1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve L.Duncan DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ STANDARD MICROCIRCUIT DRAWING THIS DRAWING
2、 IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Greg Cecil APPROVED BY Charles F. Saffle MICROCIRCUIT, CMOS, OPERATIONAL AMPLIFIER, QUAD, MONOLITHIC SILICON DRAWING APPROVAL DATE 13-03-26 AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-10241 SHEET 1
3、OF 15 DSCC FORM 2233 APR 97 5962-E334-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10241 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope.
4、This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflec
5、ted in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 H 10241 01 K X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation
6、 hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Ge
7、neric number Circuit function 01 RHD5900 Quad operational amplifier 02 RHD5901 Quad operational amplifier, Hi-Z output control 03 RHD5902 Quad operational amplifier, High speed, Hi-Z output control 1.2.3 Device class designator. This device class designator shall be a single letter identifying the p
8、roduct assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliabil
9、ity class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses
10、the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other
11、classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufac
12、turer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10
13、241 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 16 Flat package with formed leads
14、 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) . +7.0 V dc Input voltage (VIN) range . VCC+0.4 V, VEE-0.4 V Junction temperature (TJ) . +150C Power +25C 200 mW Thermal resistance, Junction to Case (JC) 7 C/W Storage t
15、emperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C 1.4 Recommended operating conditions. Supply voltage (VCC) range +3.0 V dc to +5.5 V dc Input Common Mode (VCM) range VCCto VEECase operating temperature range (TC) . -55C to +125C 1.5 Radiation features. 2/ Maximum To
16、tal Ionizing Dose (TID) (dose rate = 50 - 300 rad(Si)/s): In accordance with MIL-STD-883, method 1019, condition A 1 Mrad(Si) Enhanced Low Dose Rate Sensitvity (ELDRS) . 3/ Single Event Phenomenon (SEP) effective linear energy transfer (LET): No Single Event Latchup (SEL) . 100 MeV-cm2/mg 4/ 5/ Sing
17、le Event Transient (SET) 59 MeV-cm2/mg 4/ 5/ Neutron Displacement Damage ( 1 x 1014 neutrons/cm2) . 3/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unl
18、ess otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835
19、 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. _ 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended oper
20、ation at the maximum levels may degrade performance and affect reliability. 2/ See section 4.3.5 for the manufacturers radiation hardness assurance analysis and testing. 3/ Not tested, Immune by 100 percent CMOS technology. 4/ Single event testing performed at 100 Mev-cm2/mg with no latch-up and up
21、to 59 Mev-cm2/mg with single event transients (voltage) limited as specified in Table IB. 5/ See table IB. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10241 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990
22、 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following documents
23、 form a part of this document to the extent specified herein. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of these documents are available online a
24、t http:/www.astm.org or from the American Society for Testing and Materials, P O Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes pre
25、cedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Co
26、mpliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the p
27、erformance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, con
28、struction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and and as specified on figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Lo
29、gic diagram(s). The logic diagram(s) shall be as specified on figure 3. 3.2.4 Switching diagram(s). The switching diagram(s) shall be as specified on figure 4. 3.2.5 Radiation exposure circuits. The radiation exposure circuits shall be maintained by the manufacturer under document revision level con
30、trol and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table IA and shall apply over the full specified operating temperature
31、range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table IA. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
32、 with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from th
33、e initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufact
34、urer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and
35、Maritime -VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. Provided by I
36、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10241 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 5 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test Symbol Conditions -
37、55C TC +125C VCC= +5.0 V, VEE= GND Group A subgroups Device types Limits Unit unless otherwise specified Min Max Input offset voltage 1/ VOS 1,2,3 01,02 -3 3 mV 03 -4 4 Input offset current 1/ IOS1,2,3 All -100 100 pA Input bias current 1/ IB1,3 All -100 100 pA 2 -1 1 nA Common Mode Rejection Ratio
38、CMRR 4,5,6 01,02 70 dB 03 60 Power supply rejection ratio PSRR 4,5,6 All 70 dB Output voltage high VOHROUT= 3.6 k to GND 1,2,3 All 4.90 V Output voltage low VOLROUT= 3.6 k to VCC1,2,3 All 0.1 V Short circuit output current 2/ IO(SINK) VOUTto VCC 1,2,3 01,02 -30 -75 mA 03 -130 -290 IO(SOURCE) VOUTto
39、VEE01,02 45 55 03 110 210 Slew rate 1/ SR RL= 8 k, Gain = +1 9,10,11 01,02 2.0 V/s 03 12.0 Open loop gain 1/ AOL RL= 100 k 4,5,6 All 90 dB Unity gain bandwidth 1/ UGBW RL= 10 k 4,5,6 01,02 4 MHz 03 23 Quiescent supply current 1/ ICCQAll amplifiers enabled, no loads 1,2,3 All 5.5 mA All amplifiers di
40、sabled 02,03 300 nA Channel separation 2/ CHSEP RL= 2 k, f = 1.0 kHz 4,5,6 All 84 dB Enable input voltage high 2/ VHI HI = enabled 1,2,3 02,03 3.5 V Enable input voltage low 2/ VLO LO = disabled 1,2,3 02,03 1.5V Enable input current 2/ IEN1,2,3 02,03 10 nA Output enable delay 2/ tONEN See figure 4 9
41、,10,11 02,03 500 ns Output disable delay 2/ tOFFEN 9,10,11 02,03 100 ns 1/ These devices have been tested to (2 Mrad(Si) to Method 1019, condition A of MIL-STD-883 at +25C for these parameters to assure the requirements of RHA designator level “H” (1Mrad(Si) are met. 2/ Not tested. Shall be guarante
42、ed by design, characterization, or correlation to other test parameters. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10241 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 6 DSCC FORM
43、2234 APR 97 TABLE IB. SEP test limits. 1/ Device types SEP Temperature (TC) Conditions Results Effective linear energy transfer (LET) 01,02,03 SEL +125C VCC= +5.5 V and VEE= +0 V No SEL 100 MeV-cm2/mg VCC= +2.75 V and VEE= -2.75 V No SEL 01,02,03 SET (transient voltage) +25C VCC= +5.0 V and VEE= +0
44、V Maximum voltage 240 mV Maximum duration 3.5 S 59 MeV-cm2/mg VCC= +2.5 V and VEE= -2.5 V Maximum voltage 240 mV Maximum duration 4.0 S 1/ For SEP test conditions, see 4.3.5.1.2.2 herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO
45、CIRCUIT DRAWING SIZE A 5962-10241 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 Case X Symbol Inches Millimeters Min Max Min Max A .105 2.68 A1 .030 REF 0.76 REF A2 .017 .027 0.43 0.69 A3 .012 0.30 b .015 .019 0.38 0.48 c .007 .009 0.18 0.23 D .417 10.5
46、9 e .050 BSC 1.27 BSC e1 .350 BSC 8.90 BSC E .300 7.62 E1 .394 .419 10.01 10.64 E2 .346 REF 8.79 REF NOTE: 1. Location of the pin 1 marking. The ESD symbol may be used as the pin 1 marking. 2. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
47、 measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 3. Package and lid are electrically isolated from signal pads. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license
48、from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10241 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 8 DSCC FORM 2234 APR 97 Device types 01 02 and 03 Case outline X Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 OUT_A -IN_A +IN_A VCC+IN_B -IN_B OUT_B NC_GND (See note 1) NC_GND (See note 1) OUT_C -IN_C +IN_C VEE+IN_D -IN_D OUT_D OUT_A -IN_A +IN_A VCC+IN_B -IN_B OUT_B EN_AB (See note 2) EN_CD (See note 2) OUT_C -IN_C +IN_C VEE+IN_D -IN_D OUT_D NOTE: 1. NC_GND (pins 8 a
