1、Semiconductor devices - Micro-electromechanical devicesPart 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin filmBS IEC 62047-30:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06IEC 62047-30 Edition 1.0 2017-09 IN
2、TERNATIONAL STANDARD Semiconductor devices Micro-electromechanical devices Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.080.99; 31.140 ISBN 978-2-8322-4820-1 Registered trademark of the
3、International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. National forewordThis British Standard is the UK implementation of IEC62047-30:2017.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Sem
4、iconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2017 Published b
5、y BSI Standards Limited 2017ISBN 978 0 580 93578 7ICS 31.140; 31.080.99Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 October 2017.Amendments/corrigenda issu
6、ed since publicationDate Text affectedBRITISH STANDARDBS IEC 6204730:2017IEC 62047-30 Edition 1.0 2017-09 INTERNATIONAL STANDARD Semiconductor devices Micro-electromechanical devices Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film INTERNA
7、TIONAL ELECTROTECHNICAL COMMISSION ICS 31.080.99; 31.140 ISBN 978-2-8322-4820-1 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. BS IEC 6204730:2017 2 IEC 62047-30:2017 IEC 2017 CONTENTS FOREWO
8、RD . 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 Test bed of MEMS piezoelectric thin film . 6 4.1 General . 6 4.2 Functional blocks and components . 8 4.2.1 General . 8 4.2.2 Clamp 8 4.2.3 Linear actuator 8 4.2.4 Displacement meter . 9 4.2.5 Electric measurement instrument . 9 4
9、.2.6 Power source 9 5 Thin film under testing . 9 5.1 General . 9 5.2 Measurement principle 9 5.3 Measuring procedures of direct transverse piezoelectric coefficient 10 5.4 Measuring procedures of converse transverse piezoelectric coefficient . 10 6 Test report . 11 Annex A (informative) Example of
10、measuring method of MEMS piezoelectric thin film 13 A.1 General . 13 A.2 Sample preparation procedures 13 A.3 Measuring procedures 13 A.3.1 Measuring procedures of direct transverse piezoelectric coefficient . 13 A.3.2 Measuring procedures of converse transverse piezoelectric coefficient 15 A.4 Test
11、 report 18 A.5 Equation of neutral plane 19 Bibliography 20 Figure 1 Test bed of direct and converse transverse piezoelectric coefficient of MEMS piezoelectric thin film . 7 Figure A.1 Tip displacement and calculated direct transverse piezoelectric coefficient . 15 Figure A.2 Input voltage and calcu
12、lated converse transverse piezoelectric coefficient . 17 Table 1 Symbols and designations of test bed . 8 Table A.1 Poling treatment conditions 14 Table A.2 Material properties for calculation of direct transverse piezoelectric coefficient . 14 Table A.3 Output voltage and calculated transverse piez
13、oelectric coefficient 14 Table A.4 Material properties for calculation of converse transverse piezoelectric coefficient . 16 Table A.5 Tip displacement of cantilever and calculated transverse piezoelectric coefficient . 16 BS IEC 6204730:2017 2 IEC 62047-30:2017 IEC 2017 CONTENTS FOREWORD . 4 1 Scop
14、e 6 2 Normative references 6 3 Terms and definitions 6 4 Test bed of MEMS piezoelectric thin film . 6 4.1 General . 6 4.2 Functional blocks and components . 8 4.2.1 General . 8 4.2.2 Clamp 8 4.2.3 Linear actuator 8 4.2.4 Displacement meter . 9 4.2.5 Electric measurement instrument . 9 4.2.6 Power so
15、urce 9 5 Thin film under testing . 9 5.1 General . 9 5.2 Measurement principle 9 5.3 Measuring procedures of direct transverse piezoelectric coefficient 10 5.4 Measuring procedures of converse transverse piezoelectric coefficient . 10 6 Test report . 11 Annex A (informative) Example of measuring met
16、hod of MEMS piezoelectric thin film 13 A.1 General . 13 A.2 Sample preparation procedures 13 A.3 Measuring procedures 13 A.3.1 Measuring procedures of direct transverse piezoelectric coefficient . 13 A.3.2 Measuring procedures of converse transverse piezoelectric coefficient 15 A.4 Test report 18 A.
17、5 Equation of neutral plane 19 Bibliography 20 Figure 1 Test bed of direct and converse transverse piezoelectric coefficient of MEMS piezoelectric thin film . 7 Figure A.1 Tip displacement and calculated direct transverse piezoelectric coefficient . 15 Figure A.2 Input voltage and calculated convers
18、e transverse piezoelectric coefficient . 17 Table 1 Symbols and designations of test bed . 8 Table A.1 Poling treatment conditions 14 Table A.2 Material properties for calculation of direct transverse piezoelectric coefficient . 14 Table A.3 Output voltage and calculated transverse piezoelectric coe
19、fficient 14 Table A.4 Material properties for calculation of converse transverse piezoelectric coefficient . 16 Table A.5 Tip displacement of cantilever and calculated transverse piezoelectric coefficient . 16 IEC 62047-30:2017 IEC 2017 3 Table A.6 Example of measuring conditions and results of elec
20、tro-mechanical characteristics of piezoelectric thin film as mandatory . 18 Table A.7 Example of measuring conditions and results of electro-mechanical characteristics of piezoelectric thin film as optional . 19 BS IEC 6204730:2017 4 IEC 62047-30:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSI
21、ON _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all nati
22、onal electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technica
23、l Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. I
24、nternational, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The
25、 formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendatio
26、ns for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end us
27、er. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication
28、 shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent c
29、ertification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal
30、 injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative referen
31、ces cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for id
32、entifying any or all such patent rights. International Standard IEC 62047-30 has been prepared by subcommittee 47F: Micro-electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this International Standard is based on the following documents: FDIS Report on votin
33、g 47F/286/FDIS 47F/289/RVD Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. BS IEC 6204730:2017 4 IEC 62047-30:2017 IEC 2
34、017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organizat
35、ion for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC
36、publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
37、may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agre
38、ement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC
39、Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used
40、 or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the cor
41、responding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible fo
42、r any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees a
43、nd IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8)
44、Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent right
45、s. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-30 has been prepared by subcommittee 47F: Micro-electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this International Standard is based on th
46、e following documents: FDIS Report on voting 47F/286/FDIS 47F/289/RVD Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. IE
47、C 62047-30:2017 IEC 2017 5 A list of all parts in the IEC 62047 series, published under the general title Semiconductor devices Micro-electromechanical devices, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability dat
48、e indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour
49、 inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. BS IEC 6204730:2017 6 IEC 62047-30:2017 IEC 2017 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film 1
