1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added two suggested sources of supply. Editorial changes throughout. 30 Aug 1988 Randy Larson B Relocated pin markings on figure 1. Changed 3.27. Added 3.28. Editorial changes throughout. 27 Sep 1990 Randy Larson C Changed 3.12. Changed several dimensions a
2、nd added standoffs. Added footnotes 4 and 5 on figure 1. Editorial changes throughout. 7 Oct 1991 D. Moore D Added note 6 to figure 1. Added vendor 22519 to 6.4. Editorial changes throughout. 17 Dec 1992 D. Moore E Added vendor 50965 to 6.4. Editorial changes throughout. 1 Oct 1999 James A. Crum F U
3、pdated references, sources of supply, and editorial corrections. 1 July 2005 Kendall A. Cottongim G Incorporate boilerplate updates, update approved sources of supply and incorporate pure tin prohibition guidance. 22 Dec 2009 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source Control
4、 drawing REV STATUS OF PAGES REV G G G G G G G G G PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY James B. Walker Jr DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-5000 Original date of drawing: 16 Dec 1987 CHECKED BY Dan McGrath TITLE DELAY LINES, PASSIVE, 3-PIN, SIP APPROVED BY R
5、andy Larson SIZE A CODE IDENT. NO. 14933 DWG NO. 88013 REV G PAGE 1 OF 9 AMSC N/A 5999-E220 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
6、rom IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88013 REV G PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a family of 3-pin, single in-line package, passive delay lines. 1.2 Part or Identifying Number (PIN). The complete PIN sha
7、ll be as follows: 88013 -001 | | | | Drawing Dash number number (see table I) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or re
8、commended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Gover
9、nment documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT O
10、F DEFENSE SPECIFICATIONS MIL-STD-31000 - Technical Data Packages. MIL-DTL-19491 - Semiconductor Devices, Packaging of. MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for. MIL-PRF-83531 - Delay
11、 Lines, Passive, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-1285 - Marking of Electrical and Electronic Parts. DEPARTMENT OF DEFENSE HANDBOOK MIL-HDBK-454 - General Guidelines for Electronic Equipment.
12、(Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ of from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a confl
13、ict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking p
14、ermitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88013 REV G PAGE 3 3. REQUIREMENTS 3.1 Interface and physical dimensions. See figure 1. 3.2 Item requirements. This drawing shall be interpreted in accordance with MIL-STD-31000.
15、3.3 Case material. Case material shall be nonmetallic, cast epoxy encapsulated, and be in accordance with MIL-PRF-83531. 3.4 Terminals. Terminal material and finish shall be in accordance with MIL-PRF-83531. 3.5 Temperature coefficient of delay. The temperature coefficient of delay shall be 70 ppm/C
16、 maximum. 3.6 Capacitors. Chip capacitors shall be items that have been tested and supplied in accordance with MIL-PRF-55681, when possible. 3.7 Impedance. See table I. 3.8 Total delay time. See table I. 3.9 Rise time. See table I. 3.10 Pulse attenuation. See table I. 3.11 Distortion. The maximum di
17、stortion shall be 10 percent on the output pulse, when measured with the input pulse rise time set to 5 1 nanoseconds. The rise time shall be measured from 10 percent to 90 percent of the pulse amplitude. 3.12 Thermal shock. Method 107, MIL-STD-202, test condition B, 5 minutes at temperature extreme
18、s and in accordance with MIL-PRF-83531. 3.13 Dielectric withstanding voltage at reduced barometric pressure. In accordance with MIL-PRF-83531, except that test condition D shall apply. 3.14 Insulation resistance. Insulation resistance shall be 10,000 megohms (minimum) at 50 V dc, ambient room temper
19、ature, between input and ground terminals. Insulation resistance shall be 10,000 megohms minimum at 500 V dc, ambient room temperature, when measured between all terminals tied together and the case. 3.15 Sealing. As specified in MIL-PRF-83531. 3.16 Terminal strength. Method 211a, MIL-STD-202, test
20、condition C and in accordance with MIL-PRF-83531, applied force 5 pounds. 3.17 Vibration. Method 204, test condition B, MIL-STD-202 and in accordance with MIL-PRF-83531. 3.18 Shock. Method 213, MIL-STD-202, test condition I and in accordance with MIL-PRF-83531. 3.19 Immersion. Method 104, test condi
21、tion A, MIL-STD-202 and in accordance with MIL-PRF-83531. Measurement ;insulation resistance. 3.20 Moisture resistance. As specified in MIL-PRF-83531. 3.21 Solderability. As specified in MIL-PRF-83531. Internal soldering should be in accordance with Guideline 5 of MIL-HDBK-454. 3.22 Resistance to so
22、lvents. Method 215, MIL-STD-202 and in accordance with MIL-PRF-83531. 3.23 Operating temperature. -55C to +125C. 3.24 Storage temperature. -65C to +130C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO S
23、IZE A CODE IDENT NO. 14933 DWG NO. 88013 REV G PAGE 4 3.25 Altitude. Maximum altitude shall be 100,00 feet (operating and non-operating). 3.26 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum exte
24、nt possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.27 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-835
25、31 Qualified Product List for at least one part, or perform the group A and group C inspections specified herein on a sample of parts agreed upon by the manufacturer and DSCC-VA. 3.28 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an appr
26、oved source of supply. 3.29 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.30 Marking.
27、 Marking shall be in accordance with MIL-STD-1285, except the delay line shall be marked on the top of the case with the pin locations (see figure 1) with the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. 3.31 Workmansh
28、ip. Parts shall be free of flash pits, voids, and excessive mold marks. Visible parting line is acceptable. Guideline 9 of MIL-HDBK-454 applies. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A COD
29、E IDENT NO. 14933 DWG NO. 88013 REV G PAGE 5 Inches mm .002 .010 .020 .125 .150 .250 .265 .350 .380 .500 .820 0.05 0.25 0.51 3.18 3.81 6.35 6.73 8.89 9.65 12.70 20.83 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tole
30、rance is .010 (0.25 mm). 4. Location and shape of standoffs are optional. Height shall be as indicated. 5. Flat pins optional. If used, dimensions shall be .010 .002 (0.25 0.05 mm) by .020 .002(0.51 0.05 mm). 6. Leads shall be free of case meniscus and other foreign material and shall be solderable
31、for a minimum of .010 (0.25 mm) above the seating plane of the delay line. FIGURE 1. Interface and physical dimensions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO.
32、 88013 REV G PAGE 6 TABLE I. PINs and electrical measurements. Characteristic impedance (10%) Nominal total delay Rise time max (ns) (max) Pulse attenuation 50 100 200 300 500 PIN 88013- 001 002 003 004 005 006 007 008 009 010 011 012 013 014 015 016 017 018 019 020 021 022 023 024 025 026 027 028 0
33、29 030 031 032 033 034 035 036 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 224 225 226 227 228 229 230 231 2
34、32 233 234 235 236 301 302 303 304 305 306 307 308 309 310 311 312 313 314 315 316 317 318 319 320 321 322 323 324 325 326 327 328 329 330 331 332 333 334 335 336 401 402 403 404 405 406 407 408 409 410 411 412 413 414 415 416 417 418 419 420 421 422 423 424 425 426 427 428 429 430 431 432 433 434 4
35、35 436 10 20 30 40 50 60 70 80 90 100 125 150 175 200 225 250 275 300 325 350 375 400 425 450 475 500 550 600 650 700 750 800 850 900 950 1,000 2 ns 2 ns 2 ns 2 ns 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 3 5.5 6.5 8 10 12 14 16 18 20 25 30 35 4
36、0 45 50 55 60 65 70 75 80 85 90 95 100 110 120 130 140 150 160 170 180 190 200 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 15% 15% 15% 15% 15% 15% 15% 15% 15% 15% 15% 4. VERIFICATION 4.1 Sampling and inspection. Unless otherwise specified, samp
37、ling and inspection procedures shall be performed in accordance with MIL-STD-202. 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for delivery shall consist of the group A inspection of MIL-PRF-83531. 4.2.2 Optional statement of compliance. The acquiring a
38、ctivity, at its discretion, may accept a statement of compliance with the group A inspection in lieu of the manufacturer performing the group A inspection (see 6.2c). 4.2.3 Inspection of packaging. The sampling and inspection of the preservation, packing, and container marking shall be in accordance
39、 with MIL-DTL-19491. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88013 REV G PAGE 7 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirement
40、s shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inve
41、ntory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the r
42、esponsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for
43、delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. The requirements for packaging should be in accordance with the provisions fo
44、r semiconductors specified in MIL-DTL-19491. 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical oper
45、ating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer
46、to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Users of record. Coordination of this document for future revisions is coordinated only with the approved source(s) of supply and the users of record of this document. Requests to be added as a recorded user of this draw
47、ing may be achieved online at mailto:relaydla.mil or if in writing to: Defense Supply Center, Columbus, ATTN: DSCC/VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. 6.5 Approved source(s) of supply. Approved source(s) of supply are listed herein. Addi
48、tional sources will be added as they become available. Assistance in the use of this drawing may be obtained online at mailto:relaydla.mil, or by contacting Defense Supply Center, Columbus, ATTN: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88013 REV G PAGE 8 DSCC Drawing P
