1、BSI Standards PublicationSemiconductor devices Micro-electromechanical devicesPart 1: Terms and definitionsBS EN 62047-1:2016National forewordThis British Standard is the UK implementation of EN 62047-1:2016. It isidentical to IEC 62047-1:2016. It supersedes BS EN 62047-1:2006 which iswithdrawn.The
2、UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsibl
3、e for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 84971 8ICS 31.080.99Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Poli
4、cy and Strategy Committee on 30 April 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62047-1:2016IEC 62047-1 Edition 2.0 2016-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions
5、 Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 1: Termes et dfinitions INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.080.99 ISBN 978-2-8322-3099-2 Registered trademark of the International Electrotechnical Commission Marque dpose de
6、 la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. BS EN 62047-1:2016 2 IEC 62047-1:2016 IEC 2016 CONTENTS FOREWORD . 3 1
7、 Scope 5 2 Terms and definitions 5 2.1 General terms and definitions . 5 2.2 Terms and definitions relating to science and engineering 6 2.3 Terms and definitions relating to materials science . 7 2.4 Terms and definitions relating to functional element 7 2.5 Terms and definitions relating to machin
8、ing technology 12 2.6 Terms and definitions relating to bonding and assembling technology . 19 2.7 Terms and definitions relating to measurement technology . 21 2.8 Terms and definitions relating to application technology . 23 Annex A (informative) Standpoint and criteria in editing this glossary .
9、27 A.1 Guidelines for selecting terms . 27 A.2 Guidelines for writing the definitions . 27 A.3 Guidelines for writing the notes . 27 Annex B (informative) Clause cross-references of IEC 62047-1:2005 and IEC 62047-1:2015 28 Bibliography 32 Table B.1 Clause cross-reference of IEC 62047-1: 2005 and IEC
10、 62047-1:2015 28 BS EN 62047-1:2016IEC 62047-1:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 1: Terms and definitions FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardizati
11、on comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes Internation
12、al Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in th
13、is preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two
14、 organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the
15、 form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterp
16、retation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national o
17、r regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carrie
18、d out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Commi
19、ttees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to
20、 the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be h
21、eld responsible for identifying any or all such patent rights. International Standard IEC 62047-1 has been prepared by subcommittee 47F: Micro-electromechanical systems, of IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2005
22、. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) removal of ten terms; b) revision of twelve terms; c) addition of sixteen new terms. BS EN 62047-1:2016 4 IEC 62047-1:2016 IEC 2016 The text of
23、this standard is based on the following documents: FDIS Report on voting 47F/232/FDIS 47F/238/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Direc
24、tives, Part 2. A list of all parts in the IEC 62047 series, published under the general title Semiconductor devices Micro-electromechanical devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicat
25、ed on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 62047-1:2016IEC 62047-1:2016 IEC 2016 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL D
26、EVICES Part 1: Terms and definitions 1 Scope This part of IEC 62047 defines terms for micro-electromechanical devices including the process of production of such devices. 2 Terms and definitions For the purposes of this document, the following terms and definitions apply. 2.1 General terms and defin
27、itions 2.1.1 micro-electromechanical device microsized device, in which sensors, actuators, transducers, resonators, oscillators, mechanical components and/or electric circuits are integrated Note 1 to entry: Related technologies are extremely diverse from fundamental technologies such as design, ma
28、terial, processing, functional element, system control, energy supply, bonding and assembly, electric circuit, and evaluation to basic science such as micro-science and engineering as well as thermodynamics and tribology in a micro-scale. If the devices constitute a system, it is sometimes called as
29、 MEMS which is an acronym standing for “micro-electromechanical systems“ 2.1.2 MST microsystem technology technology to realize microelectrical, optical and machinery systems and even their components by using micromachining Note 1 to entry: The term MST is mostly used in Europe. Note 2 to entry: Th
30、is note applies to the French language only. 2.1.3 micromachine 2.1.3.1 micromachine, miniaturized device, the components of which are several millimetres or smaller in size Note 1 to entry: Various functional device (such as a sensor that utilizes the micromachine technology) is included. 2.1.3.2 m
31、icromachine, microsystem that consists of an integration of micromachine devices Note 1 to entry: A molecular machine called a nanomachine is included. BS EN 62047-1:2016 6 IEC 62047-1:2016 IEC 2016 2.2 Terms and definitions relating to science and engineering 2.2.1 micro-science and engineering sci
32、ence and engineering for the microscopic world of MEMS Note 1 to entry: When mechanical systems are miniaturized, various physical parameters change. Two cases prevail: 1) these changes can be predicted by extrapolating the changes of the macro-world, and 2) the peculiarity of the microscopic world
33、becomes apparent and extrapolation is not possible. In the latter case, it is necessary to establish new theoretical and empirical equations for the explanation of phenomena in the microscopic world. Moreover, new methods of analysis and synthesis to deal with engineering problems must be developed.
34、 Materials science, fluid dynamics, thermodynamics, tribology, control engineering, and kinematics can be systematized as micro-sciences and engineering supporting micromechatronics. 2.2.2 scale effect change in effect on the objects behaviour or properties caused by the change in the objects dimens
35、ion Note 1 to entry: The volume of an object is proportional to the third power of its dimension, while the surface area is proportional to the second power. As a result, the effect of surface force becomes larger than that of the body force in the microscopic world. For example, the dominant force
36、in the motion of a microscopic object is not the inertial force but the electrostatic force or viscous force. Material properties of microscopic objects are also affected by the internal material structure and surface, and, as a result, characteristic values are sometimes different from those of bul
37、ks. Frictional properties in the microscopic world also differ from those in the macroscopic world. Therefore, those effects must be considered carefully while designing a micromachine. 2.2.3 microtribology tribology for the microscopic world Note 1 to entry: Tribology deals with friction and wear i
38、n the macroscopic world. On the other hand, when the dimensions of components such as those in micromachines become extremely small, surface force and viscous force become dominant instead of gravity and inertial force. According to Coulombs law of friction, frictional force is proportional to the n
39、ormal load. In the micromachine environment, because of the reaction between surface forces, a large frictional force occurs that would be inconceivable in an ordinary scale environment. Also a very small quantity of abrasion that would not be a problem in an ordinary scale environment can fatally d
40、amage a micromachine. Microtribology research seeks to reduce frictional forces and to discover conditions that are free of friction, even on an atomic level. In this research, observation is made of phenomena that occur with friction surfaces or solid surfaces at from angstrom to nanometer resoluti
41、on, and analysis of interaction on an atomic level is performed. These approaches are expected to be applied in solving problems in tribology for the ordinary scale environment as well as for the micromachine environment. 2.2.4 biomimetics creating functions that imitate the motions or the mechanism
42、s of organisms Note 1 to entry: In devising microscopic mechanisms suitable for micromachines, the mechanisms and structures of organisms that have survived severe natural selection may serve as good examples to imitate. One example is the microscopic three-dimensional structures that were modelled
43、on the exoskeletons and elastic coupling systems of insects. In exoskeletons, a hard epidermis is coupled with an elastic body, and all movable parts use the deformation of the elastic body to move. The use of elastic deformation would be advantageous in the microscopic world to avoid friction. Also
44、, the exoskeleton structure equates to a closed link mechanism in kinematics and has the characteristic that some actuator movement can be transmitted to multiple links. 2.2.5 self-organization organization of a system without any external manipulation or control, where a nonequilibrium structure em
45、erges spontaneously due to the collective interactions among a number of simple microscopic objects or phenomena BS EN 62047-1:2016IEC 62047-1:2016 IEC 2016 7 2.2.6 electro wetting on dielectric EWOD wetting of a substrate controlled by the voltage between a droplet and the substrate covered with a
46、dielectric film Note 1 to entry: The contact angle of a liquid droplet, typically an electrolyte, on a substrate can be electrically controlled because the solid-liquid surface interfacial tension can be controlled with the energy stored in the electric double layer which works as capacitor. Coverin
47、g the electrode with a dielectric material of determined thickness, the capacitance can be determined with ease. Electro wetting on dielectric is used typically in microfluidic devices. Note 2 to entry: This note applies to the French language only. 2.2.7 stiction phenomenon that a moving microstruc
48、ture is stuck to another structure or substrate by adhesion forces Note 1 to entry: When structures become smaller, stiction appears significant due to the scale effect that surface forces predominate over body forces. Stiction frequently occurs in the MEMS fabrication process when small structures
49、are released during wet etching processes due to the surface tension of liquid. Representative adhesion forces to cause stiction are van der Waals force, electrostatic force, and surface tension of liquid between structures. 2.3 Terms and definitions relating to materials science 2.3.1 silicon-on-insulator SOI structure composed of an insulator and a thin layer of silicon on it Note 1 to entry: Sapphire (as in SOS), glass (as in SOG), silicon dioxide, silicon nitride, or even an insulating for
