1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Convert to SMD format. Added device type 02. Technical changes to 1.3, 1.4, Table I and Table II. Editorial changes throughout. 92-01-23 Monica L. Poelking E Update boilerplate to MIL-PRF-38535 requirements. jak 01-02-23 Thomas M. Hess F Made cha
2、nge to paragraph 3.5. Update boilerplate to MIL-PRF-38535 requirements. LTG 05-03-14 Thomas M. Hess G Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 11-04-21 David J. Corbett CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV G G G G G G G G G G OF SHEETS SHEET
3、1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY A. J. Foley DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY C. R. Jackson APPROVED BY Nels
4、on A. Hauck MICROCIRCUIT, DIGITAL, CMOS, QUAD 2-INPUT AND GATE, MONOLITHIC SILICON DRAWING APPROVAL DATE 77-09-13 REVISION LEVEL G SIZE A CAGE CODE 14933 77024 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E281-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
5、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38
6、535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 77024 01 C A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device ty
7、pe Generic number Circuit function 01 4081B Quad 2-input AND gate 02 4081B Quad 2-input AND gate 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1
8、-F14 or CDFP2-F14 14 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VDD) device type 01 -0.5 V dc to +18.0 V dc 2/ Supply voltage range (VDD) device type 02 -0.5 V dc to +20.0 V dc 2/ Input voltage ran
9、ge -0.5 V dc to VDD+ 0.5 V dc DC input current (any one input) 10 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW 3/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +17
10、5C 1.4 Recommended operating conditions. Supply voltage range (VDD) device type 01 +3.0 V dc to +15.0 V dc Supply voltage range (VDD) device type 02 +3.0 V dc to +18.0 V dc Minimum low level input voltage (VIH) 3.5 V dc at VDD= 5.0 V dc Maximum low level input voltage (VIL):. 1.5 V dc at VDD= 5.0 V
11、dc Case operating temperature range (TC) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Voltages referenced to the VSSterminal. 3/ For TA= +100C to +125C
12、, derate linearly at 12 mW/C to 200 mW. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS
13、2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE S
14、PECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of S
15、tandard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of preced
16、ence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirem
17、ents. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who
18、has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifica
19、tions to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
20、3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections sh
21、all be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms. The switching waveforms shall be as specified on figure 4. Provided by IHSNot for ResaleNo repro
22、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical perform
23、ance characteristics are as specified in table I and shall apply over the full (case or ambient) operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table
24、 I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). 3.5.1 Certification/compliance mark. A compliance indicator “C
25、” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate
26、 of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers produ
27、ct meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notificati
28、on of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documenta
29、tion. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SH
30、EET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C unless otherwise specified Device type Group A subgroups Limits Unit Min Max High-level output voltage VOHVDD= 5.0 V 1/ VIN= 0.0 V or VDDAll 1, 2, 3 4.95 V VDD= 10.0 V 1/ VIN= 0.0 V
31、 or VDDAll 1, 2, 3 9.95 VDD= 15.0 V. VIN= 0.0 V or VDDAll 1, 2, 3 14.95 Low level output voltage VOLVDD= 5.0 V 1/ VIN= VDDor 0.0 V All 1, 2, 3 0.05 V VDD= 10.0 V 1/ VIN= VDDor 0.0 V All 1, 2, 3 0.05 VDD= 15.0 V, VDDor 0.0 V All 1, 2, 3 0.05 High-level input voltage VIHVDD= 5.0 V, VO= 4.5 V or 0.5 V
32、All 1, 2, 3 3.5 V VDD= 10.0 V 1/ VO= 9.0 V or 1.0 V All 1, 2, 3 7.0 VDD= 15.0 V, VO= 13.5 V or 1.5 V All 1, 2, 3 11.0 Low level input voltage VILVDD= 5.0 V, VIN= 4.5 V or 0.5 V All 1, 2, 3 1.5 V VDD= 10.0 V 1/ VIN= 9.0 V or 1.0 V All 1, 2, 3 3.0 VDD= 15.0 V, VIN= 13.5 V or 1.5 V All 1, 2, 3 4.0 High
33、-level output current IOH2/ VOH= 4.6 V, VDD= 5.0 V All 1, 2, 3 -0.36 mA VOH= 9.5 V, VDD= 10.0 V -0.9 VOH= 13.5 V, VDD= 15.0 V -2.4 Low-level output current IOL2/ VOH= 0.4 V, VDD= 5.0 V All 1, 2, 3 0.36 mA VOH= 0.5 V, VDD= 10.0 V 0.9 VOH= 1.5 V, VDD= 15.0 V 2.4 Input current IINVDD= 15.0 V 01 1, 2, 3
34、 1.0 A VDD= 18.0 V 02 1.0 Input capacitance CINVIN= 0.0 V, See 4.3.1b All 4 7.5 pF Quiescent current IDDVDD= 5.0 V 1/ All 1, 2, 3 7.5 A VDD= 10.0 V 1/ 1, 2, 3 15.0 VDD= 15.0 V 1/ 1, 2, 3 30.0 VDD= 20.0 V 3/ 02 1, 2, 3 150.0 Functional tests See 4.3.1c All 7, 8 See footnotes at end of table. Provided
35、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol T
36、est conditions -55C TC +125C unless otherwise specified Device type Group A subgroups Limits Unit Min Max Propagation delay time tPHL, tPLHCL= 50 pF min RL= 200 k See figure 4 VDD= 5.0 V All 9 250.0 ns VDD= 10.0 V 1/ 120.0VDD= 15.0 V 1 90.0VDD= 5.0 V 1/ 10, 11 375.0 VDD= 10.0 V 1/ 180.0VDD= 15.0 V 1
37、 135.0Transition time tTHL, tTLHCL= 50 pF min RL= 200 k See figure 4 VDD= 5.0 V All 9 200.0 ns VDD= 10.0 V 1/ 100.0VDD= 15.0 V 1 80.0VDD= 5.0 V 1/ 10, 11 300.0 VDD= 10.0 V 1/ 150.0VDD= 15.0 V 1 120.01/ This condition is guaranteed, if not tested, to the specified limits in table I. 2/ This parameter
38、 is guaranteed, if not tested, for subgroups 2 and 3. 3/ This parameter is tested at VDD= 18 V for subgroup 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990
39、REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Device type All Case outlines C, D Terminal number Terminal symbol 1 A 2 B 3 J 4 K 5 C 6 D 7 VSS8 E 9 F 10 L 11 M 12 G 13 H 14 VDDFIGURE 1. Terminal connections. Inputs Output A B J L H L H L L H H L L L H H = High voltage level L = Low voltage level FI
40、GURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 One of four identical gates. FIGURE 3. Logi
41、c diagram. INPUT PULSE VGEN= VDD1.0% Pulse width = 1.0 0.1 s tr= tf=20 2.0 ns PRR = 200 kHz FIGURE 4. Switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77024 DLA LAND AND MARITIME COLUMBUS, OHIO
42、 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on
43、 all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made availab
44、le to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters sha
45、ll be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electri
46、cal parameters (method 5004) - - - Final electrical test parameters (method 5004) 1, 2, 3, 7, 9 1/ Group A test requirements (method 5005) 1, 2, 3, 4, 7, 8, 9, 10, 11 2/ Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 1/ PDA applies to subgroup 1. 2/ Subgroups 10 and 11, if not
47、tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspecti
48、on. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CINmeasurement) shall be measured only for the initial test and after process or design changes which may affect input capacitance. Capacitance shall be measured between the designated terminal and VSSat a frequency of 1 MHz. Test all applicable pins on 5 devices with zero failures. d. Subgroups 7 and 8 shall include verification of the truth table as specified on figure 2. Provided by IHSN
