1、BRITISH STANDARD BSEN 60455-1:1998 IEC60455-1: 1998 Resin based reactive compounds used for electrical insulation Part 1: Definitions and general requirements The European Standard EN60455-1:1998 has the status of a British Standard ICS 29.035.20BSEN60455-1:1998 This British Standard, having been pr
2、epared under the directionof the Electrotechnical Sector Committee, was publishedunder the authorityofthe Standards Committee andcomes into effect on 15 December1998 BSI 05-1999 ISBN 0 580 30828 6 National foreword This British Standard is the English language version of EN60455-1:1998. It is identi
3、cal with IEC60455-1:1998. It constitutes a revision of BS5664-1:1978 which is withdrawn. The UK participation in its preparation was entrusted by Technical Committee GEL/15, Insulating materials, to Subcommittee GEL/15/3, Material specifications, which has the responsibility to: aid enquirers to und
4、erstand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented o
5、n this subcommittee can be obtained on request to its secretary. From1 January1997, all IEC publications have the number60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the change over from one numbering system to the other, publicat
6、ions may contain identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications with their correponding European publications. The British Standards which implement
7、 these international or European publications may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the neces
8、sary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theENt
9、itlepage, pages2 to6, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSEN60455-1:19
10、98 BSI 05-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of EN 60455-1 3ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60455-1 October 1998 ICS 29.035.01 Supersedes HD 307.1 S2:1981 Descriptors: Solid electrical insulating materials, resins, composite materia
11、ls, resin hardeners, reaction inhibitors, solvents, designation, definitions, classifications, specifications English version Resin based reactive compounds used for electrical insulation Part1: Definitions and general requirements (IEC60455-1:1998) Composs ractifs base de rsine utiliss comme isolan
12、ts lectriques Partie1: Dfinitions et prescriptions gnrales (CEI60455-1:1998) Reaktionsharzmassen fr die Elektroisolierung Teil1: Begriffe und allgemeine Anforderungen (IEC60455-1:1998) This European Standard was approved by CENELEC on1998-10-01. CENELEC members are bound to comply with the CEN/CENEL
13、EC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CE
14、NELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official version
15、s. CENELEC members are the national electrotechnical committees of Austria, Belgium, CzechRepublic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotech
16、nical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN6045
17、5-1:1998 EEN60455-1:1998 BSI 05-1999 2 Foreword The text of document15C/969/FDIS, future edition2 of IEC60455-1, prepared by SC15C, Specifications, of IEC TC15, Insulating materials, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN60455-1 on1998-10-01. This European S
18、tandard supersedes HD307.1 S2:1981. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. Annexes designated “informative” are given for information only. In this standard,Annex ZA is normative andAnnex A is informative.Annex ZA has been added by CENELE
19、C. Endorsement notice The text of the International Standard IEC60455-1:1998 was approved by CENELEC as a European Standard without any modification. In the official version, forAnnex A, Bibliography, the following note has to be added for the standard indicated: Contents Page Foreword 2 Introductio
20、n 3 1 Scope 3 2 Designation 3 3 Normative references 3 4 Definitions 4 5 Classification 5 6 General requirements 5 Annex A (informative) Bibliography Inside back cover Annex ZA (normative) Normative references to international publications with their corresponding European publications Inside back c
21、over Table 1 Application methods 3 Table 2 Basic resins 3 Table 3 Classification of cured compounds 5 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop)1999-07-01 latest date by which the national standards con
22、flicting with the EN have to be withdrawn (dow)2001-07-01 IEC61006 NOTEHarmonized as EN61006:1993 (not modified).EN60455-1:1998 BSI 05-1999 3 Introduction This International Standard is one of a series which deals with resin based reactive compounds and their components used for electrical insulatio
23、n. The series consists of three parts: Part 1: Definitions and general requirement; (IEC60455-1) Part 2: Methods of test; (IEC60455-2) Part 3: Specifications for individual materials. (IEC60455-3) 1 Scope This part of IEC60455relates to resin based reactive compounds and their components used for el
24、ectrical insulation. All reactive compounds are solvent-free and may contain reactive diluents and fillers. The reactions involved in curing are polymerization and/or crosslinking. This standard does not relate to reactive compounds used as coating powders. NOTEIt is intended to draw up specificatio
25、ns for coating powders as a separate IEC Standard having a different number. These materials may be used for a range of applications, of which common ones are shown in Table 1. Table 1 Application methods The code letters associated with the application may be used as abbreviation of the application
26、 description. Further applications and associated code letters may be added if so required. 2 Designation Depending on their composition and reactivity, these compounds cure at ambient or at elevated temperature. The curing reaction may lead to rigid, flexible or elastomeric materials. The designati
27、on of a particular compound is based on the composition of its resin content or of its major reactive portion. The commonly used resins are as shown in Table 2. For symbols of resins and polymers and their special characteristics see ISO1043-1. Table 2 Basic resins The code letters associated with t
28、he designation may be used as abbreviation of the polymer description. Further designations and associated code letters may be added if so required. NOTEFor symbols of fillers and reinforcing materials see ISO1043-2. For designations of hardeners and accelerators for epoxy resins, see ISO4597-1. 3 N
29、ormative references The following normative documents contain provisions which, through reference in this text, constitutes provisions of this part of IEC60455. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements b
30、ased on this part of IEC60455 are encouraged to investigate the possibility of applying the most recent edition of the normative documents indicated below 1) . Members of IEC and ISO maintain registers of currently valid international standards. IEC 60050(212):1990, International Electrotechnical Vo
31、cabulary (IEV) Chapter212: Insulating solids, liquids and gases. IEC 60445-2:1977, Specification for solventless polymerisable resinous compounds used for electrical insulation Part2: Methods of test. ISO 472:1988, Plastics Vocabulary. ISO 1043-1:1987, Plastics Symbols Part1:Basic polymers and their
32、 special characteristics. ISO 1043-2:1988, Plastics Symbols Part2:Fillers and reinforcing materials. ISO 4597-1:1983, Plastics Hardeners and accelerators for epoxide resins Part1:Designation. Application Code letters Casting compound Embedding compound Potting compound Encapsulating compound Impregn
33、ating compound for dipping procedure for trickling procedure for vacuum-pressure impregnation CC EBC PC ECC IC ICD ICT VPI Resin Code letters Acrylic Epoxy Polyurethane Silicone Unsaturated polyester A EP PUR SI UP 1) In case of dispute, the referenced edition is applicable.EN60455-1:1998 4 BSI 05-1
34、999 4 Definitions NOTEIf available, definitions are taken from IEC60050(212) or ISO472. Where a more specific definition is required, its wording is as close as possible to that given in IEC60050(212) or ISO472. 4.1 reactive compound intimate admixture of a casting resin with other reactive componen
35、ts such as hardener, accelerator, inhibitor or reactive diluent, and with or without filler and certain additives, whereby virtually no volatile matter is released during the subsequent curing reaction. Reactive compounds are solvent-free NOTESmall quantities of by-products may be evolved during cur
36、e of selected resins. In the case where the resinous part of the reactive compound is diluted by means of a reactive diluent, small quantities of monomeric diluent may evaporate during cure mainly due to the application conditions used. 4.2 cured compound the reactive compound after it is cured. The
37、 cured compound is self-supporting 4.3 reactive component any part of the reactive compound, for example resin, initiator, hardener, accelerator, inhibitor and reactive diluent, that reacts with other components or by chain reaction 4.4 resin a solid, semi-solid, or pseudo-solid organic material tha
38、t has an indefinite and often high relative molecular mass, exhibits a tendency to flow when subjected to stress, usually has a softening or melting range, and usually fractures conchoidally. In a broad sense, the term is used to designate any polymer that is a basic material for plastics 4.5 acryli
39、c resin (A) a resin made of acrylic acid or a structural derivative of acrylic acid, or their copolymers with other monomers, the acrylic monomer(s) being in the greatest amount by mass 4.6 epoxy resin (EP) a resin containing epoxy groups capable of crosslinking 4.7 polyurethane resin (PUR) a resin
40、in which, after curing, the repeated structural unit in the chain is of the urethane type 4.8 silicone resin (SI) a resin in which, after curing, the main polymer chain consists of alternating silicon and oxygen atoms 4.9 unsaturated polyester resin (UP) a polyester resin characterized by carbon-car
41、bon unsaturation in the polymer chain, which permits subsequent crosslinking with an unsaturated monomer or prepolymer 4.10 reactive diluent a low-viscosity liquid, which is added to a high-viscosity solvent-free thermosetting resin and which reacts chemically with the resin or the hardener during c
42、uring NOTEReactive diluents allow the decrease of viscosity without significant loss of other properties. 4.11 hardener an agent that promotes or regulates the curing reaction of resins by taking part in the reaction 4.12 accelerator a substance used in a small proportion to increase the reaction ra
43、te of a reactive compound 4.13 inhibitor a substance used in a small proportion to suppress a chemical reaction 4.14 filler a relatively inert solid material added to a reactive compound to modify its working properties or other qualities of the uncured compound, or the physical, electrical, chemica
44、l or thermal properties of the cured compound, or to lower cost 4.15 cure; curing the process of converting the reactive compound into a stable, usable condition by polymerization and/or crosslinking 4.16 polymerization the process of converting a monomer or a mixture of monomers into a polymer 4.17
45、 crosslinking the process of multiple intermolecular covalent or ionic bonding between polymer chainsEN60455-1:1998 BSI 05-1999 5 4.18 pot life the period of time during which a reactive compound, prepared for application, remains in a usable state 4.19 shelf life the storage time under specified co
46、nditions during which a material retains its essential properties 4.20 casting compound (CC) a reactive compound poured or otherwise introduced into a mould and subsequently cured NOTECasting compounds in general and casting compounds to be used for specific application such as embedding and potting
47、 are not defined in IEC60050(212) or the definition is inadequate as in the case of potting compound. IEC60050(212) does not distinguish between resin and compound. 4.20.1 embedding compound (EBC) a casting compound poured into a mould completely encasing an electrical or electronic component. After
48、 subsequent curing, the encased component is removed from the mould NOTEConnecting wires or terminals of the electrical or electronic component may protrude from the embedment. 4.20.2 potting compound (PC) a casting compound poured into a mould completely encasing an electrical or electronic compone
49、nt. After subsequent curing, the mould remains attached to the encased component as a permanent part of the unit 4.21 encapsulating compound (ECC) a reactive compound applied without a mould as a protective or insulating coating to enclose an electrical or electronic component by suitable means such as brushing, dipping, spraying, or spreading 4.22 impregnating compound (IC) a reactive compound which is capable of penetrating or impregnating windings and coils or electrical components with the purpose to fi
