1、BSI Standards PublicationSurface mounting technologyPart 4: Classification, packaging, labelling and handling of moisture sensitive devicesBS EN 61760-4:2015National forewordThis British Standard is the UK implementation of EN 61760-4:2015. It isidentical to IEC 61760-4:2015.The UK participation in
2、its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible f
3、or its correct application. The British Standards Institution 2015.Published by BSI Standards Limited 2015ISBN 978 0 580 78687 7ICS 31.190Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and
4、 Strategy Committee on 31 July 2015.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 61760-4:2015EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61760-4 July 2015 ICS 31.190 English Version Surface mounting technology - Part 4: Classification, packaging, lab
5、elling and handling of moisture sensitive devices (IEC 61760-4:2015) Technique du montage en surface (SMT) - Partie 4: Classification, emballage, tiquetage et manipulation des dispositifs sensibles lhumidit (IEC 61760-4:2015) Oberflchenmontagetechnik - Teil 4: Klassifikation, Verpackung, Kennzeichnu
6、ng und Handhabung feuchteempfindlicher Bauteile (IEC 61760-4:2015) This European Standard was approved by CENELEC on 2015-06-23. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national sta
7、ndard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version
8、 in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cr
9、oatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Tu
10、rkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CENELEC All rights of exploitation in any form a
11、nd by any means reserved worldwide for CENELEC Members. Ref. No. EN 61760-4:2015 E BS EN 61760-4:2015EN 61760-4:2015 2 Foreword The text of document 91/1244/FDIS, future edition 1 of IEC 61760-4, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote a
12、nd approved by CENELEC as EN 61760-4:2015. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-03-23 latest date by which the national standards conflicting with the doc
13、ument have to be withdrawn (dow) 2018-06-23 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the Interna
14、tional Standard IEC 61760-4:2015 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 1)(not modified). IEC 60068
15、2-78 NOTE Harmonized as EN 60068-2-78. IEC 60749-20-1 NOTE Harmonized as EN 60749-20-1. ISO 62 NOTE Harmonized as EN ISO 62. 1)Superseded by EN 60068-2-58:2015 (IEC 60068-2-58:2015): DOW = 2018-05-01. BS EN 61760-4:2015EN 61760-4:2015 3 Annex ZA (normative) Normative references to international pub
16、lications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the refere
17、nced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
18、 www.cenelec.eu Publication Year Title EN/HD Year IEC 60068-1 - Environmental testing - Part 1: General and guidance EN 60068-1 - IEC 60749-20 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and sold
19、ering heat EN 60749-20 - IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements EN 61340-5-1 - IEC 61760-2 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Applic
20、ation guide EN 61760-2 - IPC/JEDEC J-STD-020D.1, March 2008, Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices BS EN 61760-4:2015 2 IEC 61760-4:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions
21、7 4 General information . 9 4.1 Moisture sensitive devices 9 4.2 Moisture sensitivity level (MSL) . 10 4.3 Relation to other environmental test methods (humidity tests) . 10 5 Assessment of moisture sensitivity 10 5.1 Identification of non moisture sensitive devices . 10 5.2 Classification 10 6 Test
22、 procedure 11 6.1 General . 11 6.1.1 Structurally similar components . 11 6.1.2 Verification and validation tests . 11 6.1.3 Selection of applicable soak conditions and temperature profile 12 6.2 Drying . 12 6.3 Moisture soak . 12 6.4 Temperature load 13 6.4.1 Classification temperature profile . 13
23、 6.4.2 Classification temperature profile for special devices . 14 6.5 Recovery 14 6.6 Final measurements 14 6.6.1 Requirements 14 6.6.2 Visual inspection . 15 6.6.3 Electrical measurements 15 6.6.4 Non-destructive inspection (if required) . 15 6.7 Classification 15 6.8 Information to be given in th
24、e relevant specification 15 7 Requirements to packaging and labelling . 16 7.1 Packaging process 16 7.1.1 Drying of MSDs and carrier materials before being sealed in MBBs . 16 7.1.2 Evacuation and sealing 17 7.2 Packaging material for dry pack 17 7.2.1 Moisture barrier bag (MBB) 17 7.2.2 Desiccant 1
25、7 7.2.3 Humidity indicator 19 7.3 Information to be given on labels 20 8 Handling of moisture sensitive devices 21 8.1 Storage . 21 8.1.1 Recommended storage conditions . 21 8.1.2 Shelf life 21 8.1.3 Floor life 21 8.2 ESD 22 BS EN 61760-4:2015IEC 61760-4:2015 IEC 2015 3 8.3 Humidity indication 22 8.
26、3.1 Humidity indicator card (HIC) . 22 8.3.2 Moisture indicating desiccant . 22 8.4 Unpacking and re-packing . 22 9 Drying 23 9.1 Drying options . 23 9.2 Methods 24 9.2.1 General considerations for baking . 24 9.2.2 Bakeout times 24 9.2.3 ESD protection 25 9.2.4 Reuse of carriers . 25 9.2.5 Solderab
27、ility limitations 25 Annex A (informative) Moisture sensitivity of assemblies . 26 Annex B (informative) Mass/gain loss analysis . 27 Annex C (informative) Baking of devices 28 C.1 Baking time and conditions . 28 C.2 Example of a baking process 28 Annex D (normative) Moisture sensitivity labels . 30
28、 D.1 Object . 30 D.2 Graphical symbols and labels . 30 D.2.1 Graphical symbol for moisture-sensitivity . 30 D.2.2 Moisture-sensitivity identification label (MSID) . 30 D.2.3 Moisture-sensitivity caution label (MSCL) 31 Bibliography 32 Figure 1 Classification temperature profile . 13 Figure 2 Example
29、s of humidity indicator cards . 20 Figure C.1 Baking process . 29 Figure D.1 Standardized graphical symbol for use on equipment . 30 Figure D.2 Alternative moisture sensitivity symbol (also in market use) 30 Figure D.3 MSID labels (examples) 31 Table 1 Moisture sensitivity levels 11 Table 2 Moisture
30、 soak conditions . 12 Table 3 Parameters of the classification temperature profile 14 Table 4 Classification temperatures Tc14 Table 5 MBB material properties 17 Table 6 Conditions for re-bake Example for one type of plastic encapsulated devices . 23 Table 7 Conditions for baking prior to dry pack E
31、xample for one type of plastic encapsulated devices . 24 BS EN 61760-4:2015 4 IEC 61760-4:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY Part 4: Classification, packaging, labelling and handling of moisture sensitive devices FOREWORD 1) The International Electr
32、otechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. T
33、o this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC Nati
34、onal Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (I
35、SO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation
36、from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be
37、 held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. An
38、y divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access t
39、o IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individu
40、al experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, thi
41、s IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of thi
42、s IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61760-4 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the follo
43、wing documents: FDIS Report on voting 91/1244FDIS 91/1259/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts i
44、n the IEC 61760, published under the general title Surface mounting technology, can be found on the IEC website. BS EN 61760-4:2015IEC 61760-4:2015 IEC 2015 5 The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website u
45、nder “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are c
46、onsidered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. BS EN 61760-4:2015 6 IEC 61760-4:2015 IEC 2015 INTRODUCTION Due to the higher temperature profiles of reflow soldering processes using tin-silver-copper alloys or
47、other lead-free solder alloys with higher melting temperatures than Sn-Pb eutectic solder, the sensitivity of components against soldering heat, when being exposed to moisture before soldering, becomes an increasingly important factor. The currently existing standards describing the moisture sensiti
48、vity classification of devices are applicable for plastic encapsulated semiconductors and similar solid state packages (e.g. IEC 60749-20), but not for other types of components. This part of IEC 61760 also extends the classification and packaging methods as described in J-STD-020 and J-STD-033. It
49、is intended to be used for such type of components, where J-STD-020 and J-STD-033 are not required or not appropriate. BS EN 61760-4:2015IEC 61760-4:2015 IEC 2015 7 SURFACE MOUNTING TECHNOLOGY Part 4: Classification, packaging, labelling and handling of moisture sensitive devices 1 Scope This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling
