1、BRITISH STANDARD BS EN 123700:1997 Harmonized system of quality assessment for electronic components Sectional specification: Flex-rigid double sided printed boards with through connections The European Standard EN 123700:1996 has the status of a British Standard ICS 31.180BSEN 123700:1997 This Brit
2、ish Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes intoeffect on 15 May 1997 BSI 03-1999 The following BSI references relate to the work on this standard: Committee reference EPL/52 Draft for
3、 comment 91/28660 DC ISBN 0 580 27428 4 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/52, Printed circuits, upon which the following bodies were represented: British Telecommunications plc Federation of the Electron
4、ics Industry GAMBICA (BEAMA Ltd.) National Supervising Inspectorate (BSI-PC) Printed Circuit Interconnection Federation Surface Mount and Related Technologies (SMART Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS EN 123700:1997 BSI 03-1999 i Contents Page Committees respons
5、ible Inside front cover National Foreword ii Foreword 2 Text of EN 123700 3 List of references Inside back coverBSEN 123700:1997 ii BSI 03-1999 National foreword This British Standard has been prepared by Technical Committee EPL/52, and is the English language version of EN123700:1996 Sectional spec
6、ification: Flex-rigid double sided printed boards with through connections, published by the European Committee for Electrotechnical Standardization (CENELEC). A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for th
7、eir correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-references Publication referred to Corresponding British Standard EN 123000:1991 BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic s
8、pecification: Printed boards BS 2011 Environmental testing IEC 68-2-3:1969 Part 2.1Ca:1977 Test Ca. Damp heat, steady state IEC 68-2-20:1979 Part 2.1T:1981 Test T. Soldering IEC 68-2-38:1974 Part 2.1Z/AD:1977 Tests Z/AD. Composite temperature/humidity cyclic test IEC 194:1988 BS 4727 Glossary of ele
9、ctrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1 Terms common to power, telecommunications and electronics Group 11:1991 Printed circuits BS 6221 Printed wiring boards IEC 326-2:1990 Part 2:1991 Methods of test IEC 326-3:1991 Part 3:1991 Guide for the design and
10、 use of printed wiring boards Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages 2 to 32, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will
11、 be indicated in the amendment table on theinside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123700 December 1996 Descriptors: Double sided printed boards, with through connections, capability test, quality conformance inspection, test patterns English version Sectional specifi
12、cation: Flex-rigid double sided printed boards with through connections Spcification intermdiaire: Cartes imprimes double face flexorigides avec connexions transversales Rahmenspezifikation: Biegesteife doppelseitig gedruckte Leiterplatten mit Durchverbindungen This European Standard was approved by
13、 CENELEC on 1992-02-14. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national st
14、andards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and n
15、otified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland
16、 and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1996 Copyright reserved to CENELEC members Ref. No. EN 123700
17、:1996 EEN123700:1996 BSI 03-1999 2 Foreword This European Standard was prepared by CLC/TC CECC/SC 52, Printed boards (former WG 23). It is based, wherever possible, on the Publications of the International Electrotechnical Commission, and in particular on IEC326-10, Printed boards, Part10: Specifica
18、tion for flex-rigid double-sided printed boards with through connections. The text of the draft based on document CECC(Secretariat)2824 was submitted to the formal vote; together with the voting report, circulated as document CECC(Secretariat)3023, it was approved as EN123700 on 1992-02-14. The foll
19、owing dates were fixed: Contents Page Foreword 2 1 Introduction 3 1.1 Scope and object 3 1.2 Related documents 3 2 General 3 3 Test specimen 3 3.1 Capability Approval 3 3.2 Quality conformance inspection 3 4 Relevant specification 4 5 Characteristics of the printed board 4 6 Capability test programm
20、e 13 7 Quality conformance inspection 15 8 Test pattern Test boards 17 8.1 General 17 8.2 Application of test patterns and test boards 17 8.3 Structure of test boards 17 8.4 Multiple arrangements of the composite test pattern 18 8.4.1 Examples of multiple arrangements 19 Figure 1 Length of defect 17
21、 Figure 2 19 Figure 3a Layer 1 21 Figure 3b Layer 2 22 Figure 3c 23 Figure 4 Examples of delamination 29 Figure 5 Methods of reinforcing lands 30 Figure 6 Examples relating to access holes 31 Figure 7 Examples of soldered holes 32 Table I Basic characteristics 4 Table II Additional characteristics 1
22、1 Table III 14 Table IV 15 Table V 17 Table VI 20 latest date by which the ENhas to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1997-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2003
23、-05-01EN123700:1996 BSI 03-1999 3 1 Introduction IEC 326-10 is the IEC Standard for flex-rigid double sided printed boards with through connections. The following document comprises this IEC Standard and in accordance with the Generic Specification EN123000, the information additionally necessary fo
24、r printed boards intended to be handled within the CENELEC system for electronic components of assessed quality. 1.1 Scope and object This document is a Sectional Specification (SS) relating to flex-rigid double sided printed boards with through Connections irrespective of their method of manufactur
25、e, when they are ready for the mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). 1.2 Related documents IEC 68, Basic environmental test
26、ing procedures. IEC 97, Grid system for printed circuits. IEC 194, Terms and definitions for printed circuits. IEC 249, Metal-clad base materials for printed circuits. IEC 326-1, Printed boards, instructions for the specification writer. IEC 326-2, Test methods for printed boards. IEC 326-3, Recomme
27、ndations for the design and the use of printed boards. IEC 326-10, Specification for the design and use of flex-rigid double sided printed boards with through connections. 2 General This Sectional Specification (SS) applies to flex-rigid printed boards with through-connections and is intended as a b
28、asis for the preparation of a Capability Detail Specification (CapDS) applying to specific materialse.g.according to IEC249-2, and to be used for Capability Approval Procedures. It may be necessary to have a CapDS for each type of material. A CapDS may be prepared by an international or national bod
29、y or by a manufacturer (seealsoCECC00111/IV). Customer Detail Specification (CDS) for the custom built printed boards, according to clause 5 of EN123000. The CDS will normally be written by the customer and allocated a number within his own system. Further details are also given in EN123000 and CECC
30、00114/III. Table I contains the basic characteristics that will normally be important for flex-rigid double sided printed boards with through connections and makes reference to the appropriate tests to verify these characteristics. Table II contains the additional characteristics that may be importa
31、nt for certain flex-rigid double sided printed boards with through connections and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics and tests from this Table II. Where additiona
32、l details for a test have to be specified in the relevant specification, this shall be indicated by “*”in the relevant column. These details shall then be specified in accordance with CECC00010(IEC326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is u
33、sed as a capability qualifying component. Table IV contains the information for the quality conformance inspection. The tables are not intended to prescribe a test sequence. The tests may be carried out in any sequence, unless otherwise specified. 3 Test specimen A test specimen, which may be specif
34、ically designed for this purpose (composite test pattern), or taken from production (production board), which is used for verifying capability in accordance with the relevant Generic Specification. A suitable composite test pattern is shown in Figure 3a, Figure 3b, and Figure 3c,. 3.1 Capability App
35、roval 3.1.1 Basic capability The test shall be carried out on the composite test pattern given in clause 8. 3.1.2 Additional capability Clause 3.5.3 of EN123000 shall apply. For multiple arrangements; see also clause 8. 3.1.3 Maintenance of Capability Approval Clause 3.8 of EN123000 shall apply. 3.2
36、 Quality conformance inspection Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection.EN123700:1996 4 BSI 03-1999 Where specifically designed test patterns shall be used they may be incl
37、uded in the panel. They may be based on the appropriate pattern of the composite test pattern; see clause 8. Consultation between manufacturer and customer will usually be necessary. 4 Relevant specification The term “relevant specification” means a product specification for an actual printed board.
38、,i.e.a CDS as well as a CapDS applied to a specific material and technique, as applicable. The relevant specification shall contain all information necessary to define the printed board clearly and completely. The recommendations given in IEC 326-3 shall preferably be followed. Care should be taken
39、to avoid unnecessary prescription. Permissible deviations should be stated where necessary, nominal values without tolerances or simple maxima or minima shall be given where sufficient. Where tolerances are necessary for certain areas or parts of the printed board only, they shall be applied and res
40、tricted to those areas or parts. If there are several possibilities of presentation of tolerance classes etc., the selections given in IEC326-3 shall preferably be applied. In cases of discrepancy between the CDS and other pertinent specifications (e.g.BS,GS,orSS), the CDS shall prevail. 5 Character
41、istics of the printed board Basic characteristics, seeTable I Additional characteristics, seeTable II Table I Basic characteristics (mandatory assessments) Characteristics Test No. IEC 326-2 Additional Tests Specimen of Composite Test Pattern Requirements Remarks General Examination Visual Examinati
42、on Conformity and Identification 1 a Complete printed board or composite test pattern Pattern, marking, identification, material and finishes shall comply with the relevant specification. There shall be no apparent defects. Appearance and Workmanship 1a Complete printed board or composite test patte
43、rn The boards shall appear to have been processed in a careful and workmanlike manner, in accordance with good current practice. Plated-through holes Complete printed board or composite test pattern Plated-through holes shall be clean and free from inclusions of any sort that could affect component
44、insertion and solderability, Total area of the voids shall not exceed 10% of the total wall area. The largest dimension shall not exceed 25% of the hole circumference and 25% of the thickness of the board in the vertical plane. Plated-through holes shall have no plating voids at the interface of the
45、 hole wall and the conductive pattern. a see clause 2EN123700:1996 BSI 03-1999 5Table I Basic characteristics (mandatory assessments) Characteristics Test No. IEC 326-2 Additional Tests Specimen of Composite Test Pattern Requirements Remarks The interface shall be considered to extend into the hole
46、below the surface of the board a distance of 1,5 times the total copper thickness on the surface. 1a There shall be no circumferential cracks of the copper, or circumferential separation of the copper from the wall of the plated-through hole Holes with plating voids shall not exceed 5% of the total
47、number of plated-through holes Board Edges Complete printed board or composite test pattern The edges of the board and internal cut-outs shall be clean cut without tears and nicks Eyelets Complete printed board or composite test pattern Eyelets shall be firmly secured. Plated eyelets shall not have
48、exposed bare metal. Eyelets shall not have cracked flanges. There shall be no damage to conductors or substrate around the eyelet. Bonding Conductor to Substrate 1a Complete printed board or composite test pattern There shall be no separation of the conductors from the substrate by apparent blisters
49、 or wrinkles other than those permitted in the material specification. Bonding Coverlayer to substrate and pattern 1 Complete printed board The bonding shall appear to be complete and uniform, Minor delaminations are permitted in the following positions: a) At random locations away from the conductors. Such delaminations shall have an area not exceeding5mm 2each and shall be more than0,5 mm from the edges. b) Along conductor edges. Such delaminations shall not infringe upon the design spacing between the conductors by more than 20% of th
