1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor die productsPart 1: Procurement and useBS EN 62258-1:2010National forewordThis British Standard is the UK implementation of EN 62258-1:2010. It isidentical to IEC 6
2、2258-1:2009. It supersedes BS EN 62258-1:2005 which iswithdrawn.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to inc
3、lude all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 59110 5ICS 31.080.99Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy
4、 and Strategy Committee on 30 November 2010.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62258-1:2010EUROPEAN STANDARD EN 62258-1 NORME EUROPENNE EUROPISCHE NORM October 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Norma
5、lisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62258-1:2010 E ICS 31.080.99 Supersedes EN 6225
6、8-1:2005English version Semiconductor die products - Part 1: Procurement and use (IEC 62258-1:2009) Produits de puces de semiconducteurs - Partie 1: Approvisionnement et utilisation (CEI 62258-1:2009) Halbleiter-Chip-Erzeugnisse - Teil 1: Beschaffung und Anwendung (IEC 62258-1:2009) This European St
7、andard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references conce
8、rning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into
9、its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland
10、, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. EN 62258-1:2010 - 2 - Foreword The text of document 47/1974/CDV, future edition 2 of IEC 62258-1, prepared by IEC TC 47,
11、Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62258-1 on 2010-10-01. This European Standard supersedes EN 62258-1:2005. The main changes that have been introduced in this issue have been to ensure consistency across all parts of the standard.
12、 The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by CLC/TR 62258-4, CLC/TR 62258-7 and CLC/TR 62258-8. New requirements include information on
13、 permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8). Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for ident
14、ifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2011-07-01 latest date by which the national standards conflicting with the EN have to be
15、 withdrawn (dow) 2013-10-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62258-1:2009 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for th
16、e standards indicated: IEC 60068 series NOTE Harmonized in EN 60068 series (not modified). IEC 60749-26 NOTE Harmonized as EN 60749-26. IEC 60749-27 NOTE Harmonized as EN 60749-27. IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1. IEC 61340-5-2 NOTE Harmonized as EN 61340-5-2. IEC 61340-5-2 NOTE Harmon
17、ized as EN 61340-5-2. ISO 9000 NOTE Harmonized as EN ISO 9000. _ BS EN 62258-1:2010- 3 - EN 62258-1:2010 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of
18、this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD appl
19、ies. Publication Year Title EN/HD Year IEC 60050 Series International Electrotechnical Vocabulary (IEV) - - IEC 60191 Series Mechanical standardization of semiconductor devices EN 60191 Series IEC 60191-4 + A1 + A2 1999 2001 2002 Mechanical standardization of semiconductor devices - Part 4: Coding s
20、ystem and classification into forms of package outlines for semiconductor device packages EN 60191-4 + A1 + A2 1999 2002 2002 IEC 61360-1 - Standard data elements types with associated classification scheme for electric items - Part 1: Definitions - Principles and methods EN 61360-1 - IEC 62258-2 -
21、Semiconductor die products - Part 2: Exchange data formats EN 62258-2 - IEC/TR 62258-3 - Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage CLC/TR 62258-3 - IEC/TR 62258-4 - Semiconductor die products - Part 4: Questionnaire for die users and supp
22、liers CLC/TR 62258-4 - IEC 62258-5 - Semiconductor die products - Part 5: Requirements for information concerning electrical simulation EN 62258-5 - IEC 62258-6 - Semiconductor die products - Part 6: Requirements for information concerning thermal simulation EN 62258-6 - IEC/TR 62258-7 - Semiconduct
23、or die products - Part 7: XML schema for data exhange CLC/TR 62258-7 - IEC/TR 62258-8 - Semiconductor die products - Part 8: EXPRESS model schema for data exchange CLC/TR 62258-8 - ISO 14644-1 1999 Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness EN ISO 1
24、4644-1 1999 BS EN 62258-1:2010 62258-1 IEC:2009 CONTENTS INTRODUCTION.7 1 Scope.8 2 Normative references8 3 Terms and definitions .9 3.1 Basic definitions 9 3.2 General terminology 10 3.3 Semiconductor manufacturing and interconnection terminology12 4 General requirements .13 5 Data exchange .13 6 R
25、equirements for all devices.14 6.1 Data package 14 6.1.1 General .14 6.1.2 Information source.14 6.1.3 Data version 14 6.1.4 Data exchange formats 14 6.2 Identity and source 14 6.2.1 General .14 6.2.2 Type number .14 6.2.3 Manufacturer .14 6.2.4 Supplier.14 6.2.5 Signature.14 6.3 Function 14 6.4 Phy
26、sical characteristics .15 6.4.1 Semiconductor material .15 6.4.2 Technology15 6.5 Ratings and limiting conditions.15 6.5.1 Power dissipation.15 6.5.2 Operating temperature.15 6.6 Connectivity.15 6.6.1 General .15 6.6.2 Terminal count.15 6.6.3 Terminal information 15 6.6.4 Permutability16 6.7 Documen
27、tation 16 6.8 Form of supply.16 6.8.1 Physical form.16 6.8.2 Packing .16 6.9 Simulation and modelling.16 6.9.1 General .16 6.9.2 Electrical modelling and simulation.16 6.9.3 Thermal data and modelling.16 7 Requirements for bare die and wafers with or without connection structures 17 7.1 General .17
28、7.2 Identity 17 7.2.1 General .17 BS EN 62258-1:2010462258-1 IEC:2009 5 7.2.2 Die name.17 7.2.3 Die version 17 7.3 Materials .17 7.3.1 Substrate material17 7.3.2 Substrate connection .17 7.3.3 Backside detail 17 7.3.4 Passivation material.17 7.3.5 Metallisation 17 7.3.6 Terminal material.17 7.3.7 Te
29、rminal structure18 7.3.8 Vias.18 7.4 Geometry 18 7.4.1 General .18 7.4.2 Units of measurement18 7.4.3 Geometric view18 7.4.4 Die size .18 7.4.5 Die thickness .18 7.4.6 Dimension tolerances 18 7.4.7 Geometric origin 18 7.4.8 Terminal shape and size 18 7.4.9 Die fiducials.19 7.4.10 Die picture .19 7.5
30、 Wafer data 19 7.5.1 General .19 7.5.2 Wafer size .19 7.5.3 Wafer index .19 7.5.4 Wafer die count and step size 19 7.5.5 Wafer reticules 19 8 Minimally-packaged devices19 8.1 General .19 8.2 Number of terminals 19 8.3 Terminal position .19 8.4 Terminal shape and size20 8.5 Device size20 8.6 Seated h
31、eight 20 8.7 Encapsulation material.20 8.8 Moisture sensitivity 20 8.9 Package style code20 8.10 Outline drawing20 9 Quality, test and reliability.21 9.1 General .21 9.2 Outgoing quality level.21 9.2.1 Value.21 9.2.2 Description 21 9.3 Electrical parameters specified 21 9.4 Compliance to standards .
32、21 9.5 Additional device screening .21 9.6 Product status .21 9.7 Testability features 21 BS EN 62258-1:2010 6 62258-1 IEC:2009 9.8 Additional test requirements.21 9.9 Reliability.22 9.9.1 Reliability estimate.22 9.9.2 Reliability calculation .22 10 Handling and packing .22 10.1 General requirements
33、 for all devices22 10.1.1 General .22 10.1.2 Customer part number .22 10.1.3 Type number .23 10.1.4 Supplier.23 10.1.5 Manufacturer .23 10.1.6 Traceability23 10.1.7 Quantity.23 10.1.8 ESD sensitivity.23 10.1.9 Requirements for environmental protection 23 10.2 Specific requirement for bare die or waf
34、ers mask version23 10.3 Specific requirement for wafers wafer map23 10.4 Special item requirements .23 10.4.1 General .23 10.4.2 Special protection requirements .24 10.4.3 Unencapsulated die warning label 24 10.4.4 Toxic material warning .24 10.4.5 Fragile components warning 24 10.4.6 ESD sensitivit
35、y warning24 11 Storage 24 11.1 General .24 11.2 Storage duration and conditions.24 11.3 Long-term storage .24 11.4 Storage limitations.24 12 Assembly25 12.1 General .25 12.2 Attach methods and materials25 12.3 Bonding method and materials.25 12.4 Attachment limitations25 12.4.1 General .25 12.4.2 Te
36、mperature/time profile25 12.5 Process limitations 25 Annex A (informative) Terminology.26 Annex B (informative) Acronyms.36 Bibliography43 BS EN 62258-1:201062258-1 IEC:2009 7 INTRODUCTION This standard is based on the work carried out in the ESPRIT 4thFramework project GOOD-DIE which resulted in th
37、e publication of the ES59008 series of European specifications. Organisations that helped prepare this document included the European IST ENCASIT project, JEITA, JEDEC and ZVEI. The structure of this International Standard as currently conceived is as follows: Part 1: Procurement and use Part 2: Exc
38、hange data formats Part 3: Recommendations for good practice in handling, packing and storage (technical report) Part 4: Questionnaire for die users and suppliers (technical report) Part 5: Requirements for information concerning electrical simulation Part 6: Requirements for information concerning
39、thermal simulation Part 7: XML schema for data exchange (technical report) Part 8: EXPRESS model schema for data exchange (technical report) Further parts may be added as required. BS EN 62258-1:2010 8 62258-1 IEC:2009 SEMICONDUCTOR DIE PRODUCTS Part 1: Procurement and use 1 Scope This part of IEC 6
40、2258 has been developed to facilitate the production, supply and use of semiconductor die products, including wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. The standard defines the minimum requirements for the dat
41、a that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including product identity product data die mechanical information test, quality, assembly and reliability inform
42、ation handling, shipping and storage information It covers the specific requirements for the data that are needed to describe the geometrical properties of die, their physical properties and the means of connection necessary for their use in the development and manufacture of products. It also conta
43、ins, in the annexes, a vocabulary and list of common acronyms. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document
44、 (including any amendments) applies. IEC 60050 (all parts), International Electrotechnical Vocabulary IEC 60191 (all parts), Mechanical standardization of semiconductor devices IEC 60191-4:1999, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms o
45、f package outlines for semiconductor device packages Amendment 1 (2001) Amendment 2 (2002) IEC 61360-1, Standard data element types with associated classification scheme for electric components Part 1: Definitions Principles and methods IEC 62258-2, Semiconductor die products Part 2: Exchange data f
46、ormats IEC/TR 62258-3, Semiconductor die products Part 3: Recommendations for good practice in handling, packing and storage BS EN 62258-1:201062258-1 IEC:2009 9 IEC/TR 62258-4, Semiconductor die products Part 4: Questionnaire for die users and suppliers IEC 62258-5, Semiconductor die products Part
47、5: Requirements for information concerning electrical simulation IEC 62258-6, Semiconductor die products Part 6: Requirements for information concerning thermal simulation IEC/TR 62258-7, Semiconductor die products Part 7: XML schema for data exchange IEC/TR 62258-8, Semiconductor die products Part
48、8: EXPRESS model schema for data exchange ISO 14644-1:1999, Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness 3 Terms and definitions For the purpose of this document, the following terms and definitions are applicable. All the terms and definitions defined
49、here are in addition to the relevant terms and definitions that are defined in IEC 60050 series1. Additional terms and acronyms are given for information in Annexes A and B. 3.1 Basic definitions 3.1.1 die (singular or plural) separated piece(s) of semiconductor wafer that constitute a discrete semiconductor or whole integrated circuit 3.1.2 wafer slice or flat disc, either of semiconductor material or of such a material deposited on a substrate, in which dev
