1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSolderless connectionsPart 8: Compression mount connections General requirements, test methods and practical guidanceBS EN 60352-8:2011National forewordThis British Standard is t
2、he UK implementation of EN 60352-8:2011. It isidentical to IEC 60352-8:2011.The UK participation in its preparation was entrusted to Technical CommitteeEPL/48, Electromechanical components and mechanical structures for electronic equipment.A list of organizations represented on this committee can be
3、 obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2011ISBN 978 0 580 58214 1ICS 31.220.10Compliance with a British Standard cannot confer immunity fromlegal obligations.T
4、his British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 May 2011.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 60352-8:2011EUROPEAN STANDARD EN 60352-8 NORME EUROPENNE EUROPISCHE NORM March 2011 CENELEC European
5、 Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELE
6、C members. Ref. No. EN 60352-8:2011 E ICS 13.220.10 English version Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011) Connexions sans soudure - Partie 8: Connexions par compression - Exigences gnrales, mthode
7、s dessai et guide pratique (CEI 60352-8:2011) Ltfreie Verbindungen - Teil 8: Druckmontage-Verbindungen - Allgemeine Anforderungen, Prfverfahren und Anwendungshinweise (IEC 60352-8:2011) This European Standard was approved by CENELEC on 2011-03-17. CENELEC members are bound to comply with the CEN/CEN
8、ELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any
9、CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versi
10、ons. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal,
11、 Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 60352-8:2011EN 60352-8:2011 - 2 - Foreword The text of document 48B/2223/FDIS, future edition 1 of IEC 60352-8, prepared by SC 48B, Connectors, of IEC TC 48, Electromechanical components and mechanical structures
12、for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60352-8 on 2011-03-17. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for id
13、entifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2011-12-17 latest date by which the national standards conflicting with the EN have to
14、 be withdrawn (dow) 2014-03-17 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60352-8:2011 was approved by CENELEC as a European Standard without any modification. _ BS EN 60352-8:2011- 3 - EN 60352-8:2011 Annex ZA (normative) Normative references
15、 to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (includ
16、ing any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60050-581 2008 International Electrotechnical Vocabulary - Part 581: Electromechanical components for e
17、lectronic equipment - - IEC 60068-1 + A1 1988 1992 Environmental testing - Part 1: General and guidance EN 60068-11994 IEC 60512 Series Connectors for electronic equipment - Tests and measurements EN 60512 Series IEC 60512-1 - Connectors for electronic equipment - Tests and measurements - Part 1: Ge
18、neral EN 60512-1 - IEC 60512-1-100 - Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications EN 60512-1-100 - IEC 61249-2-7 2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and uncl
19、ad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad EN 61249-2-7 + corr. September 2002 2005 BS EN 60352-8:2011 2 60352-8 IEC:2011 CONTENTS INTRODUCTION . 6 1 Scope and object 7 2 Normative references . 7 3 Terms and definitions . 7 4 Requirements
20、. 8 4.1 General . 8 4.2 Mounting tools . 8 4.3 Compression mount contact 8 4.3.1 Materials . 8 4.3.2 Design features . 8 4.3.3 Surface finishes . 8 4.4 Connector body . 9 4.4.1 Materials . 9 4.4.2 Design features . 9 4.5 Printed wiring board 9 4.5.1 Materials . 9 4.5.2 Design features . 9 4.5.3 Surf
21、ace finishes . 9 4.6 Stiffener 9 5 Tests 9 5.1 General . 9 5.1.1 Standard conditions for testing 9 5.1.2 Mounting of the specimen 10 5.2 Test and measuring methods 10 5.2.1 General examination 10 5.2.2 Mechanical tests 10 5.2.3 Electrical tests . 11 5.2.4 Climatic tests . 12 5.3 Test schedule 13 5.3
22、.1 General . 13 5.3.2 Basic test schedule . 14 5.3.3 Full test schedule 14 6 Practical guidance 17 6.1 Advantages for compression mount connection . 17 6.2 Current-carrying capacity 18 6.3 Compression mount contact 18 6.4 Connector housing and printed wiring board 18 6.4.1 General . 18 6.4.2 Connect
23、or housing 18 6.4.3 Printed wiring board 18 Bibliography 20 Figure 1 Wiring arrangement for contact resistance test . 12 Figure 2 An example of compression mount connection within a connector 17 BS EN 60352-8:201160352-8 IEC:2011 3 Table 1 Vibration, preferred test severities . 11 Table 2 Group P ba
24、sic test 14 Table 3 Group A corrosion test . 15 Table 4 Group B mechanical test 15 Table 5 Group C climatic test 16 Table 6 Group D current carrying capacity test . 16 BS EN 60352-8:2011 6 60352-8 IEC:2011 INTRODUCTION This part of IEC 60352 includes requirements, tests and practical guidance inform
25、ation. Two test schedules are provided: A basic test schedule applies to compression mount connections which conform to all of the requirements given in Clause 4. A full test schedule applies to compression mount connections which are part of a new component and have already passed the basic test sc
26、hedule or to connections of the same kind which do not fully comply with the requirements of Clause 4. Requirements given in Clause 4 are derived from experience with successful applications of such compression mount connections. IEC Guide 109 advocates the need to minimize the impact of a product o
27、n the natural environment throughout the product life cycle. It is understood that some of the materials permitted in this standard may have a negative environmental impact. As technological advances lead to acceptable alternatives for these materials, they will be eliminated from the standard. BS E
28、N 60352-8:201160352-8 IEC:2011 7 SOLDERLESS CONNECTIONS Part 8: Compression mount connections General requirements, test methods and practical guidance 1 Scope and object This part of IEC 60352 is applicable to compression mount connections with metallic spring contacts for use in telecommunication
29、equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 6
30、0352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture. 2 Normative references The foll
31、owing referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(581):2008, International Electrotechnical Vocab
32、ulary (IEV) Part 581: Electromechanical components for electronic equipment IEC 60068-1:1988, Environmental testing Part 1: General and guidance Amendment 1 (1992) IEC 60512 (all parts), Connectors for electric equipment Tests and measurements IEC 60512-1, Connectors for electronic equipment Tests a
33、nd measurements Part 1: General IEC 60512-1-100, Connectors for electric equipment Tests and measurements Part 1-100: General Applicable publications IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide wove
34、n E-glass laminated sheet of defined flammability (vertical burning test), copper-clad 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60050(581) and IEC 60512-1 as well as the following (additional) terms and definitions apply. 3.1 compression mount
35、 connection solderless connection between a compression mount contact and a contact pad which is established by a continuous compression force BS EN 60352-8:2011 8 60352-8 IEC:2011 3.2 compression mount contact conductive element in a compression mount connector which makes contact with its correspo
36、nding contact pad on a printed wiring board to provide an electrical path 3.3 contact pad (land) conductive element on a printed wiring board which makes contact with its corresponding compression mount contact of a connector to provide an electrical path NOTE Usually the contact area on devices suc
37、h as on semiconductors is called “land”. 3.4 stiffener component used to provide resistance against warpage of a printed wiring board 3.5 locating pin guiding element equipped with a connector body or a printed wiring board for accurate positioning of the connector on the printed wiring board by mat
38、ing with its corresponding locating slot (or hole) 3.6 locating slot (or locating hole) guiding element equipped with a printed wiring board or a connector body to accommodate a locating pin 4 Requirements 4.1 General The connections are made in accordance with the connector manufacturers instructio
39、ns. 4.2 Mounting tools Mounting tools for a compression mount connector on a printed wiring board shall be specified in the detail specification. When a screw driver is used, torque shall be specified in the detail specification. If any special tools are required, tooling instructions shall be provi
40、ded by the manufacturer. 4.3 Compression mount contact 4.3.1 Materials Suitable contact materials satisfying the test and requirements of this standard shall be used. 4.3.2 Design features Contact force of the compression mount connection shall be such that the connector meets all the relevant requi
41、rements of this standard. 4.3.3 Surface finishes Finishes used on metallic elements of the connector shall be such that the connector meets all the relevant requirements of this standard. BS EN 60352-8:201160352-8 IEC:2011 9 4.4 Connector body 4.4.1 Materials Suitable connector body materials satisf
42、ying the test and requirements of this standard shall be used. 4.4.2 Design features A connector body shall be provided with a locating pin(s), slot(s) or hole(s) that allows the connector to be positioned on the printed wiring board accurately. Dimensions and location of pin(s), slot(s) or hole(s)
43、shall be specified in the detail specification. 4.5 Printed wiring board 4.5.1 Materials The materials of a printed wiring board shall be in accordance with IEC 61249-2-7. 4.5.2 Design features The thickness of a printed wiring board shall be specified in the detail specification. The dimensions and
44、 layout of contact pads (lands) shall be specified in the detail specification. A printed wiring board shall be provided with a locating slot(s), hole(s) or pin(s), and the dimensions of those shall be specified in the detail specification. 4.5.3 Surface finishes Contact pads (lands) of a printed wi
45、ring board shall be plated free from contamination and corrosion visible to the unaided eye. 4.6 Stiffener If required, stiffener shall be specified in the detail specification. 5 Tests 5.1 General 5.1.1 Standard conditions for testing Unless otherwise specified, all tests shall be carried out under
46、 standard atmospheric conditions for testing, as specified in IEC 60512-1. The ambient temperature and the relative humidity at which the measurements are made shall be stated in the test report. In case of dispute about test results, the test shall be repeated at one of the referee conditions of IE
47、C 60068-1. 5.1.1.1 Preconditioning Where specified, specimens shall be preconditioned under the standard atmospheric conditions for a period of 24 h, as specified in IEC 60512-1. 5.1.1.2 Recovery Where specified, the specimens shall be allowed to recover under the standard atmospheric conditions for
48、 a period of 1 h to 2 h after conditioning. BS EN 60352-8:2011 10 60352-8 IEC:2011 5.1.2 Mounting of the specimen The specimen shall consist of the connector including compression mount connections and a printed wiring board, unless otherwise specified. When mounting is required in a test, the conne
49、ctor shall be mounted using the normal mounting method. 5.2 Test and measuring methods 5.2.1 General examination 5.2.1.1 Visual examination The test shall be carried out in accordance with test 1a: Visual examination, IEC 60512-1-1. The visual examination test shall be carried out with magnification approximately five times. Specimens shall be examined to ensure that the applicable requirements given in 4.3 to 4.6 have been met. 5.2.1.2 Examinati
