1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update and validation of drawing. Editorial changes throughout. 14 JUL 00 K. COTTONGIM B Add pure tin prohibition paragraph. Editorial changes throughout. 7 MAR 07 M. Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CE
2、NTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Selected item drawing REV B B B B B B REV STATUS OF PAGES PAGES 1 2 3 4 5 6 PMIC N/A PREPARED BY Allen R. Knox DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45444-5000 CHECKED BY David E. Moore APPROVE
3、D BY David E. Moore TITLE RESISTOR, CHIP, FIXED, FILM, TANTALUM NITRIDE, STYLE 0505 SIZE A CODE IDENT. NO. 14933 DWG NO. 88008 Original date of drawing: 20 JULY 1988 REV B PAGE 1 OF 6 AMSC N/A 5905-E608 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,
4、-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88008 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a fixed, .05 x.05 tantalum nitride, chip resistor. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 88008 - * | |
5、 | | Drawing number Dash number (see table I) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues o
6、f these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Fixed, Film, Chip, Nonestablished Reliability, Established Reliability, Space Level, General Specification For. DEPARTMENT OF DEFENSE STANDARD MIL-STD-790 - Standard Prac
7、tice for Established Reliability and High Reliability Qualified Products List (QPL) System of Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksea
8、rch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes pre
9、cedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342 and as specified herein. 3.2 Interface and physical
10、dimensions. The resistor shall meet the interface and physical dimensions as specified in MIL-PRF-55342 and herein (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 149
11、33 DWG NO. 88008 REV B PAGE 3 Inches mm .005 0.13 .010 0.25 .012 0.30 .050 1.27 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tolerances are .003 (0.08 mm). FIGURE 1. Leadless chip carrier. 3.3 Electrical characterist
12、ics. 3.3.1 Resistance. The nominal resistance shall be as specified in table I. 3.3.2 Resistance tolerance. The resistance tolerance shall be as specified in table I. 3.3.3 Power rating. The power rating at 25oC shall be as specified in table I. 3.3.4 Thermal resistance. Thermal resistance (RO) shal
13、l be as specified in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88008 REV B PAGE 4 TABLE I. Electrical characteristics. DSCC drawing dash number Resistanc
14、e (ohms) Resistance tolerance (%) RO (oC/W) 1/ Maximum power (watts) -01 44 1 10.00 0.100 -02 13 2 10.00 0.100 -03 33 2 10.00 0.100 -04 20 2 10.00 0.100 1/ RO is the thermal resistance in oC/W between film and mounting surface. 3.3.5 Resistance temperature coefficient. The resistance temperature coe
15、fficient shall be 100 ppm/oC. 3.3.6 Operating temperature. The operating temperature shall be -55oC to +125oC. 3.3.7 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.3.8 Terminations. The terminations
16、 shall be in accordance with MIL-PRF-55342 (termination B). 3.3.8.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of
17、 3 percent lead, by mass (see 6.3). 3.3.9 Short time overload. When resistors are tested as specified in 4.7, the change in resistance shall not exceed 2 percent. 3.3.10 Life. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The change in resistance sha
18、ll not exceed 0.5 percent. 3.4 Marking. Marking of the individual chip resistors is not required; however, each unit package shall be in accordance with MIL-STD-1285, and include the PIN as specified in 1.2, with the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot co
19、des. 3.4.1 Package marking for Beryllium Oxide. Manufacturers which use beryllium oxide in their construction shall mark each resistor package with the symbol “BeO”. 3.5 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should
20、be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.6 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be l
21、isted as a suggested source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in acco
22、rdance with MIL-STD-790 is not applicable to this document. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88008 REV B PAGE 5 4.2 Qualification inspection. Qualificati
23、on inspection is not applicable to this document. 4.2.1 Failure rate qualification. The failure rate qualification specified in MIL-PRF-55342 is not applicable to this document. 4.3 Conformance inspections. 4.3.1 Inspection of product for delivery. Inspection of product for delivery shall consist of
24、 group A and group B inspections of MIL-PRF-55342. Additionally; a life test as specified in 4.8 shall be performed. 4.3.2 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements and/or the life test in lieu of performing group B tes
25、ts, and the life test (see 6.2d). 4.4 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-PRF-55342. 4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are i
26、n accordance with the applicable requirements of MIL-PRF-55342. 4.6 DC resistance. Resistors shall be tested in accordance with MIL-PRF-55342. The following exceptions shall apply: a. Measuring apparatus: Bridges. b. Limit of error of measuring apparatus: One fourth of the specified initial-resistan
27、ce tolerance or 0.1 percent, whichever is less, 0.002 ohm. c. Test voltage: Measurements of resistance shall be made by using a dc potential resulting in not more than 5 percent of rated wattage. This same voltage shall be used whenever a subsequent resistance measurement is made. 4.7 Short time ove
28、rload. Resistance shall be submitted to a short time overload as specified in MIL-PRF-55342. There shall be no evidence of arcing, burning, or charring and resistance shall not change more than as specified in 3.3.9. 4.8 Life. Resistors shall be tested in accordance with MIL-PRF-55342. The following
29、 exceptions shall apply: a. Test condition - 100 hours. b. Measurement during test - none. c. Test shall be performed monthly. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to b
30、e performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or wi
31、thin the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. Provided by IHSNot for ResaleNo reproduction or networking perm
32、itted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88008 REV B PAGE 6 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Resistor networks are u
33、sed in surface mounting applications where space is a major concern. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certification of compliance that parts have p
34、assed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. d. Whether the manufacturer performs the group B tests and life test or provides certification of compliance (see 4.3.2). 6.3 Tin whisker growth. The use of alloys with tin conten
35、t greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whiske
36、r-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 User of record. Coordi
37、nation of this document for future revisions is coordinated only with the suggested source of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at resistordla.mil or in writing to: DSCC-VAT, Post Office Box 3990, Columbus,
38、 OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552. 6.5 Suggested source of supply. Suggested source of supply is listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained online at resistordla.mil or contact DSCC-VAT,
39、Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552. DSCC drawing PIN Vendor similar designation or type number 1/ Vendor CAGE Vendors name and address 88008-* A3WD01 64537 Aeroflex / KDI 60 South Jefferson Road Whippany, NJ 07981 1/ Parts must be purchased to the DSCC PIN to assure that all performance requirements and tests are met. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
