DLA SMD-5962-77030 REV C-2009 MICROCIRCUIT DIGITAL TTL 6-BIT BINARY TO BCD CONVERTER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Table I electrical corrections, convert to approve source. Editorial changes throughout. 83-09-01 N. A. Hauck B Remove vendor - FSCM: 27014. Add vendor - FSCM: 01295. Add case 2. Change CLfor ac tests to 30 pF and RLto 300 . - DQ 84-10-04 N. A. H

2、auck C Update drawing to current requirements. Change CAGE code to 67268. Editorial changes throughout. - gap 09-11-12 Charles F. Saffle Current CAGE is 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8

3、PMIC N/A PREPARED BY A. J. Foley DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY C. R. Jackson APPROVED BY N. A. Hauck MICROCIRCUIT,

4、 DIGITAL, TTL, 6-BIT BINARY TO BCD CONVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 77-09-26 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 77030 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E364-09Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAN

5、DARD MICROCIRCUIT DRAWING SIZE A 77030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3853

6、5, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 77030 01 E X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2)Lead finish (see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device typ

7、e Generic number Circuit function 01 54185A 6-bit binary-to-BCD converter 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line package F GDFP2-F16 or CDFP3-F

8、16 16 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . 7 V dc Input voltage 5.5 V dc Storage temperature range . -65C to +150C Lead temperature (soldering 10 seconds) . +300

9、C Thermal resistance, junction to case JC See MIL-STD-1835 Junction temperature TJ. +175C 1.4 Recommended operating conditions. Supply voltage, (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Low level output current (IOL) . 12 mA dc Case operating temperature range (TC) -55C to +125C Provided by IHSNo

10、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and han

11、dbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits

12、, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - St

13、andard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text

14、 of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be i

15、n accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MI

16、L-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modificat

17、ions shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions

18、. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tabl

19、e. The truth table shall be as specified on figure . 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements.

20、 The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the ma

21、nufacturers PIN may also be marked 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF

22、-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TA

23、BLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsLimits Unit Min Max High-level input voltage VIH1, 2, 3 2 - - - V Low-level input voltage VIL1, 2, 3 - - - 0.8 V Input clamp voltage VICVCC= 4.5 V, II= -12 mA 1 - - - -1.5

24、V High-level output current IOHVCC= 4.5 V, VIH= 2 V, VIL= 0.8 V, VOH= 5.5 V 1, 2, 3 - - - 100 A Low-level output voltage VOLVCC= 4.5 V, VIH= 2 V, VIL= 0.8 V, IOL= 12 mA 1, 2, 3 - - - 0.4 V Input current at maximum input voltage IIVCC= 5.5 V, VI= 5.5 V 1, 2, 3 - - - 1.0 mA High-level input current II

25、HVCC= 5.5 V, VI= 2.4 V 1, 2, 3 - - - 40 A Low-level input current IILVCC= 5.5 V, VI= 0.4 V 1, 2, 3 - - - -1.0 mA Supply current, all programmed outputs low ICCVCC= 5.5 V 1, 2, 3 - - - 99 mA Functional tests See 4.3.1(c) 7 Propagation delay time, output from enable G tPLHVCC= 5.0 V, RL= 300 5%, CL= 3

26、0 pF 10% 9 2 35 ns 10, 11 2 49 tPHL9 2 40 ns 10, 11 2 56 Propagation delay time, output from binary select tPHL9 2 40 ns 10, 11 2 56 tPLH9 2 45 ns 10, 11 2 63 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77030

27、DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F 2 Terminal number Terminal symbol 1 Y1 NC 2 Y2 Y1 3 Y3 Y2 4 Y4 Y3 5 Y5 Y4 6 Y6 NC 7 Y7 Y5 8 GND Y6 9 Y8 Y7 10 A GND 11 B NC 12 C Y8 13 D A 14 E B 15 Enable G C

28、 16 VCCNC 17 D 18 E 19 Enable G 20 VCCNC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVE

29、L C SHEET 6 DSCC FORM 2234 APR 97 Binary words Inputs Outputs Binary Select Enable E D C B A G Y8 Y7 Y6 Y5 Y4 Y3 Y2 Y1 0 1 L L L L L L H H L L L L L L 2 3 L L L L H L H H L L L L L H 4 5 L L L H L L H H L L L L H L 6 7 L L L H H L H H L L L L H H 8 9 L L H L L L H H L L L H L L 10 11 L L H L H L H H

30、 L L H L L L 12 13 L L H H L L H H L L H L L H 14 15 L L H H H L H H L L H L H L 16 17 L H L L L L H H L L H L H H 18 19 L H L L H L H H L L H H L L 20 21 L H L H L L H H L H L L L L 22 23 L H L H H L H H L H L L L H 24 25 L H H L L L H H L H L L H L 26 27 L H H L H L H H L H L L H H 28 29 L H H H L

31、 L H H L H L H L L 30 31 L H H H H L H H L H H L L L 32 33 H L L L L L H H L H H L L H 34 35 H L L L H L H H L H H L H L 36 37 H L L H L L H H L H H L H H 38 39 H L L H H L H H L H H H L L 40 41 H L H L L L H H H L L L L L 42 43 H L H L H L H H H L L L L H 44 45 H L H H L L H H H L L L H L 46 47 H L

32、 H H H L H H H L L L H H 48 49 H H L L L L H H H L L H L L 50 51 H H L L H L H H H L H L L L 52 53 H H L H L L H H H L H L L H 54 55 H H L H H L H H H L H L H L 56 57 H H H L L L H H H L H L H H 58 59 H H H L H L H H H L H H L L 60 61 H H H H L L H H H H L L L L 62 63 H H H H H L H H H H L L L H ALL

33、 X X X X X H H H H H H H H H H = High level, L = Low level, X = Dont care FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVIS

34、ION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an

35、 approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircui

36、ts delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable req

37、uired documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with metho

38、d 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document

39、revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b.

40、Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method

41、5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall includ

42、e verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufactur

43、er under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +

44、125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI

45、SION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test

46、requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 5. PACKAGING 5.1 Packaging requirements. The requirements

47、 for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits

48、 covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of

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