1、BRITISH STANDARD BS EN 100012:1996 Harmonized system of quality assessment for electronic components Basic specification: X-ray inspection of electronic components The European Standard EN100012:1995 has the status of a BritishStandardBSEN100012:1996 This BritishStandard, having been prepared under
2、the directionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comesintoeffect on 15April1996 BSI03-2000 The following BSI references relate to the work on this standard: Committee reference L/9 Draft for comment93/205734DC ISBN 0 580 25523 9 Committee
3、s responsible for this BritishStandard The preparation of this BritishStandard was entrusted to Technical Committee L/9, Electronic Components Policy Committee, upon which the following bodies were represented: Association of Franchised Distributors of Electronic Components BritishStandards Society
4、British Telecommunications plc Department of Trade and Industry Federation of the Electronics Industry Ministry of Defence National Supervising Inspectorate (BSI PC) Amendments issued since publication Amd. No. Date CommentsBSEN100012:1996 BSI 03-2000 i Contents Page Committees responsible Inside fr
5、ont cover National foreword ii Foreword 2 Text of EN100012 3BSEN100012:1996 ii BSI 03-2000 National foreword This BritishStandard has been prepared by Policy Committee L/9 and is the English language version of EN100012:1995 Basic specification: X-ray inspectionof electronic components, published by
6、 the Electronic Components Committee(CECC) of the European Committee for Electrotechnical Standardization (CENELEC). BS EN100012:1995 supersedes BS CECC00012:1985 which is withdrawn. Textual errors. When implementing the English language version of EN100012 as the national standard, the textual erro
7、rs listed below were discovered. They have been reported to CENELEC in a proposal to amend the text of the European Standard. In clause3, references to sections5.8,5.3,5.4 and5.2 should be read as references to clauses4.8, 4.3, 4.4 and4.2 respectively. The title to clause4.8, and its corresponding e
8、ntry in the contents list, should read “Information concerning radiography”. WARNING. Attention is drawn to clause4.10 concerning compliance with national X-ray safety regulations. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards a
9、re responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pagesi andii, theEN title page, pages2 to7 and a back cover. This standard has be
10、en updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN100012 May1995 Supersedes CECC00012:1985 Descriptors: Electronic components, X-ray inspection English
11、version Basic Specification: X-ray inspection of electronic components Spcification de base: Contrl aux rayons X des composants lectroniques Grundspezifikation: Rntgenprfung von Bauelementen der Elektronik This European Standard was approved by CENELEC on 1994-06-06. CENELEC members are bound to com
12、ply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Se
13、cretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status a
14、s the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland andUnitedKingdom. CENELEC European Committee for Electr
15、otechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1995 Copyright reserved to CENELEC members Ref.No.EN100012:1995EEN100012:1995 2 BSI 03-2000 Foreword This European Stan
16、dard was prepared byCECCWG-DE. The text of the draft based on document CECC(Secretariat)3346, was submitted to the formal vote; together with the voting report, circulated as document CECC (Secretariat)3554, itwas approved as EN100012 on1994-06-06. This European Standard supersedes CECC00012:1985. T
17、he following dates were fixed: Contents Page Foreword 2 1 Definitions 3 1.1 Radiography 3 1.2 Radioscopy 3 1.3 Searchray Camera 3 2 Scope 3 3 Equipment and materials 3 4 Procedure 3 4.1 General 3 4.2 Mounting of components 3 4.3 Indicators for the spatial resolution 3 4.4 Indicators for the image co
18、ntrast 3 4.5 Positioning of components 4 4.6 Radiation direction 4 4.7 Marking of documents 4 4.8 Information concerning radiographic 4 4.9 Information concerning radioscopy 4 4.10 Operating personnel 4 5 Interpretation of results 4 6 Reports and records 5 6.1 Reports of inspection 5 6.2 Presentatio
19、n of radiographs 5 6.3 Retention of reports and inspection records 5 7 Examination and acceptance criteria 5 Figure 1 Example of a line test array for identifying spatial resolution 6 Figure 2 Contrast sensitivity indicator 7 latest date by which the ENhas to be implemented at national level by publ
20、ication of an identical national standard or by endorsement (dop)1995-07-06 latest date by which national standards conflicting with the EN haveto be withdrawn (dow)1996-03-06EN100012:1995 BSI 03-2000 3 1 Definitions 1.1 radiography radiographic inspection procedure which uses X-ray films for visual
21、 examination 1.2 radioscopy X-ray inspection procedure which uses an X-ray image intensifier, a diode array or an X-ray sensitive TV-camera as the image detector 1.3 searchray camera X-ray sensitive TV-camera 2 Scope This specification describes the equipment and procedures to be used for the inspec
22、tion of electronic components by means of radiography and radioscopy. When the x-ray inspection is prescribed in a detail or component specification, specific accept/reject criteria should be prescribed either directly or by reference to an appropriate higher order specification (e.g.generic or Tech
23、nology Approval Schedule TAS). These types of examination are not intended as analternative to pre- and post assembly visual inspections. For certain component types, the construction materials may effectively restrict X-ray inspection performance. This aspect should be considered during the design
24、of the component, when the application of this test method is specified. 3 Equipment and materials 1) One of the following systems has to be used for theX-ray inspection: 1) X-ray system in conjunction with a film as specified in section5.8. 2) X-ray system in conjunction with a searchray camera (X-
25、ray sensitive TV camera). 3) X-ray system with a focal spot size ofd0,4mm in conjunction with an image intensifier. Radiographic or radioscopic methods with or without magnification have to be used for the X-ray inspection. Unless otherwise prescribed in the component specifications, the resolution
26、shall be254m or better in all angular directions. The spatial resolution shall be verified by means of indicators as specified in section5.3 placed in the position of the component. The contrast shall be verified by means of indicators as specified in section5.4. Where image enhancement techniques a
27、re used the spatial resolution and the contrast shall be verified without image enhancement. The holding fixtures for holding the components shall comply with the specifications in section5.2. 4 Procedure 4.1 General The X-ray inspection shall be performed by the manufacturer inhouse or at an indepe
28、ndent approved X-ray inspection facility in cooperation with the manufacturer. The exposure factors, voltage (U in kV), current(IinmA), exposure time (t in min), focus-object distance (FOD inmm), focus-detector distance (FDD in mm) and the derivative geometric magnification factor M=FDD/FOD shall be
29、 adjusted as necessary to obtain the spatial resolution and contrast sensitivity prescribed for specific applications. 4.2 Mounting of components Components shall be mounted in the holding fixture so that they are not damaged or contaminated. The fixtures shall not compromise of impede the interpret
30、ation of the X-ray inspection results. 4.3 Indicators for the spatial resolution Unless otherwise prescribed in the applicable component specifications, the minimum spatial resolution of all X-ray inspection systems shall be254m. The spatial resolution shall be identified by means of a test array as
31、 presented for example inFigure 1. Equivalent arrays for identifying the resolution may be used. Such verification shall be performed at the beginning of all inspection to ascertain the basic ability of the used radiographic or radioscopic equipment to comply with the specified spatial resolution re
32、quirements. In the case of long-time operation, the spatial resolution shall additionally be tested and identified on a weekly basis to prevent and exclude ageing. 4.4 Indicators for the image contrast Indicators as specified inFigure 2 shall be used for identifying contrast sensitivity. Indicators
33、shall be selected to give a radiographic density within 10% of the density of the area of interest of the component under inspection. The material and the height of the step(s) are prescribed in the object specific rules. 1) Seenational foreword for details of textual errors.EN100012:1995 4 BSI 03-2
34、000 In conjunction with X-ray film techniques, this verification shall be required with each image. When35mm strip is used, the indicator shall be placed in a position normally occupied by a component for every50components or every40cm of film. In conjunction with an image intensifier or a searchray
35、 camera, the performance of the inspection equipment in relation to contrast sensitivity shall be identified at the beginning of all radioscopic testing and shall additionally be verified on a weekly basis in the case of long-time operation. This procedure shall equally be employed in the same manne
36、r for all testings and component examinations when digital image processing equipment is used to improve identification by means of image integration, contrast manipulation or digital filtering. 4.5 Positioning of components Components shall be radiographed in consecutive serial number order, when a
37、pplicable. When a component is missing, the blank space shall contain either the serial number or an X-ray opaque object to assist in the accurate correlation of X-ray data. Components shall be aligned in rows, starting with the lowest serial number in the top left corner, continuing to the right, t
38、hen forming a second row from left to right, and so on. A clearance distance onthe processed film of not less than6mm shall beprovided between the components, between components and indicators and components or indicators and the edge of the film. Such arrangement shall equally be employed when imag
39、e intensifiers are used. When searchray cameras are used, components shall be inspected inconsecutive order. 4.6 Radiation direction The directions of radiation are prescribed in the relevant object specific rules (e.g.Generic, Details or Component Specification or PAS). Dynamic testing procedures s
40、hall preferably be selected for identifying surface defects (cracks). In conjunction with an image intensifier, optimum direction of radioscopic exposure for a specific defect shall be made adjustable by means of an object manipulator. 4.7 Marking of documents Documents are either the radiographic f
41、ilm or, in conjunction with the image intensifier and the searchray camera, a video tape or hardcopies, respectively. The documents shall be identified such that the following information may be referenced to the inspection result: 1) Component manufacturers name or code 2) Component type or part nu
42、mber 3) Production lot number or date code or inspection lot number 4) Number and date of the inspection 5) Component serial numbers or cross reference numbers, when applicable 6) Inspection facilities identification (manufacturer or X-ray laboratory). 4.8 Information concerning radiographic 2) To r
43、educe scatter radiation the back of the film shallbe protected by means of a lead screening notthinner than1.6mm. The X-ray beam shall becollimated by means of a lead diaphragm on theX-ray tube side to the size of the film. The exposure time shall be adjusted so that the density of the film is betwe
44、en1.5 and2. The use of intensifier films shall not be permitted. Films shall be developed in a process recommended by the film manufacturer. Each film shall be treated carefully so as to avoid processing defects such as finger prints, scratches, blurs, chemical residues, physical damages and so on.
45、4.9 Information concerning radioscopy The radioscopic inspection shall be performed by means of a TV monitor in a dark room. Inspection personnel shall be given not less than5minutes to let the eyes adapt. 4.10 Operating personnel Personnel who will perform the X-ray inspection shall be properly tra
46、ined so that defects revealed by this method can be validly interpreted and compared with applicable reference specimens. All applicable national X-ray safety prescriptions shall be complied with. 5 Interpretation of results Utilizing the testing systems specified herein, the radiographic or radiosc
47、opic results shall be inspected by the manufacturer to determine that each component conforms to the applicable reference specimens and the relevant criteria. Defective components shall be rejected. 2) Seenational foreword for details of textual error.EN100012:1995 BSI 03-2000 5 6 Reports and record
48、s 6.1 Reports of inspection When specified in the appropriate CECC Specification the manufacturer shall furnish inspection reports with each component delivery lot. The report shall describe the results of the X-ray inspection and list the 1) Purchase order number, or equivalent identification 2) Co
49、mponent type or part number 3) Date code 4) Quantity inspected, with serial numbers when applicable 5) Quantity rejected, with serial numbers when applicable 6) Date of the inspection 7) Inspecting persons name For each rejected component the cause for rejection shall be listed. 6.2 Presentation of radiographs When specified in the appropriate CECC Specification the manufacturer shall furnish the inspection records (radiographic films or video tape) relevant to a component delivery lot. 6.3 Retention of reports and inspection records The manufacturer shal
