1、 REVISIONSLTR DESCRIPTION DATE APPROVEDA Make addition to paragraph 2. Make change to to the min limit of dimension “c” and notes specified under figure 1. Update boilerplate paragraph to current requirements. - ro 11-11-14 C. SAFFLE CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA
2、LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original dat
3、e of drawing YY-MM-DD CHECKED BY TOM HESS TITLE MICROCIRCUIT, LINEAR, DUAL OPERATIONAL AMPLIFIER, MONOLITHIC SILICON 06-11-13 APPROVED BY RAYMOND MONNIN SIZE A CODE IDENT. NO. 16236 DWG NO. V62/07605 REV A PAGE 1 OF 11 AMSC N/A 5962-V004-12 Provided by IHSNot for ResaleNo reproduction or networking
4、permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance dual operational amplifier microcircuit, with an operating temper
5、ature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/07605 - 01 X E Drawing Device
6、type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 LM258A-EP Dual operational amplifier1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 8
7、MS-012-AA Plastic surface mount1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other Provided by IHSNot for ResaleNo
8、 reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (VDD) . 16.5 V or 32 V 2/ Differential input voltage (VID) 32 V 3/ Input
9、voltage (VI) (either input) . -0.3 V to 32 V Duration of output short circuit (one amplifier) to ground at (or below) 25C free-air temperature (VCC 15 V) Unlimited 4/ Package thermal impedance (JA) . 97C/W 5/ 6/ Operating virtual junction temperature (TJ) +150C Storage temperature range (TSTG) -65C
10、to +150C 7/ 1.4 Recommended operating conditions. 8/ Supply voltage range (VCC) . 5 V Operating free-air temperature range (TA) . -55C to +125C 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional oper
11、ation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltage values, except differential voltages and VCCspecified
12、for measurement of IOS, are with respect to the network ground terminal. 3/ Differential voltages are at IN+ with respect to IN-. 4/ Short circuits from outputs to VCCcan cause excessive heating and eventual destruction. 5/ Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum
13、allowable power dissipation at any allowable ambient temperature is PD= ( TJ(max) TA) / JA. Operating at the absolute maximum TJof 150C can affect reliability. 6/ The package thermal impedance is calculated in accordance with JESD 51-7. 7/ Long term high temperature storage and/or extended use at ma
14、ximum recommended operating conditions may result in a reduction of overall device life. See manufacturers datasheet or additional information on enhanced plastic packaging. 8/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer
15、and/or distributor maintain no responsibility or liability for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A P
16、AGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices EIA/JEDEC 51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the JEDEC Office, 3103 North 10th Street, Suite 240-S,
17、 Arlington, VA 22201-2107 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optio
18、nal) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and t
19、able I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as sho
20、wn in figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions 2/ VC
21、C= 5 V unless otherwise specified Temperature, TADevice type Limits Unit Min Max Input offset voltage VIOVCC= 5 V to 30 V, 25C 01 3 mV VIC= VICR(min), VO= 1.4 V -55C to +125C 4 Average temperature coefficient of input offset voltage VIO-55C to +125C 01 15 V/C Input offset current IIOVO= 1.4 V 25C 01
22、 15 nA -55C to +125C 30 Average temperature coefficient of input offset current IIO-55C to +125C 01 200 pA/C Input bias current IIBVO= 1.4 V 25C 01 -80 nA -55C to +125C -100 Common mode input voltage range VICRVCC= 5 V to max 25C 01 0 to VCC 1.5 V -55C to +125C 0 to VCC 2 High level output voltage V
23、OHRL 2 k 25C 01 VCC 1.5 V VCC= 30 V, RL= 2 k -55C to +125C 26 VCC= 30 V, RL 10 k -55C to +125C 27 Low level output voltage VOLRL 10 k -55C to +125C 01 20 mV Large signal differential voltage amplification AVDVCC= 15 V, RL 2 k, 25C 01 50 V/mV VO= 1 V to 11 V -55C to +125C 25 Common mode rejection rat
24、io CMRR VCC= 5 V to max, VIC= VICR(min)25C 01 70 dB See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 6 TABLE I. Elec
25、trical performance characteristics - Continued. 1/ Test Symbol Conditions 2/ VCC= 5 V unless otherwise specified Temperature, TADevice type Limits Unit Min Max Supply voltage rejection ratio ( VDD/ VIO) kSVRVCC= 5 V to max 25C 01 65 dB Crosstalk attenuation VO1/ VO2f = 1 kHz to 20 kHz 25C 01 120 typ
26、ical dB Output current IOSource, VCC= 15 V, 25C 01 -20 mA VID= 1 V, VO= 0 -55C to +125C -10 Sink, VCC= 15 V, 25C 10 VID= -1 V, VO= 15 V -55C to +125C 5 VID= -1 V, VO= 200 mV 25C 12 A Short circuit output current IOSVCCat 5 V, GND at -5 V, VO= 0 25C 01 60 mA Supply current ICCVO= 2.5 V, no load -55C
27、to +125C 01 1.2 mA (two amplifiers) VCC= max, VO= VCC/2, no load -55C to +125C 2 Slew rate at unity gain SR RL= 1 M, CL= 30 pF, VI= 10 V, see figure 3 25C 01 0.3 typical V/s Unity gain bandwidth B1RL= 1 M, CL= 20 pF, see figure 3 25C 01 0.7 typical MHz Equivalent input noise voltage VnRS= 100 , VIN=
28、 0 V, f = 1 kHz, see figure 4 25C 01 40 typical nV / Hz 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all paramete
29、rs may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ All characteristics are measured under open loop conditions with zero common mode input voltage, unless otherwise specified. Maximum VCCfor testing pu
30、rposes is 30 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 7 Case X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or n
31、etworking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 8 Case X - continued Symbol Dimensions Inches Millimeters Min Max Min Max A - 0.069 - 1.75 A1 0.004 0.010 0.10 0.25 b 0.012 0.020 0.31 0.51 c 0.005
32、 0.010 0.13 0.25 D 0.189 0.197 4.80 5.00 E 0.150 0.157 3.80 4.00 E1 0.228 0.244 5.80 6.20 e 0.050 BSC 1.27 BSC L 0.016 0.050 0.40 1.27 n 8 8 NOTES: 1. Controlling dimensions are inch, millimeter dimensions are given for reference only. 2. For dimension D, body length does not include mold flash, pro
33、trusion, or gate burrs. Mold flash, protrusion, or gate burrs shall not exceed 0.006 inch (0.15 mm) each side. 3. For dimension E, body width does not include interlead flash. Interlead flash shall not exceed 0.017 inch (0.43 mm) each side. 4. Falls with JEDEC MS-012 variation AA. FIGURE 1. Case out
34、line Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 9 Device type 01 Case outline X Terminal number Terminal symbol 1 1 OUT2 1 IN- 3 1
35、 IN+ 4 GND 5 2 IN+ 6 2 IN- 7 2 OUT 8 VCCFIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 10 FIGURE 4. Noise test ci
36、rcuit. FIGURE 3. Unity gain amplifier. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07605 REV A PAGE 11 4. VERIFICATION 4.1 Product assurance requirements. The
37、manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PR
38、EPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS
39、class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(
40、s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code VIOmax at +25C Max tested VCCPack
41、age Top side marking Vendor part number V62/07605-01XE 01295 3 mV 30 V Reel of 2500 258AM LM258AMDREP 1/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. 2/ Package drawings, standard packaging quantities, thermal data, s
42、ymbolization, and PCB design guidelines are available at CAGE code Source of supply 01295 Texas Instruments, Inc. Semiconductor Group8505 Forest Ln. PO Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
