DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf

上传人:testyield361 文档编号:688878 上传时间:2018-12-30 格式:PDF 页数:6 大小:128.44KB
下载 相关 举报
DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf_第1页
第1页 / 共6页
DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf_第2页
第2页 / 共6页
DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf_第3页
第3页 / 共6页
DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf_第4页
第4页 / 共6页
DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf_第5页
第5页 / 共6页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Revise section 4. Editorial changes throughout. 17 Jan 92 D. MOORE B Title change. Add marking requirements for beryllium oxide construction, editorial changes throughout. 25 Oct 93 D. MOORE C Add new resistance values. Change dash number to resistance desi

2、gnation and resistance tolerance. Editorial changes throughout. 19 Sep 94 D. MOORE D Update and validation of drawing. Editorial changes throughout. 14 Jul 00 K. COTTONGIM E Add pure tin prohibition paragraph. Editorial changes throughout. 7 Mar 07 M. Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3

3、DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Selected item drawing REV E E E E E E REV STATUS OF PAGES PAGES 1 2 3 4 5 6 PMIC N/A PREPARED BY Allen R. Knox DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45

4、444-5000 CHECKED BY David E. Moore TITLE RESISTOR, CHIP, FIXED, FILM, APPROVED BY David E. Moore TANTALUM NITRIDE, STYLE 1050 SIZE A CODE IDENT. NO. 14933 DWG NO. 88009 Original date of drawing: 27 May 1988 REV E PAGE 1 OF 6 AMSC N/A 5905-E609Provided by IHSNot for ResaleNo reproduction or networkin

5、g permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88009 REV E PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a .10 x .05 fixed, tantalum chip, resistor. 1.2 Part or Identifying Number (PIN). The complete

6、 PIN is as follows: 88009 - * * | | | | | | Drawing number Resistance (3.3.1) Tolerance (3.3.2) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specifie

7、d herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Fixed, Film, Chip, Nonestablished Reliability, Established Reliability, Space Level, General Specification For. DEPARTME

8、NT OF DEFENSE STANDARD MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) System of Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are avai

9、lable online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references

10、 cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342 an

11、d as specified herein. 3.2 Interface and physical dimensions. The resistor shall meet the interface and physical dimensions as specified in MIL-PRF-55342 and herein (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SU

12、PPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88009 REV E PAGE 3 Inches mm .005 0.13 .010 0.25 .017 0.43 .050 1.27 .100 2.54 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tolerances are .003 (0.08 mm).

13、FIGURE 1. Leadless chip carrier. 3.3 Electrical characteristics. 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent significant figures and the last digit specifies the number of zeros to follow. When the value of resistance is l

14、ess than 100 ohms, or when fractional values of an ohm are required, the letter ”R” shall be substituted for one of the significant digits to represent the decimal point. 3.3.1.1 Resistance range. The resistance range shall be 4.3 ohms to 500 ohms. Note: Values of less than 10 ohms are only availabl

15、e in (K) 10 percent tolerance. 3.3.2 Resistance tolerance. Resistors are available in (F) 1 percent, (G) 2 percent, (J) 5 percent, and (K) 10 percent (see 3.3.1.1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYT

16、ON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88009 REV E PAGE 4 3.3.3 Power rating. The power rating at 25oC shall be 10 watts. Maximum film temperature is 150oC. Power ratings are based on 100oC heat sink temperature and a single edge wraparound termination to a ground plane. 3.3.4 Thermal resistan

17、ce. Thermal resistance (RO) shall be 12. RO is the thermal resistance in oC/W between film and mounting surface. 3.3.5 Resistance temperature coefficient. The resistance temperature coefficient shall be 100 ppm/oC. 3.3.6 Operating temperature. The operating temperature shall be -55oC to +125oC. 3.3.

18、7 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.3.8 Terminations. The terminations shall be in accordance with MIL-PRF-55342 (termination B). 3.3.8.1 Pure tin. The use of pure tin, as an underplate

19、 or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.3.9 Short time overload. When resistors are tested as specific in 4.7, the ch

20、ange in resistance shall not exceed 2 percent. 3.3.10 Life. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The change in resistance shall not exceed 0.5 percent. 3.4 Marking. Marking of the individual chip resistors is not required; however, each unit

21、 package shall be in accordance with MIL-STD-1285, and include the PIN as specified in 1.2, with the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. 3.4.1 Package marking for Beryllium Oxide. Manufacturers which use beryllium oxide in their construction shall

22、mark each resistor package with the symbol “BeO”. 3.5 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance r

23、equirements, and promotes economically advantageous life cycle costs. 3.6 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed as a suggested source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defe

24、cts that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection i

25、s not applicable to this document. 4.2.1 Failure rate qualification. The failure rate qualification specified in MIL-PRF-55342 is not applicable to this document. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON

26、, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88009 REV E PAGE 5 4.3 Conformance inspections. 4.3.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A and group B inspections of MIL-PRF-55342. Additionally; a life test as specified in 4.8 shall be performed.

27、 4.3.2 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements and/or the life test in lieu of performing group B tests, and the life test (see 6.2d). 4.4 Inspection of packaging. Inspection of packaging shall be in accordance with M

28、IL-PRF-55342. 4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342. 4.6 DC resistance. Resistors shall be tested in acco

29、rdance with MIL-PRF-55342. The following exceptions shall apply: a. Measuring apparatus: Bridge b. Limit of error of measuring apparatus: One fourth of the specified initial resistance tolerance or 0.1 percent, whichever is less, 0.002 ohm. c. Test voltage: Measurements of resistance shall be made b

30、y using a dc potential resulting in not more than 5 percent of rated voltage. This same voltage shall be used whenever a subsequent resistance measurement is made. 4.7 Short time overload. Resistance shall be submitted to a short time overload as specified in MIL-PRF-55342. There shall be no evidenc

31、e of arcing, burning, or charring and resistance shall not change more than specified in 3.3.9. 4.8 Life. Resistors shall be tested in accordance with MIL-PRF-55342. The following exceptions shall apply: a. Test condition - 100 hours. b. Measurement during test - none. c. Test shall be performed mon

32、thly. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity t

33、o ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments

34、or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Resistor networks are used in surface mount

35、ing applications where space is a major concern. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88009 REV E PAGE 6 6.2 Ordering data. The contract or purchase order sh

36、ould specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certification of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing.

37、d. Whether the manufacturer performs the group B tests and life test or provides certification of compliance (see 4.3.2). 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur any

38、time from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit

39、the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 User of record. Coordination of this document for future revisions is coordinated only with the suggested source of supply and the users of rec

40、ord of this document. Requests to be added as a recorded user of this drawing may be achieved online at resistordla.mil or in writing to: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552. 6.5 Suggested source of supply. Suggested source of supply

41、 is listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained online at resistordla.mil or contact DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552. DSCC drawing PIN Vendor sim

42、ilar designation or type number 1/ Vendor CAGE Vendors name and address 88009-* A3WD02 64537 Aeroflex / KDI 60 South Jefferson Road Whippany, NJ 07981 1/ Parts must be purchased to the DSCC PIN to assure that all performance requirements and tests are met. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

展开阅读全文
相关资源
猜你喜欢
相关搜索
资源标签

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1