搜索
麦多课文库
收藏
下载资源
加入VIP,免费下载
CSN 42 6510-1984 Cold drawn round bars made of steel grades 11-16 with tolerances h 11 and h 12 Dimensions《公差为h11和h12的11-16级钢制冷拔圆棒 尺寸》.pdf
上传人:
appealoxygen216
文档编号:625032
上传时间:2018-12-21
格式:PDF
页数:12
大小:310.47KB
下载
相关
举报
第1页 / 共12页
第2页 / 共12页
第3页 / 共12页
第4页 / 共12页
第5页 / 共12页
点击查看更多>>
资源描述
展开
阅读全文
相关资源
IRS 70778-2-2018 Recommendations for determining the carrying capacity and fatigue risks of existing metallic railway bridges.pdf
IRS 70712-2018 Rail defects.pdf
IRS 50596-6-2018 Conditions for coding intermodal loading units in combined transport combined transport lines and wagons.pdf
IRS 50596-5-2018 Transport of road vehicles on wagons-Technical Organisation-Conveyance of semi-trailers with P coding or N coding on recess wagons.pdf
IESNA TM-23-2017 Lighting Control Protocols.pdf
IESNA RP-2-2017 Recommended Practice for Retail Lighting.pdf
ITU-R RAPPORT M 766-2 FRENCH-1990 Feasibility of frequency sharing between the GPS and other services《全球定位系统和其他服务之间的频率共享的可行性》.pdf
ITU-R RAPPORT M 763-3 FRENCH-1990 Signal level variation due to multipath effects and blockage by ship-s superstructure in maritime mobile-satellite service lin.pdf
ITU-R RAPPORT M 739-1 FRENCH-1986 Interference due to intermodulation products in the land mobile service between 25 and 100 MHz《由于互调产物在陆地移动服务25和100 MHz之间产生的干扰》.pdf
ITU-R RAPPORT M 319-7 FRENCH-1990 Characteristics of equipment and principles governing the assignment of frequency channels between 25 and 100 MHz for land mob.pdf
猜你喜欢
BS EN 62047-17-2015 Semiconductor devices Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films《半导体器件 微型机电装置 用于测量薄膜力学性能的胀形试验方法》.pdf
BS EN 62047-18-2013 Semiconductor devices Micro-electromechanical devices Bend testing methods of thin film materials《半导体器件 微型机电装置 薄膜材料的弯曲测试方法》.pdf
BS EN 62047-19-2013 Semiconductor devices Micro-electromechanical devices Electronic compasses《半导体器件 微型机电装置 电子罗盘》.pdf
BS EN 62047-2-2006 Semiconductor devices - Micro-electromechanical devices - Part 2 Tensile testing method of thin film materials《半导体器件 微型机电器件 薄膜材料的拉伸试验方法》.pdf
BS EN 62047-20-2014 Semiconductor devices Micro-electromechanical devices Gyroscopes《半导体器件 微型机电装置 陀螺仪》.pdf
BS EN 62047-21-2014 Semiconductor devices Micro-electromechanical devices Test method for Poissons ratio of thin film MEMS materials《半导体器件 微型机电装置 薄膜MEMS材料泊松比试验方法》.pdf
BS EN 62047-22-2014 Semiconductor devices Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates《半导体器件 微型机电装置 柔性基板上导.pdf
BS EN 62047-25-2016 Semiconductor devices Micro-electromechanical devices Silicon based MEMS fabrication technology Measurement method of pull-press and shearing strength of micro .pdf
BS EN 62047-26-2016 Semiconductor devices Micro-electromechanical devices Description and measurement methods for micro trench and needle structures《半导体器件 微型机电装置 微槽和针孔结构的描述和测量方法》.pdf
相关搜索
CSN4265101984COLDDRAWNROUNDBARSMADE
公差
H11
H12
1116
当前位置:
首页
>
标准规范
>
国际标准
>
其他
copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:
苏ICP备17064731号-1
登录
首页
资源分类
专题
通知公告