1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add device type 02 information. Update boilerplate. - CFS 07-05-08 Thomas M. Hess B Update boilerplate paragraphs to current requirements. - PHN 13-11-18 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLU
2、MBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Charles F. Saffle DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date o
3、f drawing CHECKED BY Charles F. Saffle TITLE MICROCIRCUIT, DIGITAL-LINEAR, HIGH-SPEED DIFFERENTIAL RECEIVER, MONOLITHIC SILICON YY-MM-DD 05-10-19 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/05614 REV B PAGE 1 OF 14 AMSC N/A 5962-V006-14 Provided by IHSNot for ResaleNo reprodu
4、ction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance high-speed differential receiver microcircuit
5、, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/0561
6、4 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device types. Device type Generic Circuit function 01 SN65LVDS33-EP High-speed differential receiver 02 SN65LVDT33-EP High-speed differential receiver 1.2.2 Case outlines. The case outlines are a
7、s specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 16 JEDEC MS-012 Plastic small-outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead pla
8、te C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 3 1.3 Absolute maximum ratings. 1/ 2/ S
9、upply voltage range (VCC) . -0.5 V to +4 V 2/ Voltage range: Enables or Y -1 V to +6 V A or B -5 V to +6 V |VA VB| (Device 02 only) . 1 V Electrostatic discharge: A, B, and GND Class 3, A: 15 kV, B: 500 V 3/ Charged-device mode: All pins 500 V 4/ Continuous power dissipation: TA 25C power rating 950
10、 mW TA= 85C power rating 494 mW TA= 125C power rating 189 mW Operating factor above TA= 25C . 7.6 mW/C 5/ Storage temperature range (TSTG) . -65C to +150C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds +260C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +3 V to +3.
11、6 V High-level input voltage (Enables) (VIH) +2 V to +5 V Low-level input voltage (Enables) (VIL) 0 V to +0.8 V Magnitude of differential input voltage (|VID|): Device type 01 +0.1 V to +3 V Device type 02 0.8 V maximum Voltage at any bus terminal (separately or common-mode) (VIor VIC) -4 V to +5 V
12、Operating free-air temperature range (TA) -55C to +125C _ 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “re
13、commended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. 3/ Tested in accordance with JEDEC Standard 22,
14、Test Method A114 (JESD 22-A114). 4/ Tested in accordance with JEDEC Standard 22, Test Method C101 (JESD 22-C101). 5/ This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. Provided by IHSNot for ResaleNo reproduction or networking permitted without
15、 license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 4 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices JESD 22-A114 Electrostatic Dischar
16、ge (ESD) Sensitivity Testing Human Body Model (HBM) JESD 22-C101 Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology A
17、ssociation, 3103 North 10th Street, Suite 240S, Arlington, VA 22201-2107). 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identi
18、fication (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in
19、1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1. 3.5.2 Logic diagram and function table. The logic d
20、iagram and function table shall be as shown in figure 2. 3.5.3 Terminal connections. The terminal connections shall be as shown in figure 3. 3.5.4 Switching waveforms and test circuits. The switching waveforms and test circuits shall be as shown in figures 4a 4f. Provided by IHSNot for ResaleNo repr
21、oduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Test conditions unless otherwise specified Device type Limits Unit M
22、in Typ Max Electrical Characteristics 2/ Positive-going differential input voltage threshold VIT1VIB = -4 V or 5 V See figures 4a and 4b. All 50 mV Negative-going differential input voltage threshold VIT2-50 mV Differential input failsafe voltage threshold VIT3See figures 4a and 4e. -32 -100 mW Diff
23、erential input voltage hysteresis, VIT1 VIT2VID(HYS)50 mV High-level output voltage VOHIOH= -4 mA 2.4 V Low-level output voltage VOLIOL= 4 mA 0.4 V Supply current ICCG at VCC, No load, Steady state All 16 25 mA G at GND 1.1 6 Input current (A or B inputs) IIVI= 0 V, Other input open. 01 25 A VI= 2.4
24、 V, Other input open. 25 VI= -4 V, Other input open. 80 VI= 5 V, Other input open. 45 VI= 0 V, Other input open. 02 50 VI= 2.4 V, Other input open. 50 VI= -4 V, Other input open. 180 VI= 5 V, Other input open. 95 Differential input current (IIA IIB) IIOVID= 100 mV, VIC= -4 V or 5 V 01 5 A VID= 200 m
25、V, VIC= -4 V or 5 V 02 1.55 2.4 mA Power-off input current (A or B inputs) II(OFF)VAor VB= 0 V or 2.4 V, VCC= 0 V 01 25 A VAor VB= -4 V or 5 V, VCC= 0 V 60 VAor VB= 0 V or 2.4 V, VCC= 0 V 02 35 VAor VB= -4 V or 5 V, VCC= 0 V 120 High-level input current (Enables) IIHVIH= 2 V All 12 A Low-level input
26、 current (Enables) IILVIL= 0.8 V 12 A High-impedance output current IOZ-10 12 A Input capacitance, A or B input to GND CIVI= 0.4 sin (4E6t) + 0.5 V 5 pF See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CEN
27、TER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 6 TABLE I. Electrical performance characteristics - Continued. 1/ Test Symbol Test conditions unless otherwise specified Device type Limits Unit Min Typ Max Switching Characteristics 2/ Propagation delay time, low-
28、to-high level output tPLH(1)See figures 4a and 4c. All 1.8 4 8 ns Propagation delay time, high-to-low level output tPHL(1)1.8 4 8 ns Delay time, failsafe deactivate time td1CL= 10 pF See figures 4a, 4c, and 4f. 11 ns Delay time, failsafe activate time td20.2 2 s Pulse skew (|tPHL(1) tPLH(1)|) tsk(p)
29、See figures 4a and 4c. 200 ps Output skew tsk(o)3/ 150 ps Part-to-part skew tsk(pp)4/ 1.2 ns Output signal rise time tr0.8 ns Output signal fall time tf0.8 ns Propagation delay time, high level-to-high impedance output tPHZSee figure 4d. 5.5 12 ns Propagation delay time, low level-to-high impedance
30、output tPLZ4.4 12 ns Propagation delay time, high impedance-to-high level output tPZH3.8 12 ns Propagation delay time, high impedance-to-low level output tPZL7 12 ns 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specifi
31、ed temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ All typical (Typ) values are at TA= 25C
32、and with a 3.3-V supply. All minimum (Min) values and maximum (Max) values are over the recommended operating full temperature range of -55C to +125C, unless otherwise specified. 3/ tsk(o)is the magnitude of the time difference between the tPLHor tPHLof all receivers of a single device with all of t
33、heir inputs driven together. 4/ tsk(pp)is the magnitude of the time difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. Provided by IHSNot
34、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 7 Case X Dimensions Symbol Inches Millimeters Symbol Inches Millimeters Min Max Min Max Min Max Min Max A - 0.069 -
35、1.75 E 0.150 0.157 3.80 4.00 A1 0.004 0.010 0.10 0.25 E1 0.228 0.244 5.80 6.20 b 0.012 0.020 0.31 0.51 e 0.050 BSC 1.27 BSC c 0.007 0.010 0.17 0.25 L 0.016 0.050 0.40 1.27 D 0.386 0.394 9.80 10.00 NOTES: 1. All linear dimensions are in inches (millimeters). 2. This drawing is subject to change witho
36、ut notice. 3. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0.15). 4. This package is designed to be soldered to a thermal pad on the board. 5. Falls within JEDEC MS-012 variation AC. FIGURE 1. Case outlines. Provided by IHSNot for ResaleNo reproduction or networking p
37、ermitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 8 Function table. Device types: 01 and 02 Differential Input Enables Output VID= VA- VBG G Y VID -32 mV H X H X L H -100 mV VID -32 mV H X ? X L ? VID -100 mV
38、 H X L X L L X L H Z Open H X H X L H H = high level, L = low level, X = irrelevant, Z = high impedance (off), ? = indeterminate FIGURE 2. Logic diagram and function table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMB
39、US COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 9 Device types: 01 and 02 Case outline: X Terminal number Terminal symbol Terminal number Terminal symbol 1 1B 9 3B 2 1A 10 3A 3 1Y 11 3Y 4 G 12 G 5 2Y 13 4Y 6 2A 14 4A 7 2B 15 4B 8 GND 16 VCCFIGURE 3. Terminal connections. F
40、IGURE 4a. Switching waveforms and test circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 10 FIGURE 4b. Switching waveforms and test circui
41、ts. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 11 NOTE: All input pulses are supplied by a generator having the following characteristics: tr
42、or tf 1 ns, pulse repetition rate (PRR) = 50 Mpps, pulsewidth = 10 0.2 ns. CLincludes instrumentation and fixture capacitance within 0.06 mm of the D.U.T. FIGURE 4c. Switching waveforms and test circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,
43、-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 REV B PAGE 12 NOTE: All input pulses are supplied by a generator having the following characteristics: tror tf 1 ns, pulse repetition rate (PRR) = 0.5 Mpps, pulsewidth = 500 10 ns. CLincludes instrumentat
44、ion and fixture capacitance within 0.06 mm of the D.U.T. FIGURE 4d. Switching waveforms and test circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05614 RE
45、V B PAGE 13 FIGURE 4e. Switching waveforms and test circuits. FIGURE 4f. Switching waveforms and test circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/056
46、14 REV B PAGE 14 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, pa
47、ckaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data
