1、DRAFT FOR DEVELOPMENTDD IEC/TS 62454:2007Mechanical structures for electronic equipment Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 seriesICS 31.240g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37
2、g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58DD IEC/TS 62454:2007This Draft for Development was published under the authority of the Standards Policy and Strategy Committee on 30 November 2007 BSI 2007I
3、SBN 978 0 580 57032 2National forewordThis Draft for Development is the UK implementation of IEC/TS 62454:2007.This publication is not to be regarded as a British Standard.It is being issued in the Draft for Development series of publications and is of a provisional nature. It should be applied on t
4、his provisional basis, so that information and experience of its practical application can be obtained.Comments arising from the use of this Draft for Development are requested so that UK experience can be reported to the international organization responsible for its conversion to an international
5、standard. A review of this publication will be initiated not later than 3 years after its publication by the international organization so that a decision can be taken on its status. Notification of the start of the review period will be made in an announcement in the appropriate issue of Update Sta
6、ndards.According to the replies received by the end of the review period, the responsible BSI Committee will decide whether to support the conversion into an international Standard, to extend the life of the Technical Specification or to withdraw it. Comments should be sent to the Secretary of the r
7、esponsible BSI Technical Committee at British Standards House, 389 Chiswick High Road, London W4 4AL.The UK participation in its preparation was entrusted to Technical Committee EPL/48, Electromechanical components and mechanical structures for electronic equipment.A list of organizations represente
8、d on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Amendments issued since publicationAmd. No. Date CommentsIEC/TS 62454Edition 1.0 2007-10TECHNICAL
9、 SPECIFICATIONMechanical structures for electronic equipment Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series CONTENTS INTRODUCTION.3 1 Scope and object4 2 Normative references .4 3 Arrangement overview4
10、 4 Interface level 1: Cabinet with heat exchanger, bottom or side mounted .5 4.1 General .5 4.2 Cabinet with heat exchanger, bottom mounted 6 4.3 Cabinet cooling with side mounted heat exchanger .9 5 Interface level 2: Cabinet with sectional heat exchanger.13 5.1 Overview .13 5.2 Cooling performance
11、 of a sectional heat exchanger.14 5.3 Cooling performance calculation of a sectional heat exchanger .16 6 Interface level 3: Cabinet mounted subrack, cooling at component level.17 7 Cabinet interface for water supply connection.18 7.1 General .18 7.2 Additional cabinet requirements 19 Figure 1 Arran
12、gement overview: three interface levels for cooling of electronic devices, within a cabinet.5 Figure 2 Cabinet with bottom mounted heat exchanger 6 Figure 3 Diagram for the heat capacity transfer, dependent on air volume at air velocity of 3 m/s7 Figure 4 Diagram for the heat capacity transfer, depe
13、ndent on air volume at airvelocity of 5 m/s.8 Figure 5 Cabinet with side mounted heat exchanger 10 Figure 6 Diagram for the heat capacity transfer, dependent on air volume at air velocity of 3 m/s11 Figure 7 Diagram for the heat capacity transfer, dependent on air volume at air velocity of 5 m/s12 F
14、igure 8 Side mounted sectional heat exchanger, attached to subrack.14 Figure 9 Diagram for the heat capacity transfer, dependent on air volume at air velocity of 3 m/s15 Figure 10 Diagram for the heat capacity transfer, dependent on air volume at air velocity of 5 m/s15 Figure 11 Cooling connection
15、principle at component level 18 Figure 12 Inlet/outlet area for the external water supply.19 DD IEC/TS 62454:2007 2 INTRODUCTION The increasing computing performance of electronic devices with increasing electrical power consumption creates very high heat loads within electronic cabinets. Next gener
16、ations of electronic equipment built into cabinets require new ways of cooling. State of the art in office or data centre environments is the cooling by ambient air, within air conditioned rooms. The dimensioning of the heat loads was typically based on approximately 1 kW per cabinet. Next generatio
17、n equipment cooling solutions, as described in this Technical specification, take heat loads of up to 35 kW per cabinet under consideration. The heat management in such installations becomes difficult if the heat per cabinet reaches such levels or if the distribution across the multiple cabinets bec
18、omes extremely uneven. In order to meet such heat spots or uneven heat concentration, it is necessary to conduct the heat to the outside of the room, instead of loading the room. The proposed solution uses water cooled heat exchangers within the individual cabinet. Assuming that the chilled water su
19、pply is the easiest cooling opportunity within existing infrastructures and new installations, this Technical specification was initiated for the definition of dimensional interfaces and cooling performance guidelines. Three different cooling arrangements for heat exchangers within cabinets have bee
20、n regarded, called “interface levels”, where level 1 and 2 are described in detail in this Technical specification. The third level, which is per definition the component level on a single board is not described in detail due to the fact, that such an interface depends on too complex design details
21、and that a water cooled heat sink is used, principally working by conduction cooling of the component (e.g. processor). Level 3 is described by some basic considerations of the interfaces. For a clear definition of interface dimensions and cooling performance guidelines, only cabinets have been rega
22、rded from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. Interface level 1: Cabinet with heat exchanger bottom or side mounted for the cooling of a whole cabinet. Interface level 2: Cabinet with sectional heat exchanger, dedicated to individual subracks or groups of subracks. Interface level 3:
23、 Cabinet with inbuilt subrack where the water pipe connects to components on individual boards. In this Technical specification, the terms Water and Air require further definition in application specific standards or specifications. DD IEC/TS 62454:2007 3 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPME
24、NT DESIGN GUIDE: INTERFACE DIMENSIONS AND PROVISIONS FOR WATER COOLING OF ELECTRONIC EQUIPMENT WITHIN CABINETS OF THE IEC 60297 AND IEC 60917 SERIES 1 Scope and object This technical specification provides interface dimensions and cooling performance guidelines for cabinets, using water supplied hea
25、t exchangers. For a clear definition of interface dimensions and cooling performance guidelines, only cabinets have been regarded from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. As the cooling performance is in direct relation to volume flows and temperatures of air and water, cooling perfo
26、rmance guidelines are provided for two structural interface levels Interface level 1 and 2 of equipment built into cabinets. The third interface level is only described by main interfaces, but without detailed dimensions and without cooling performance guidelines. This interface needs very complex d
27、etails for the ducting of water supply within the cabinet and down to the component heat sinks on boards within subracks. Therefore, only the principle is shown usable for individual design solutions. 2 Normative references The following referenced documents are indispensable for the application of
28、this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60297-2, Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 2: Cabinets and pitches of rack structur
29、es IEC 60917-2-1, Modular order for the development of mechanical structures for electronic equipment practices Part 2: Sectional specification Interface coordination dimensions for the 25 mm equipment practice Section 1: Detail specification Dimensions for cabinets and racks IEC 60529:1989, Degrees
30、 of protection provided by enclosures (IP Code) Amendment 1 (1999) ISO 228-1:2000, Pipe threads where pressure tight joints are not made on the threads Part 1: Dimensions, tolerances and designation ISO 11690-1, Acoustics Recommended practice for design of low-noise workplaces containing machinery P
31、art 1: Noise control strategies 3 Arrangement overview The arrangement overview shown in Figure 1 illustrates the typical interface levels. DD IEC/TS 62454:2007 4 Interface level 1: cabinet with heat exchanger bottom or side mounted for the cooling of a whole cabinet Interface level 2: cabinet with
32、sectional heat exchanger, dedicated to individual subracks or groups of subracks Subrack with air duct on top and bottom for a sectional heat exchanger Interface level 3: subrack with water pipe connecting to components on individual boards Sectional heat exchanger, attached to the subrack IEC 1995/
33、07 Figure 1 Arrangement overview: three interface levels for cooling of electronic devices, within a cabinet 4 Interface level 1: Cabinet with heat exchanger, bottom or side mounted 4.1 General The following figures illustrate the mounting positions of the heat exchanger and the direction of the air
34、 circulation. For the individual application, the provided cabinet dimensions and dimensions relevant for the air volume shall be used as the reference. DD IEC/TS 62454:2007 5 4.2 Cabinet with heat exchanger, bottom mounted 4.2.1 Overview Figure 2 illustrates the principal application of a bottom mo
35、unted heat exchanger. The air stream is in the vertical direction, on the front side upwards between the front door and the equipment face plate. The principal drawing in the figure shows only one subrack as an example. The whole area above the heat exchanger may be assembled with subracks or electr
36、onic equipment to direct the air upwards along the face plates (or to be closed by filler panels in case of unused mounting sections). In such configurations, the heat exchanger systems most likely will have their own fans for the air circulation. The subracks or electronic equipment usually also ha
37、ve fans for the throughput from the front to the rear. All open sections in the face plate area (also on the side) should be closed to prevent air bypassing. Three dimensional view on a cabinet with bottom mounted heat exchanger Top view, cross section A-B Air downstream in the rear Air downstream i
38、n the rear Heat exchanger, bottom mounted Air upstreamin the front Air upstream in the front Heat exchanger Subrack example D W W H HUA B DEDFDRD IEC 1996/07 Abbreviations: W Width of the cabinet D Depth of the front door and rear door H Height of the cabinet HUUseable height for electronic equipmen
39、t DFDistance between the front of the equipment and the front door DRDistance between the rear door and the rear of the equipment DEDepth of the equipment Figure 2 Cabinet with bottom mounted heat exchanger 4.2.2 Cooling performance in cabinets with bottom mounted heat exchanger Figure 3 illustrates
40、 the cooling performance guidelines of a cabinet with a bottom mounted heat exchanger as direct function of the air throughput defined by the available cross section at the front and rear of the installed equipment. The cross section (W DR) times the air velocity determines the possible air volume,
41、which in turn determines the possible heat transfer to the heat exchanger. The cabinet model to which this diagram belongs is assumed as H = 2 000 mm by W = 600 mm and variable depth from 600 mm to 1 200 mm. DD IEC/TS 62454:2007 6 The assumption is made, that 25 % of the rear area may be blocked by
42、cabling. Therefore, the calculation includes 25 % more space at the rear than at the front. The same effect applies if the cabling restricts the front area or if both areas are blocked by 12,5 %. The air velocity of 3 m/s is taken as one example for the possibility to approach the acoustic noise pre
43、ssure level of 45 dB(A) in accordance with ISO 11690-1. Figure 4 illustrates the cooling performance for the same cabinet dimensions, but at 5 m/s air velocity. The cooling capacity of the suitable heat exchanger may be chosen in accordance with the required total heat load. The air velocity of 5 m/
44、s is taken as one example for the possibility to approach the acoustic noise pressure level of 55 dB(A) in accordance with ISO 11690-1. Depth of cabinet D at a vertical direction of air streamW = 600 mm Depth of the equipment DE= 400 mmVmax= 3 m/s 0 Q (kW)T(K)D= 600 mmD= 700 mmD= 800 mmD= 900 mmD= 1
45、 000mmD= 1 100mmD= 1 200mm25 22,5 20 17,5 15 12,5 10 7,5 5 2 4 6 8 10 12 14 16 18 20 IEC 1997/07 Figure 3 Diagram for the heat capacity transfer, dependent on air volume at air velocity of 3 m/s DD IEC/TS 62454:2007 7 Depth of cabinet D at a vertical direction of air streamW = 600 mm Depth of the eq
46、uipment DE= 400 mmVmax= 5 m/s 0 Q (kW)T(K) D= 600 mmD= 700 mmD= 800 mmD= 900 mmD = 1 200 mm 25 22,5 20 17,5 15 12,5 10 7,5 5 2 4 6 8 10 12 14 16 18 20 D = 1 100 mm D = 1 000 mm IEC 1998/07 Figure 4 Diagram for the heat capacity transfer, dependent on air volume at air velocity of 5 m/s 4.2.3 Cooling
47、 performance calculation for a cabinet with bottom mounted heat exchanger The cooling performance of the above diagrams is calculated with the following formula. The results are not representative for the specific application, but are rather a guideline for the assessment of dimensional requirements
48、 for the air flow volume as an indicator for the possible heat capacity transfer to the heat exchanger. D = DR+ DF+ DEwhere TCpWQD=airairFsimilarly the subracks usually have fans for the throughput from the front to the rear. All open sections in the face plate area (also on side) should be closed t
49、o prevent air bypassing. DD IEC/TS 62454:2007 9 Three dimensional view on a cabinet with side mounted heat exchanger Top view, cross section A-B D W W1DEDFDRD HW1W A B Compartment for heat exchanger IEC 1999/07 Figure 5 Cabinet with side mounted heat exchanger 4.3.2 Cooling performance in cabinets with side mounted heat exchanger Figure 6 illustrates the cooling performance guideline of a cabinet with a side mounted heat exchanger as direct function of the air throughput defined by the available
