1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add a SCLK frequency test under Table I. - ro 09-07-22 C. SAFFLE B Under paragraph 1.5, footnote 8/, delete the effective dose rate of “0.16 rad(Si)/s” and substitute “0.027 rad(Si)/s”. Add supply current limits to Table IIB. - ro 10-05-06 C. SAF
2、FLE C Under Table IA, make correction to full scale output test by moving all limits from the maximum column to the minimum limit column. Make change to footnote 1/ under Table IIB. - ro 10-06-23 C. SAFFLE D Add device type 02. - ro 12-05-08 C. SAFFLE REV SHEET REV D D D D SHEET 15 16 17 18 REV STAT
3、US REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF T
4、HE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY ROBERT M. HEBER MICROCIRCUIT, DIGITAL-LINEAR, CMOS, 12 BIT, DIGITAL-TO-ANALOG CONVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 09-02-12 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-07226 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5
5、962-E283-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07226 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two
6、product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance
7、 (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 R 07226 01 V Z A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing numbe
8、r 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designat
9、or. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 DAC121S101 12 bit digital-to-analog converter 02 DAC121S101 12 bit digital-to-analog converter 1.2.3 Device class designator. T
10、he device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
11、 Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Z GDFP1-G10 10 Flat pack with gullwing leads 1.2.5 Lead finish. The lead finish is as sp
12、ecified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07226 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVIS
13、ION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage (VA) . +6.5 V Voltage on any input pin . -0.3 V to ( VA+ 0.3 V ) Input current at any pin . 10 mA 3/ Maximum output current . 10 mA 4/ VOUTpin in powerdown (PD) mode 1.0 mA Package input current . 20 mA 3/ P
14、ower dissipation (PD) at TA= +25C See footnote 5/ Maximum junction temperature (TJ) +175C Lead temperature (soldering, 10 seconds) +260C Storage temperature range . -65C to +150C Electrostatic discharge (ESD) tolerance . 4,000 V 6/ Thermal resistance, junction-to-case (JC) . 25.7C/W Thermal resistan
15、ce, junction-to-ambient (JA) 214C/W (still air) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are measured with respect to
16、GND = 0 V. 3/ When the input voltage at any pin exceeds the power supplies ( less than GND or greater than VA), the current at that pin should be limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current
17、 of 10 mA to two. 4/ Maximum output current may not exceed 10 mA. At VDD= 5.5 V, the minimum external resistive load can be no less than 550 , (360 at VDD= 3.6 V). 5/ The absolute maximum junction temperature ( TJmax ) for this device is 175C. The maximum power dissipation is dictated by TJMAX, the
18、junction to ambient thermal resistance ( JA), and the ambient temperature( TA) and can be calculated using the formula PDmax = (TJMAX- TA) / JA. The values for maximum power dissipation will be reached only when the device is operated in a severe fault condition (for example, when input or output pi
19、ns are driven beyond the power supply voltages, or the power supply polarity is reversed). These conditions should be avoided. 6/ Human body model (HBM) is 100 pF capacitor discharged through a 1.5 k resistor. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
20、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07226 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. 1/ 2/ Supply voltage range (VA) +2.7 V to +5.5 V Any input voltage -0.1 V to ( VA+ 0.1 V ) 7/ Output load capac
21、itance . 0 to 1500 pF Select clock (SCLK) frequency . Up to 20 MHz Ambient operating temperature (TA) . -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads(Si)/s): Device type 01 . 100 krads(Si) 8/ Maximum total dose available (dose rate = 10 mrads(Si)/s): Dev
22、ice type 02 . 100 krads(Si) 9/ No single event latch-up (SEL) occurs at effective LET (see 4.4.4.2) . 120 MeV/(mg/cm2) 10/ _ 7/ The analog inputs are protected as shown below. Input voltage magnitudes up to VA+ 300 mV or to 300 mV below GND will not damage this device. However, errors in the convers
23、ion result can occur if any input goes above VAor below GND by more than 100 mV. For example, if VAis 2.7 VDC, ensure that -100 mV input voltages 2.8 VDCto ensure accurate conversions. 8/ Device type 01 is irradiated at dose rate = 50 - 300 rads(Si)/s in accordance with MIL-STD-883, method 1019, con
24、dition A, and is guaranteed to a maximum total dose specified. The effective dose rate after extended room temperature anneal = 0.027 rad(Si)/s per MIL-STD-883, method 1019, condition A, section 3.11.2. The total dose specification for this device only applies to the specified effective dose rate, o
25、r lower, environment. 9/ For device type 02, radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition D. 10/ Limits are based on characterization, but not production tested unless specified on the purchase order or
26、 contract. See table IB. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07226 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Govern
27、ment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATI
28、ON MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Mi
29、crocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publicatio
30、ns. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation. ASTM INTERNATIONAL (ASTM) ASTM F1192 Standard Guide for the Measurement of Single Event Phenom
31、ena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of this document is available online at http:/www.astm.org/ or from ASTM International, P.O. Box C700, 100 Bar Harbor Drive, West Conshohocken, PA 19428-2959). 2.3 Order of precedence. In the event of a conflict between the
32、 text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for d
33、evice classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device c
34、lass M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or
35、 MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Input / output transfer characteristics. The input / output transfer
36、characteristics diagram shall as specified on figure 2. 3.2.4 Timing waveforms. The timing waveforms shall be as specified on figure 3. 3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made ava
37、ilable to the preparing and acquiring activity upon request. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07226 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 9
38、7 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full ambient operating temperature range. 3.4 El
39、ectrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked.
40、For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in acco
41、rdance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a
42、“C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
43、compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manuf
44、acturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or fo
45、r device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to t
46、his drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documen
47、tation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 56 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleN
48、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07226 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Static performance. See figure 2. Integral non-linearity INL Over decimal codes 48 to 4047 1,2,3 01, 02 -8.0 +8.0 LSB Differential non-linearity DNL VA= 2.7 V to 5.5 V 1,2,3 01, 02 -0.7 +1.0
