1、BSI Standards PublicationTest methods for electrical materials, printed boards and other interconnection structures and assembliesPart 3-719: Test methods for interconnection structures (printed boards) Monitoring of single plated-through hole (PTH) resistance change during temperature cyclingBS EN
2、61189-3-719:2016National forewordThis British Standard is the UK implementation of EN 61189-3-719:2016.It is identical to IEC 61189-3-719:2016. The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on t
3、his committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 85142 1ICS
4、31.180Compliance with a British Standard cannot confer immunity fromlegal obligations.This Published Document was published under the authority of theStandards Policy and Strategy Committee on 30 April 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 61189-3
5、-719:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61189-3-719 April 2016 ICS 31.180 English Version Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monit
6、oring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles - Partie 3-719: Mthodes dessai pour les structures dinterconnexion (cartes
7、imprimes) - Contrles de la variation de rsistance des trous mtalliss uniques (PTH) au cours des cycles thermiques (IEC 61189-3-719:2016) Prfverfahren fr Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-719: Prfverfahren fr Verbindungsstrukturen (Leiterplatte
8、n) - berwachung des Widerstands von Einzeldurchkontaktierungen (PTH - plated-through hole) bei Temperaturwechselbeanspruchung (IEC 61189-3-719:2016) This European Standard was approved by CENELEC on 2016-02-09. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipu
9、late the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This Europe
10、an Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC memb
11、ers are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Nor
12、way, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenu
13、e Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61189-3-719:2016 E BS EN 61189-3-719:2016EN 61189-3-719:2016 European foreword The text of document 91/1303/FDIS, future edition 1 of IEC 61189-3-719,
14、 prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61189-3-719:2016. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national sta
15、ndard or by endorsement (dop) 2016-11-09 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2019-02-09 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not
16、be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61189-3-719:2016 was approved by CENELEC as a European Standard without any modification. BS EN 61189-3-719:2016EN 61189-3-719:2016 3 Annex ZA (normative) Normative refere
17、nces to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the lat
18、est edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this
19、 annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - Test N: Change of temperature EN 60068-2-14 - IEC 60068-2-58 2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to
20、dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58 2015 IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IPC-2221 - Generic Standard on Printed Board Design - - BS EN 61189-3-719:2016 2 IEC 61189-3-719:2016
21、IEC 2016 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 Test specimens . 5 5 Test apparatus 6 5.1 Reflow equipment . 6 5.2 Temperature cycling chamber . 6 5.3 Electrical resistance recording 6 6 Procedure 7 6.1 Preconditioning . 7 6.2 Temperature cycling test .
22、8 7 Report . 9 8 Additional information 10 Bibliography 11 Figure 1 Example photograph of a section of a test coupon for a six-layer PCB . 6 Figure 2 Principle of online resistance measurement with high currents . 7 Figure 3 Reflow temperature profile for PCB preconditioning . 8 Table 1 Details of t
23、he reflow temperature profile for PCB preconditioning 8 BS EN 61189-3-719:2016IEC 61189-3-719:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3-719: Test methods for interconnec
24、tion structures (printed boards) Monitoring of single plated-through hole (PTH) resistance change during temperature cycling FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC Nation
25、al Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicl
26、y Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmen
27、tal organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on te
28、chnical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by
29、 IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uni
30、formity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5
31、) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ens
32、ure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of
33、any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the re
34、ferenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. Int
35、ernational Standard IEC 61189-3-719 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1303/FDIS 91/1327/RVD Full information on the voting for the approval of this standard can be
36、found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 61189-3-719:2016 4 IEC 61189-3-719:2016 IEC 2016 A list of all parts in the IEC 61189 series, published under the general title Test methods for elec
37、trical materials, printed boards and other interconnection structures and assemblies can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data
38、related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 61189-3-719:2016IEC 61189-3-719:2016 IEC 2016 5 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIE
39、S Part 3-719: Test methods for interconnection structures (printed boards) Monitoring of single plated-through hole (PTH) resistance change during temperature cycling 1 Scope This part of IEC 61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed cir
40、cuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the
41、 edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-14, Environmental testing Part 2-14: Tests Test N: Change of temperature IEC 60068-2-58:2015, Environmental testing Part 2-58: Tests Test Td: Test methods for
42、 solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60194, Printed board design, manufacture and assembly Terms and definitions IPC-2221, Generic Standard on Printed Board Design 3 Terms and definitions For the purposes of this docum
43、ent the terms and definitions given in IEC 60194 apply, unless otherwise specified. 4 Test specimens The test panels are coupons of N layer PCBs (see Figure 1 for an example of a section of a test coupon for a six-layer PCB). If not described in the relevant specification, one test coupon shall have
44、: four single through-holes connecting from the first (top, outer) to the Nth(bottom, outer) layer (via L1 via LN) with the corresponding labelling; four single through-holes connecting from the second to the third layer (via L2 via L3) or the (N2) to the (N1) layers with the corresponding labelling
45、; one reference conductive pattern on an outer layer to compensate for possible temperature fluctuations over different temperature cycles and for resistance changes of the conductors by ageing during the test. The length of the reference structure conductive pattern is not relevant, but it is recom
46、mended to use a length similar to the length of the conductive patterns connecting the vias to the connection points (see Figure 1) and to BS EN 61189-3-719:2016 6 IEC 61189-3-719:2016 IEC 2016 extend the reference structure conductive pattern over the test coupon to ensure that the reference struct
47、ure is representative for the given test coupon (see Figure 1 for an example). All structures shall feature connections to enable four wire resistance measurements. The conductive patterns shall have a cross section that is at least two times larger than the cross section in the PTHs to restrict sel
48、f-heating. Key From left to right: first via (via 1) is connecting from the top to the bottom layer (via L1 via L6); the second via (via 2) is connecting between inner layers (here: via L2 via L3); middle: reference structure; right: connection points for wires connecting the test coupon to the meas
49、urement equipment. Figure 1 Example photograph of a section of a test coupon for a six-layer PCB 5 Test apparatus 5.1 Reflow equipment As long as the test conditions are fulfilled, any reflow equipment may be used. The following two methods are preferred: a) forced gas convection; b) vapour phase. NOTE 1 Forced gas convection is preferred, including infrared assistance. NOTE 2 In case of vapour phase soldering, a specific vapour creating liquid is used
