1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.100 Selected item drawing REV STATUS REV OF PAGES PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Andrew R. ErnstDEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing CHECKED BY Andrew R. ErnstTITLE RESISTOR,
2、CHIP, FIXED, FILM, 17 December 2004 APPROVED BY Kendall A. CottongimHIGH VOLTAGE, STYLE 1206 SIZE A CODE IDENT. NO. 037Z3 DWG NO. 03025 REV PAGE 1 OF 9 AMSC N/A 5905-E446 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS
3、 COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03025 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a high voltage, fixed, film, .120 X .060 chip resistor. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 03025- * * * Drawi
4、ng number Resistance value (see 3.3.2) Tolerance (see 3.3.3) Termination (see 3.3.8) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. U
5、nless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General Specification for. DEPARTMENT OF DEFEN
6、SE STANDARDS MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. (Copies of these documents are available onl
7、ine at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited he
8、rein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be as specified herein. 3.2 Interface and physi
9、cal dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Passivation is not applicable, however, a protective coating over the element shall be provided. 3.3 Electrical characteristics. Provided by IHSNot for ResaleNo reproduction or net
10、working permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03025 REV PAGE 3 L W T (max) D Inch 0.125 0.006 mm 3.175 0.152 Inch 0.063 0.006 mm 1.600 0.152 Inch 0.025 0.002 mm 0.635 0.051 Inch 0.025 max. mm 0.635 max. NOTES: 1. Dim
11、ensions are in inches. 2. Metric equivalents are given for general information only. 3. The pictorial view of the styles above are given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope and do not alter the functional as
12、pects of the device, are acceptable. FIGURE 1. Chip resistor. 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by four characters, consisting of three digits and a letter. The letter is used simultaneously as a decimal point and as a multiplier. For resistance values: a. Grea
13、ter than or equal to 2 megohm but less than 1 gigohms, the letter “M“ is used to represent a decimal point. b. Greater than or equal to 1 gigohm but less than 8 gigohms, the letter “G“ is used to represent a decimal point. All digits preceding and following the letters (M or G) of the group represen
14、t significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified herein (see table II). The resistance values for tolerances F, G, J, and K may be any value within the limits specified herein. Resistance values not listed in t
15、he “10 to 100“ decade table of MIL-PRF-55342 for the appropriate resistance tolerance shall be considered as not conforming to the specification. The standard values for every decade shall follow the sequence demonstrated for the “10 to 100“ decade table specified in MIL-PRF-55342. 3.3.2 Resistance
16、range. The resistance range shall be from 2 Megohms to 8 Gigohms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03025 REV PAGE 4 TABLE I. Designation of resistance v
17、alues. Designation Resistance ohms 2M00 to 9M99 incl. 10M0 to 99M9 incl. 100M to 999M incl. 1G00 to 8G00 incl. 2,000,000 to 9,999,999 incl. 10,000,000 to 99,999,999 incl. 100,000,000 to 999,999,999 incl. 1,000,000,000 to 8,000,000,000 incl. 3.3.3 Resistance tolerance. Resistors are available in resi
18、stance tolerances as specified in table II (see 6.5). TABLE II. Resistance tolerance. Symbol Resistance tolerance percent F G J K 1.0 2.0 5.0 10.0 3.3.4 Power rating. The power rating for chip resistors shall be .300 watt at +70C derated to +150C at zero power (see figure 2). 3.3.5 Voltage rating. T
19、he maximum continuous working voltage shall not exceed 1500 volts. Voltage derating should be applied if low pressure or high humidity is encounter. 3.3.6 Resistance temperature coefficient. The resistance temperature coefficient shall be 100 ppm/C. 3.3.7 Operating temperature. The operating tempera
20、ture shall be -25C to +150C. 3.3.8 Termination. The termination material shall be in accordance with MIL-PRF-55342, code letters B, C, G, and U. FIGURE 2. Derating curve. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS
21、 COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03025 REV PAGE 5 3.4 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.5 Thermal shock. When resistors are tested as specified in 4.7, the thermal sh
22、ock the change in resistance shall not exceed 0.25 percent +0.01 ohm. 3.6 Low temperature operation. When resistors are tested as specified in 4.9, the low temperature operation the change in resistance shall not exceed 0.02 percent +0.01 ohm. 3.7 Resistance to solder heat. When resistors are tested
23、 as specified in 4.10, the resistance to bonding exposure the change in resistance shall not exceed 0.25 percent +0.01 ohm. 3.8 Resistance temperature characteristic. When resistors are tested as specified in 4.11, the RTC shall not exceed the values specified (see 3.3.6). 3.9 Short time overload. W
24、hen resistors are tested as specified in 4.12, the short time overload the change in resistance shall not exceed 0.5 percent +0.01 ohm. 3.10 Moisture resistance. When resistors are tested as specified in 4.13, the moisture resistance the change in resistance shall not exceed 0.5 percent +0.01 ohm. 3
25、.11 High temperature exposure. When resistors are tested as specified in 4.14 the high temperature exposure the change in resistance shall not exceed 0.5 percent +0.01 ohm. 3.12 Life. When resistors are tested as specified in 4.15, the life the change in resistance shall not exceed 0.5 percent +0.01
26、 ohm. 3.13 Solderability. The requirement for solderability shall be as specified in 4.8 and 4.4.1.1.3. 3.14 Marking. Marking is not required on this resistor; however, each waffle pack shall be marked with the PIN assigned herein (see 1.2), the manufacturers identification code, the date code, and
27、the lot code. At the option of the manufacturer, the resistor may be marked (i.e., laser, color dot, etc.). The marking shall remain legible after all tests. 3.15 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used
28、 to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements and promotes economically advantageous life cycle costs. 3.16 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed a
29、s suggested sources of supply. 3.17 Workmanship. Resistors shall be processed in such a manner as to be uniform in quality and be free from defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-
30、55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER,
31、COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03025 REV PAGE 6 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 and MIL-STD-690 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspectio
32、n of product for delivery shall consist of groups A and B inspections. 4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table III, and shall be made on the same set of sample units, in the order shown. Part per million testing and verification as specified
33、 in MIL-PRF-55342 is not applicable to this document. TABLE III. Group A inspection. Inspection Requirement paragraph Method paragraph Sampling procedure Subgroup I Thermal shock DC resistance 3.5 3.4 4.7 4.6 100 percent Subgroup II Visual inspection 3.2, 3.14, 3.17 4.5 13 samples, 0 failures Subgro
34、up III Solderability 3.13 4.8 5 samples 0 failures 4.4.1.1.1 Subgroup I. Subgroup I tests shall be performed on 100 percent of the product supplied under this document. Resistors that are out of resistance tolerance, or which experience a change in resistance greater than that permitted for the test
35、s of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnished on contracts. 4.4.1.1.2 Subgroup II. A sample of 13 parts shall be randomly selected, if one or more defects are fo
36、und, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against this document. 4.4.1.1.3 Subgroup III. A sample of five parts shall be r
37、andomly selected, if one or more defects are found, the lot shall be rejected/rescreened in accordance with MIL-PRF-55342. 4.4.1.2 Group B inspection. Group B inspection shall consist of the inspections specified in table IV, and shall be made on the same set of sample units, in the order shown. 4.4
38、.1.2.1 Certification. The procuring activity may accept a certificate of compliance in lieu of group B inspection (see 6.2d). 4.4.1.2.2 Action in case of failure. If any of the subgroups fail the group B inspection and an appropriate lot screen can be established, the lot shall be screened and a new
39、 set of samples (see table IV) from the screened lot, shall be submitted to the subgroup that failed. If one or more defects are found in the resubmitted samples, the lot shall be rejected and shall not be supplied to this specification. Provided by IHSNot for ResaleNo reproduction or networking per
40、mitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03025 REV PAGE 7 4.4.1.2.3 Disposition of sample units. Sample units which have been subjected to group B inspections shall not be supplied to this specification. 4.5 Visual and mec
41、hanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342. 4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342. 4
42、.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342. TABLE IV. Group B inspection. Inspection Requirement paragraph Method paragraph Sampling procedure Subgroup I Life 3.12 4.15 30 samples, 0 failures Subgroup II Thermal shock Low temperature operation Resistance to sold
43、ering heat Resistance temperature characteristic Short time overload Moisture resistance 3.5 3.6 3.7 3.8 3.9 3.10 4.7 4.9 4.10 4.11 4.12 4.13 30 samples, 0 failures Subgroup III High temperature exposure 3.11 4.14 30 samples 0 failures 4.8 Solderability. Solderability shall be tested in accordance w
44、ith MIL-PRF-55342 and 4.4.1.1.3 herein. 4.9 Low temperature operation. Low temperature operation shall be tested in accordance with MIL-PRF-55342. 4.10 Resistance to soldering heat. Resistance to soldering heat shall be tested in accordance with MIL-PRF-55342. 4.11 Resistance temperature characteris
45、tic. Resistance temperature characteristic shall be tested in accordance with MIL-PRF-55342. 4.12 Short time overload. Short time overload shall be tested in accordance with MIL-PRF-55342. 4.13 Moisture resistance. Moisture resistance shall be tested in accordance with MIL-PRF-55342. 4.14 High tempe
46、rature exposure. High temperature exposure shall be tested in accordance with MIL-PRF-55342. 4.15 Life. Life shall be tested in accordance with MIL-PRF-55342. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, O
47、HIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03025 REV PAGE 8 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel n
48、eed to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity within the Military Department or Defense Agency, or within the military services system commands. Packaging data retrieval
49、is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended to be used in thick or thin f
