1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add package Y. Update boilerplate to current version. - CFS 06-05-30 Thomas M. Hess B Update boilerplate paragraphs to current requirements. - PHN 12-07-23 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME CO
2、LUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Charles F. Saffle DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing C
3、HECKED BY Charles F. Saffle TITLE MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON YY-MM-DD 03-11-14 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/04622 REV B PAGE 1 OF 11 AMSC N/A 5962-V085-12 Provided by IHSNot for ResaleNo re
4、production or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance octal buffer/driver with 3-state outputs
5、 microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentat
6、ion: V62/04622 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 74AC244-EP Octal buffer/driver with 3-state outputs 1.2.2 Case outlines. The case outline(s) are as specified herein. Outline
7、letter Number of pins JEDEC PUB 95 Package style X 20 JEDEC MS-013 Plastic small-outline Y 20 Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plat
8、e C Gold plate D Palladium E Gold flash palladium Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltag
9、e range (VCC) . -0.5 V to +7.0 V Input voltage range (VI) . -0.5 V to VCC+ 0.5 V 2/ Output voltage range (VO) . -0.5 V to VCC+ 0.5 V 2/ Input clamp current (IIK) (VIVCC) 20 mA Output clamp current (IOK) (VOVCC) 20 mA Continuous output current (IO) (VO= 0 to VCC) 50 mA Continuous current through VCCo
10、r GND . 200 mA Package thermal impedance (JA): Case outline X . 58C/W 3/ Case outline Y . 60C/W 3/ Storage temperature range (TSTG) . -65C to +150C 4/ 1.4 Recommended operating conditions. 5/ Supply voltage range (VCC) . 2.0 V to 6.0 V Minimum high level input voltage (VIH): VCC= 3.0 V 2.1 V VCC= 4.
11、5 V 3.15 V VCC= 5.5 V 3.85 V Maximum low level input voltage (VIL): VCC= 3.0 V 0.9 V VCC= 4.5 V 1.35 V VCC= 5.5 V 1.65 V Input voltage range (VI) . 0.0 V to VCCOutput voltage range (VO) . 0.0 V to VCCMaximum high level output current (IOH): VCC= 3.0 V -12 mA VCC= 4.5 V -24 mA VCC= 5.5 V -24 mA Maxim
12、um low level output current (IOL): VCC= 3.0 V 12 mA VCC= 4.5 V 24 mA VCC= 5.5 V 24 mA Maximum input transition rise or fall rate (t/v) . 8 ns/V Operating free-air temperature range (TA) -55C to +125C 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the de
13、vice. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ The input
14、and output voltage ratings may be exceeded if the input and output current ratings are observed. 3/ The package thermal impedance is calculated in accordance with JESD 51-7. 4/ Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reductio
15、n of overall device life. 5/ All unused inputs of the device must be held at VCCor GND to ensure proper device operation. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG N
16、O. V62/04622 REV B PAGE 4 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Copies of these documents are available onlin
17、e at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers n
18、ame, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and e
19、lectrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and fig
20、ure 1. 3.5.2 Truth table. The truth table shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. 3.5.4 Terminal connections. The terminal connections shall be as shown in figure 4. 3.5.5 Timing waveforms and test circuit. The timing waveforms and test ci
21、rcuit shall be as shown in figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Sy
22、mbol Conditions VCCTemperature, TADevice type Limits Unit Min Max High level output voltage VOHIOH= -50 A 3.0 V 25C, -55C to 125C 01 2.9 V 4.5 V 4.4 5.5 V 5.4 IOH= -12 mA 3.0 V 25C 2.56 -55C to 125C 2.4 IOH= -24 mA 4.5 V 25C 3.86 -55C to 125C 3.7 5.5 V 25C 4.86 -55C to 125C 4.7 Low level output volt
23、age VOLIOL= 50 A 3.0 V 25C, -55C to 125C 01 0.1 V 4.5 V 0.1 5.5 V 0.1 IOL= 12 mA 3.0 V 25C 0.36 -55C to 125C 0.5 IOL= 24 mA 4.5 V 25C 0.36 -55C to 125C 0.5 5.5 V 25C 0.36 -55C to 125C 0.5 Input current IIData inputs and Control inputs VI= VCCor GND 5.5 V 25C 01 0.1 A -55C to 125C 1.0 Off-state outpu
24、t current IOZVO= VCCor GND VI(OE)= VILor VIH5.5 V 25C 01 0.25 A -55C to 125C 5.0 Quiescent supply current ICCVI= VCCor GND IO= 0 A 5.5 V 25C 01 4.0 A -55C to 125C 80.0 Input capacitance CIVI= VCCor GND 5.0 V 25C 01 2.5 TYP pF Power dissipation capacitance per buffer/driver CpdCL= 50 pF f = 1 MHz 5.0
25、 V 25C 01 45 TYP pF See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 6 TABLE I. Electrical performance characteristi
26、cs - Continued. 1/ Test Symbol Conditions VCCTemperature, TADevice type Limits Unit Min Max Propagation delay time, A to Y tPLHSee figure 5 3.0 V and 3.6 V 25C 01 2.0 9.0 ns -55C to 125C 1.0 12.5 4.5 V and 5.5 V 25C 1.5 7.0 -55C to 125C 1.0 9.5 tPHLSee figure 5 3.0 V and 3.6 V 25C 2.0 9.0 -55C to 12
27、5C 1.0 12.0 4.5 V and 5.5 V 25C 1.5 7.0 -55C to 125C 1.0 9.0 Output enable time, OE to Y tPZHSee figure 5 3.0 V and 3.6 V 25C 01 2.0 10.5 ns -55C to 125C 1.0 11.5 4.5 V and 5.5 V 25C 1.5 7.0 -55C to 125C 1.0 9.0 tPZLSee figure 5 3.0 V and 3.6 V 25C 2.5 10.0 -55C to 125C 1.0 13.0 4.5 V and 5.5 V 25C
28、1.5 8.0 -55C to 125C 1.0 10.5 Output disable time, OE to Y tPHZSee figure 5 3.0 V and 3.6 V 25C 01 3.0 10.0 ns -55C to 125C 1.0 12.5 4.5 V and 5.5 V 25C 2.5 9.0 -55C to 125C 1.0 10.5 tPLZSee figure 5 3.0 V and 3.6 V 25C 2.5 10.5 -55C to 125C 1.0 13.0 4.5 V and 5.5 V 25C 2.0 9.0 -55C to 125C 1.0 11.0
29、 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of spe
30、cific parametric testing, product performance is assured by characterization and/or design. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 7 Case
31、 X Dimensions Symbol Millimeters Inches Symbol Millimeters Inches Min Max Min Max Min Max Min Max A - 2.65 - 0.104 E 7.39 7.59 0.291 0.299 A1 0.10 0.30 0.004 0.012 E1 10.15 10.65 0.400 0.419 b 0.35 0.51 0.014 0.020 e 1.27 NOM 0.050 NOM c 0.25 NOM 0.010 NOM L 0.40 1.27 0.016 0.050 D 12.70 12.95 0.500
32、 0.510 NOTES: 1. This drawing is subject to change without notice. 2. Body dimensions do not include mold flash or protrusion not to exceed 0.006 inches (0.15 mm). 3. Falls within JEDEC MS-013. 4. All linear dimensions are shown in inches (millimeters). Metric equivalents are given for general infor
33、mation only. FIGURE 1. Case outlines. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 8 Case Y Dimensions Symbol Millimeters Inches Symbol Millime
34、ters Inches Min Max Min Max Min Max Min Max A - 2.00 - 0.079 E 5.00 5.60 0.197 0.220 A1 0.05 0.15 0.002 0.006 E1 7.40 8.20 0.291 0.323 b 0.35 0.51 0.014 0.020 e 1.27 NOM 0.050 NOM c 0.15 NOM 0.006 NOM L 0.55 1.05 0.022 0.041 D 12.30 12.90 0.484 0.508 NOTES: 1. This drawing is subject to change witho
35、ut notice. 2. Body dimensions do not include mold flash or protrusion not to exceed 0.15 mm (0.006 inches). 3. All linear dimensions are shown in millimeters (inches). Inches equivalents are given for general information only. FIGURE 1. Case outlines - Continued. Provided by IHSNot for ResaleNo repr
36、oduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 9 (each buffer) Inputs Output OE A Y L L H H L X H L Z FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo
37、 reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 10 Case outlines: X and Y Terminal number Terminal symbol Terminal number Terminal symbol 1 1OE11 2A1 2 1A1 12 1Y4 3 2Y4 13 2A2 4
38、 1A2 14 1Y3 5 2Y3 15 2A3 6 1A3 16 1Y2 7 2Y2 17 2A4 8 1A4 18 1Y1 9 2Y1 19 2OE10 GND 20 VCCFIGURE 4. Terminal connections. NOTES: 1. CLincludes probe and jig capacitance. 2. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Wav
39、eform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. 3. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO= 50, tr 2.5 ns, tf 2.5 ns. 4. The outputs are measured one at a time with one
40、input transition per measurement. 5. For 3-state outputs tests: tPLH/tPHLS1 = Open tPLZ/tPZLS1 = 2 x VCCtPHZ/tPZHS1 = Open FIGURE 5. Timing waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS CO
41、LUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04622 REV B PAGE 11 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handlin
42、g of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electr
43、ostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacture
44、r reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply f
45、or the item. DLA Land and Maritime maintains an online database of all current sources of supply at http:/www.landandmaritime.dla.mil/Programs/Smcr/. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Vendor part number Top-Side Marking V62/04622-01XE 01295 SN74AC244M
46、DWREP SAC244MEP V62/04622-01YE 01295 SN74AC244MNSREP SAC244MEP 1/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. CAGE code Source of supply 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
