. 5.3 Maintenance of capability approval BS 123000:2001, 5.6 shall apply.BS 12
26、3200:2001 2 BSI 17 December 2001 6 Relevant specification The relevant specification shall contain all the information necessary to define the printed board clearly and completely. Care shall be taken to avoid unnecessary proscriptions. Tolerances shall be stated as necessary. Nominal values without
27、 tolerances, or simple maximum or minimum values, shall be given where these are sufficient. Where tolerances are necessary for certain areas or parts of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of toler
28、ance classes etc., the selections given in BS 6221-3 shall be applied as practical. In the case of discrepancy between the customer detail specification and other pertinent specifications (e.g. generic specification, sectional specification or capability detail specification), the customer detail sp
29、ecification shall prevail. 7 Capability test programme For initial demonstration and subsequent re-demonstration, the capability approval test programme shall be in accordance with the relevant capability detail specification. Demonstration of additional capability shall be in accordance with BS 123
30、000:2001, 5.3.3. NOTE For composite test pattern specimens, see clause 9 and Figure 1 and Figure 2. Examples of multiple arrangements of test patterns are shown in Figure 3, and examples of soldered holes are shown in Figure 4. There shall be no failures during any demonstration of capability. 8 Qua
31、lity conformity inspection 8.1 General Quality conformity inspection shall be conducted on samples which are either taken from the production batch, or which are representative of the production batch (i.e. manufactured using the same processes, having the same features, and concurrent with the rele
32、ased batch). 8.2 Sampling plans The sampling plans of BS 6001-1, as referenced in Table 1, Table 2 and Table 3, shall be used. In all cases there shall be no defects. NOTE 1 Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for t
33、he lot-by-lot and periodic inspection. NOTE 2 Where specially designed test patterns are used, they may be included in the panel. They may be based upon the appropriate pattern of the composite test pattern as detailed in clause 9. 8.3 Inspection groups Inspection level C shall be used, unless anoth
34、er inspection level is specified in the customer detail specification. Other inspection levels shall be in accordance with Table 1 and Table 2. Printed boards shall be aggregated into inspection lots in accordance with BS 123000:2001, 6.1. NOTE For definition of the inspection groups, see BS 123000:
35、2001, 6.3. Quality conformity inspection shall be carried out in accordance with Table 1, Table 2 and Table 3.BS 123200:2001 BSI 17 December 2001 3 Table 1 Group A quality conformity inspection Inspection group Characteristics Test no. aAssessment level A Assessment level B Assessment level C Assess
36、ment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group A1 Visual inspection See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Conformity 1 S2 2.5 % 100 % Identification 1 S2 2.5 % 100 % Appearance 1a S2 2.5 % 100 % Workmanship 1a S2 2.5 % 100 % Conductor defects 1a S2 2.5 % 100 % Misalignment of s
37、older resist and land 1a S2 2.5 % 100 % Particles between conductors 1b, 1c S2 2.5 % 100 % Sub-group A2 Dimensional examination Board dimensions 2 S1 4.0 % S4 2.5 % Holes 2 S1 4.0 % S4 2.5 % Slots, notches 2 S1 4.0 % S4 2.5 % Conductor width 2 S1 4.0 % S4 2.5 % Conductor spacing 2 S1 4.0 % S4 2.5 %
38、Misalignment of hole and land 2 S1 4.0 % S4 2.5 % Positional tolerance of hole centres 2 S1 4.0 % S4 2.5 % Misalignment of solder resist and land 2a S1 2.5 % S4 2.5 % Sub-group A3 Spare group for additional group A tests NOTE This listing may be subject to continuing review, as required by the publi
39、cation and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptability quality level.BS 123200:2001 4 BSI 17 December 2001 Table 2 Group B quality conformity inspection Inspection group Characteristics T
40、est no. a Assessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group B1 Dimensional interchangeability See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Board thickness (contact zone) 2 S2 2.5 % Flatness 12a S3 2.5 % Sub-group B2 Solderabi
41、lity As received 14a S2 2.5 % S3 2.5 % After accelerated ageing 20a S2 2.5 % S3 2.5 % Sub-group B3 Thermal shock tests Through-hole platings 19c S1 4.0 % S3 4.0 % Heatsink bond 15a S1 4.0 % S3 4.0 % Sub-group B4 Mechanical tests Peel strength, standard atmospheric conditions 10a S2 2.5 % Pull-out st
42、rength, plated-through holes 11a S2 2.5 % Sub-group B5 Surface finish tests Adhesion of plating 13a S1 2.5 % S2 2.5 % Porosity of edge contact plating 13d #, 13e S1 2.5 % S2 2.5 % Thickness of plating, contact areas 13f S2 2.5 % Sub-group B6 Spare group for additional group B tests Testing details m
43、arked “#” shall be included in the relevant capability detail specification. NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Ta
44、ble 1). c Acceptability quality level.BS 123200:2001 BSI 17 December 2001 5 Table 3 Group C quality conformity inspection Inspection group Characteristics Test no. a Assessment level A Assessment level B Assessment level C Assessment level D No. b Defects c No. Defects No. Defects No. Defects Sub-gr
45、oup C1 Tests in 3-month intervals See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Insulation resistance: as received, and after damp heat 6a 20 1 between heatsink and subjacent circuitry 6c 20 1 between heatsink and adjacent circuitry 6c 20 1 Process contamination # 20 1 Resistance to solder # 6
46、 1 Solvent and flux resistance # 6 1 Change in resistance of plated-through holes 3c 6 1 Sub-group C2 Tests in 12-month intervals Not applicable Sub-group C3 Spare group for additional intervals Testing details marked “#” shall be included in the relevant capability detail specification. NOTE This l
47、isting may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Number of specimens to be tested. c Maximum permissible number of defects.BS 123200:2001 6 BSI 17 December 2001 9 Test patterns and tes
48、t boards 9.1 General A test pattern shall consist of: a) a part of a conductive pattern on a production board (and used in the application of the printed board); or b) a special test pattern particularly designed and prepared for the purpose of testing only. A test pattern shall be located: 1) on a
49、test coupon (a portion of a printed board or a panel detached prior to using the printed board); or 2) on a separate test board. 9.2 Capability approval testing Basic capability shall be assessed using the composite test pattern given in 9.3. Where additional capability claims are for a larger board size (active area) than that of a test board bearing one composite test pattern (160 mm 160 mm), multiple arrangements as given in 9.4 shall be used. NOTE See also BS 123000:2001, 5.3. 9.3 Com
