1、BSI Standards PublicationOptical backplanes ProductspecificationPart 2-1: Optical backplane using optical fibre circuit boards and multi-core right angle optical connectorsPD IEC/TS 62661-2-1:2013Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not f
2、or ResaleNo reproduction or networking permitted without license from IHS-,-,-National forewordThis Published Document is the UK implementation of IEC/TS 62661-2-1:2013.The UK participation in its preparation was entrusted to TechnicalCommittee GEL/86, Fibre optics.A list of organizations represente
3、d on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 70777
4、 3ICS 33.180.99Compliance with a British Standard cannot confer immunity fromlegal obligations.This Published Document was published under the authority of theStandards Policy and Strategy Committee on 31 March 2014. Amendments/corrigenda issued since publicationDate Text affectedPUBLISHED DOCUMENTP
5、D IEC/TS 62661-2-1:2013Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-IEC/TS 62661-2-1 Edition 1.0 2013-08 TECHNICAL SPECIFICATION Optical backplanes Product specifi
6、cation Part 2-1: Optical backplane using optical fibre circuit boards and multi-core right angle optical connectors INTERNATIONAL ELECTROTECHNICAL COMMISSION W ICS 33.180.99 PRICE CODE ISBN 978-2-8322-1039-0 Registered trademark of the International Electrotechnical Commission Warning! Make sure tha
7、t you obtained this publication from an authorized distributor. colourinsidePD IEC/TS 62661-2-1:2013Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,- 2 TS 62661-2-1 IE
8、C:2013(E) CONTENTS FOREWORD . 4 1 Scope 6 1.1 General 6 1.2 Product definition . 6 1.3 Connection arrangement 6 1.4 Classification of connections 6 1.5 Operating environment . 7 2 Normative references 7 3 Terms and definitions 8 4 Dimensional requirements . 9 4.1 Dimension of a sub-rack 9 4.2 Dimens
9、ion of optical wiring on optical backplane 9 4.3 Interconnection condition of connectors on optical backplane 11 4.4 Mounting position of connectors on optical backplane 11 4.5 Mounting position of connectors on daughter board . 11 5 Requirements for dual-star optical circuits connection . 12 5.1 As
10、signment of the name of an optical connection point 12 5.2 Specification of optical cable connection 13 6 Tests . 20 6.1 Sample size . 20 6.2 Test and measurement methods 20 6.3 Test sequence . 20 6.4 Pass/fail criteria . 20 7 Test report . 20 8 Product qualification requirements . 20 8.1 Optical pe
11、rformance requirements . 20 8.1.1 Test 1: Attenuation, IEC 61300-3-4, Method C 20 8.1.2 Test 2: Return loss, IEC 61300-3-6, Method: branching devices . 21 8.1.3 Test 3: Optical propagation delay (fibre length), IEC 60793-1-22, Method B 22 8.2 Mechanical performance requirements . 22 8.2.1 Test 4: Ma
12、ting durability, IEC 61300-2-2 . 22 8.2.2 Test 5: Vibration, IEC 61300-2-1 . 22 8.2.3 Test 6: Shock, IEC 61300-2-9 . 23 8.3 Environmental performance requirements 23 8.3.1 Test 7: Cold, IEC 61300-2-17 . 23 8.3.2 Test 8: Dry heat, IEC 61300-2-18 . 24 9 Reliability 24 9.1 General 24 9.2 Test 9: High t
13、emperature endurance, IEC 61300-2-18 24 9.3 Test 10: Damp heat, IEC 61300-2-19 . 24 9.4 Test 11: Change of temperature, IEC 61300-2-22 24 Annex A (normative) Mounting an optical backplane to zone 3 of the advanced telecommunication computing architecture (ATCA) backplane . 26 PD IEC/TS 62661-2-1:201
14、3Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-TS 62661-2-1 IEC:2013(E) 3 A.1 General 26 A.2 Dimensional condition 26 A.2.1 Mounting position of an optical backplan
15、e . 26 A.2.2 Dimensional condition of the daughter board 28 Annex B (normative) Specification for compact right-angled optical board (CRO) connector 29 B.1 General 29 B.2 Description 29 B.3 Interfaces . 29 Bibliography 38 Figure 1 Sub-rack for optical back plane 9 Figure 2 Area for optical wiring an
16、d positions of optical connectors on optical backplane . 11 Figure 3 8 degree angle polish of ferrule 11 Figure 4 Hole positions of low loss RAO connectors on optical backplane 12 Figure 5 Hole positions to mount a RAO connector to a daughter board . 12 Figure 6 Assignment of connection points 13 Fi
17、gure A.1 Mounting position of optical backplane 27 Figure A.2 Structure of optical daughter board . 28 Figure B.1 CRO connector configuration 30 Figure B.2 CRO socket connector interface 31 Figure B.3 CRO plug connector interface (1 of 2) . 32 Figure B.4 Optical datum target location diagrams for 0,
18、250 mm pitch fibre arrayed. 34 Figure B.5 Optical datum target location diagrams for 0,125 mm pitch fibre arrayed. 35 Table 1 Classification of ferrules 7 Table 2 DS192 Optical backplane 14 Table 3 DS384 Optical wiring backplane 16 Table B.1 Dimensions of the CRO socket connector interface 36 Table
19、B.2 Dimensions of the CRO plug connector interface . 37 PD IEC/TS 62661-2-1:2013Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,- 4 TS 62661-2-1 IEC:2013(E) INTERNATIO
20、NAL ELECTROTECHNICAL COMMISSION _ OPTICAL BACKPLANES PRODUCT SPECIFICATION Part 2-1: Optical backplane using optical fibre circuit boards and multi-core right angle optical connectors FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comp
21、rising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Stan
22、dards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this prep
23、aratory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organi
24、zations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form o
25、f recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretatio
26、n by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regio
27、nal publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out b
28、y independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees f
29、or any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the No
30、rmative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held res
31、ponsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a technical specification when the required support cannot be obtained for the p
32、ublication of an International Standard, despite repeated efforts, or the subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. Technical specifications are subject to review within
33、three years of publication to decide whether they can be transformed into International Standards. IEC 62661-2-1, which is a technical specification, has been prepared by IEC technical committee 86: Fibre optics. PD IEC/TS 62661-2-1:2013Copyright British Standards Institution Provided by IHS under l
34、icense with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-TS 62661-2-1 IEC:2013(E) 5 The text of this technical specification is based on the following documents: Enquiry draft Report on voting 86/439/DTS 86/452/RVC Full information on the
35、 voting for the approval of this technical specification can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of this publication will remain unchanged until
36、 the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an International Standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of
37、 this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printe
38、r. PD IEC/TS 62661-2-1:2013Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,- 6 TS 62661-2-1 IEC:2013(E) OPTICAL BACKPLANES PRODUCT SPECIFICATION Part 2-1: Optical back
39、plane using optical fibre circuit boards and multi-core right angle optical connectors 1 Scope 1.1 General This part of IEC 62661 gives guidelines for an optical backplane using optical fibre boards and multi-core right angle optical connectors with low bending loss multimode fibres (hereafter calle
40、d low-loss RAO) to connect daughter boards to the optical backplane. NOTE Low bending multimode fibres are currently under study. 1.2 Product definition The structure of an optical backplane specified in this specification is as follows a) The optical backplane has the structure to fit to a sub-rack
41、 specified in IEC 60297-3-101 with a height of more than 3U (44,45 mm 3). b) One optical backplane occupies a space of 100 mm (height) and 420 mm (width) in the optical backplane stated in item a). c) A multiple number of optical backplanes may be installed to a sub-rack specified in IEC 60297-3-101
42、 if multiple spaces specified in item b) are available, that is, a height of 44,45 mm N (N5). d) The backplane installs maximum of 14 front boards (daughter boards) with a pitch of 6HP (30,48 mm). e) New Type RAO connectors specified in Annex B are used in the optical backplane. f) Multimode optical
43、 fibres are used for optical wiring in the optical backplane. More specifically, the optical backplane is made of an optical fibre board specified in IEC 62496-3-1 using low bending loss optical fibres. 1.3 Connection arrangement Connection arrangement for the optical backplane is as follows: a) The
44、 construction of optical connection specified in this document consists of using the compact right-angled optical board connectors specified in Annex B which are mounted on an optical backplane housed in a sub-rack specified in IEC 60297-3-101. b) The slots are assigned the following numerical desig
45、nations in this specification: the slot on the left end is designated slot number 1, and the slot on the right end is designated slot number 14. The daughter board located at slot 7 or slot 8 is defined as daughter board B, while daughter boards located on any of the other slots are defined as daugh
46、ter board A. This document specifies an optical dual star connection between daughter board A and daughter board B. 1.4 Classification of connections Connections in this specification are classified as shown in Table 1. PD IEC/TS 62661-2-1:2013Copyright British Standards Institution Provided by IHS
47、under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-TS 62661-2-1 IEC:2013(E) 7 Table 1 Classification of ferrules Class Total number of optical cables in optical backplane Optical connect- ions in daughter board A MT ferrule i
48、n the connector in slot of daughter board A MT ferrule in the connector in slot of daughter board B DS 192 optical backplane 96 2 = 192 lines 8 2 = 16 lines 8 core MT ferrule 12 core MT ferrule DS 384 optical backplane 192 2 = 384 lines 16 2 = 32 lines 16 core MT ferrule 24 core MT ferrule The 16 core MT ferrule and the 24 core MT ferrule used on DS 384 optical backplane are 125 m pitch high-density MT ferrules defined by Figure B.5. 1.5 Operating environment The operating environment is specified in Table A.1 of IEC
