1、BRITISH STANDARDBS EN 62132-3:2007Integrated circuits Measurement of electromagnetic immunity, 150 kHz to 1 GHz Part 3: Bulk current injection (BCI) methodThe European Standard EN 62132-3:2007 has the status of a British StandardICS 31.200g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g
2、44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 62132-3:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 November 2007 BSI 2007ISBN 978 0 5
3、80 53403 4National forewordThis British Standard is the UK implementation of EN 62132-3:2007. It is identical to IEC 62132-3:2007. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained
4、 on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.Amendments issued since publicationAmd. No. Date Co
5、mmentsEUROPEAN STANDARD EN 62132-3 NORME EUROPENNE EUROPISCHE NORM October 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels
6、2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62132-3:2007 E ICS 31.200 English version Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method (IEC 6213
7、2-3:2007) Circuits intgrs - Mesure de limmunit lectromagntique, 150 kHz 1 GHz - Partie 3: Mthode dinjection de courant (BCI) (CEI 62132-3:2007) Integrierte Schaltungen - Messung der elektromagnetischen Strfestigkeit im Frequenzbereich von 150 kHz bis 1 GHz - Teil 3: Stromeinspeisungs- (BCI-)Verfahre
8、n (IEC 62132-3:2007) This European Standard was approved by CENELEC on 2007-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists
9、 and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the res
10、ponsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germa
11、ny, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. EN 62132-3:2007 2 Foreword The text of document 47A/773/FDIS, future edition 1 of IEC 62132-3
12、, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62132-3 on 2007-10-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication o
13、f an identical national standard or by endorsement (dop) 2008-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-10-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62132-3:2007 was approved
14、by CENELEC as a European Standard without any modification. _ 3 EN 62132-3:2007 CONTENTS 1 Scope and object4 2 Normative references .4 3 Terms and definitions .4 4 General4 5 Test conditions .5 5.1 General .5 5.2 Test equipment6 5.3 Test board.6 6 Test procedure .8 6.1 Hazardous electromagnetic fiel
15、ds.8 6.2 Calibration of forward power limitation8 6.3 BCI test.9 6.4 BCI test set-up characterization procedure.10 7 Test report .11 Annex A (informative) Examples for test levels and frequency step selection.12 Annex B (informative) Example of BCI test board and set-up 14 Annex C (informative) Exam
16、ple of RF test board and set-up .17 Annex ZA (normative) Normative references to international publications with their corresponding European publications19 Bibliography .18 Figure 1 Principal current path when using BCI.5 Figure 2 Schematic diagram of BCI test set-up .6 Figure 3 Example test board,
17、 top view7 Figure 4 Calibration set-up.9 Figure 5 BCI test procedure flowchart for each frequency step10 Figure 6 Impedance validation test set-up 10 Figure B.1 General view.14 Figure B.2 Example of top view of the test board 15 Figure B.3 Test board build-up .15 Figure B.4 Test board and copper fix
18、ture16 Figure B.5 Example of a non-conductive probes support fixture 16 Figure C.1 Compact RF coupling to differential IC ports17 Table A.1 Test severity levels 12 Table A.2 Linear frequency step.13 Table A.3 Logarithmic frequency step.13 EN 62132-3:2007 4 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROM
19、AGNETIC IMMUNITY, 150 kHz TO 1 GHz Part 3: Bulk current injection (BCI) method 1 Scope and object This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated
20、 RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equip
21、ment used in environments that are subject to unwanted radio frequency electromagnetic signals. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest e
22、dition of the referenced document (including any amendments) applies. IEC 62132-1:2006, Integrated circuits Measurement of electromagnetic immunity, 150 kHz to 1 GHz Part 1: General conditions and definitions 3 Terms and definitions For the purposes of this document, the terms and definitions given
23、in IEC 62132-1 apply. 4 General The characterization of RF immunity (or susceptibility) of an integrated circuit (IC) is essential to define the optimum design of a printed circuit board, filter concepts and for further integration into an electronic system. This document defines a method for measur
24、ing the immunity of ICs to RF current induced by electromagnetic disturbance. This method is based on the bulk current injection (BCI) method used for equipment and systems 1, 2, 3. The BCI method simulates the induced current as a result of direct radiated RF signals coupled onto the wires and cabl
25、es of equipment and systems. In general, in electronic systems, off-board wire connections or traces on the printed circuit board act as antennas for electromagnetic fields. Via this coupling path, these electro-magnetic fields will induce voltages and currents at the pins of the IC and may cause in
26、terference. ICs are often used in various configurations dependent on their application. In this case, immunity levels of electronic equipment are closely linked to the ability of an IC to withstand the effects of an electromagnetic field represented. To characterize the RF immunity of an IC, the in
27、duced current level necessary to cause the ICs malfunction is measured. The malfunction may be classified from A to E according to the performance classes defined in IEC 62132-1. 5 EN 62132-3:2007 A principal set-up for the bulk current injection method is presented in Figure 1. Current monitoring P
28、ower injection Supportive circuitry and by-pass capacitor Injection probe Current probeIC under test DUT IdisturbanceIC controlling and monitoring VssGND IEC 1811/07 Figure 1 Principal current path when using BCI Two electrically shielded magnetic probes are clamped on one wires or a combination of
29、wires that is/are connected to the device under test. The first probe is for the injection of RF power that induces Idisturbanceonto the wires. The second probe is used for monitoring the induced current on those wires. The disturbance current flows in a loop comprising: wire(s), the selected ICs pi
30、n(s), Vssterminal, ground path and supportive circuitry. This supportive circuit provides the IC functional elements as source and/or load(s). The supportive circuitry is directly connected to the IC. When the equivalent RF impedance of the supportive circuitry is larger than 50 , then a by-pass cap
31、acitor is recommended. The by-pass capacitor, to be used at the supportive circuitry side, may also be needed to confine the loop area in which the induced current will be flowing. By default, the lumped by-pass capacitor of 1 nF shall be used. It represents the capacitance from the wire onto a cabl
32、e harness or chassis. Deviation from using this bypass capacitor (e.g. as functional performance becomes affected) shall be given in the test report The by-pass capacitor may be supplemented with optional decoupling network, see Figure 3, to achieve the required attenuation towards the supportive ci
33、rcuitry. The decoupling impedance is determined by the RF immunity of the supportive circuitry. It shall not adversely affect the response of the device under test, i.e. the result of the test. The disturbance current Idisturbanceinduced into the wire(s) flows through the IC and may create a failure
34、 in the devices operation. This failure is defined by parameters called the immunity acceptance criteria, which are checked by a controlling and monitoring system. 5 Test conditions 5.1 General The general test conditions are described in the IEC 62132-1. During the immunity tests, either a continuo
35、us wave (CW) or an amplitude modulated (AM) RF signal shall be used as the disturbance signal. The device under test (DUT) shall be exposed at each frequency for sufficient dwell time. By default, an amplitude modulated RF signal using 1 kHz sinusoidal signal with a modulation index of 80 % is recom
36、mended for testing. When an AM signal is used, the peak power shall be the same as for CW, see IEC 62132-1. When other modulation schemes are used, they shall be noted in the EMC IC test report. EN 62132-3:2007 6 The levels of disturbance current required to test the ICs immunity depend on the appli
37、cation environment. Table A.1 in Annex A gives some examples of typical values for disturbance current injection. NOTE Where required by the customer, to satisfy high test levels, additional protection components could be used to permit high current injection. All other pins must be left loaded acco
38、rding to 6.4 of IEC 62132-1. 5.2 Test equipment The test equipment comprises the following equipment and facilities: ground reference plane; current injection probe(s); current measurement probe(s); RF signal generator with AM and CW capability; RF power amplifier(s). A minimum 50 Watt RF power ampl
39、ifier is recommended; RF wattmeter or equivalent instrument, to measure the forward (and reflected) power; RF voltmeter or equivalent instrument which, together with the current measurement probe, measures the disturbance current induced; directional coupler; DUT monitoring equipment (optional: opti
40、cal interface(s). A schematic diagram of the test set-up is shown in Figure 2. Default: by-pass capacitor Ground reference plane RF wattmeter Directional coupler RF voltmeter RF amplifier RF generator Supportive circuitry Injection probe Measurement probe Device under test VssOptional: decoupling ne
41、twork IEC 1812/07Figure 2 Schematic diagram of BCI test set-up An injection probe or set of probes capable of operating over the test frequency range is required to couple the disturbance signal into the connecting lines of the DUT. The injection probe is a transformer. NOTE An optical interface can
42、 be used for monitoring the DUT response against the immunity criteria given. Use of optical interface is not mandatory but recommended. 5.3 Test board An example of a BCI test board is shown in Figure 3. This example of the BCI test board has an opening in the middle to accommodate the two current
43、probes. 7 EN 62132-3:2007 The standard test board as defined in IEC 62132-1 needs to be modified to fulfil the BCI test condition requirements. If the standard test board is used, a low impedance ground connection between standard test board and the BCI test board shall be made. Gasket, contact spri
44、ngs or multiple screws shall be used to contact the BCI test board to the BCI test fixture support at the inner hole when the GRP is not included with the BCI test board layer stack-up. Device under test I/O testedBCI test board Injection probe Measurementprobe Power supplyWireControl Standard test
45、board Supportive circuitry IEC 1813/07 Figure 3 Example test board, top view The wire(s) to which the current is injected to is/are connected at one end to the selected IC pin(s) and on the other end connected to the support circuitry. The support circuitry may comprise a load, a supply or a signal
46、source necessary to operate the device under test as intended. The BCI test board has the advantage of fixing the position of the probes resulting in a more reproducible measurement. The size of the holes and the injection wire length should be at least designed to the size of the probes used. The h
47、ole shall exceed the size of the probes on all sides by at least 10 mm, with a maximum of 30 mm. In general, the wire length shall be limited to a quarter of a wavelength at the maximum frequency used with the BCI test method ( 75 mm in air at 1 GHz). The BCI test board is placed on a copper test fi
48、xture connected to the ground reference plane (GRP), shown in Annex C. Size of GRP is typically table top size extended to a minimum of 0,1 m beyond the footprint of the test fixture. The copper test fixture needs to be high enough to allow the injection probe-carrying fixture. NOTE 1 The GRP may al
49、so be incorporated in one of the BCI test board copper layers. In this case, the copper test fixture support is no longer necessary. The shield of the injection probe and the measurement probe shall be grounded with a short connection underneath the copper test fixture to the GRP. NOTE 2 Coaxial feed-through connectors can be mounted through the GRP (underneath the copper test fixture) to be connected to the current injection and measurement probes dire
