1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change figure 1, terminal connections, to table form. Change four pin connections on logic diagram. Convert to standardized military drawing. Add figure 4. Technical changes in 1.3, 1.4, table I, and table II. Editorial changes throughout. 89-08-
2、29 M. A. Frye B Changes in accordance with NOR 5962-R025-92. -tvn 92-02-21 Monica L. Poelking C Changes in accordance with NOR 5962-R288-97. -les 97-04-25 Raymond Monnin D Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 04-07-19 Raymond Monnin CURRENT
3、CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Monica L. Poelking
4、COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, ECL, TRIPLE LINE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 78-08-15 RECEIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A C
5、AGE CODE 14933 78009 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E346-04 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78009 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FOR
6、M 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 78009 01 E A Drawing
7、number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 10516 Triple line receiver with common reset 1.2.2 Case outline(s). The case outline(s) are as
8、 designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3
9、Absolute maximum ratings. Supply voltage range (VEE) . -8.0 V dc to 0.0 V dc Input voltage range. -5.2 V dc to 0.0 V dc Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) +165C Maximum power dissipation (PD) 110 mW Thermal resistance, junctio
10、n-to-case (JC): . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VEE) . -5.46 V dc minimum to - 4.94 V dc maximum Supply voltage range (VCC) -0.02 V to +0.02 V or +1.98 V to +2.02 V Ambient operating temperature range (TA) -55C to +125C Minimum high-level input voltage
11、(VIH) : TA = +25C . -0.780 V TA = +125C . -0.630 V TA = -55C -0.880 V Maximum low-level input voltage (VIL) : TA = +25C . -1.850 V TA = +125C . -1.820 V TA = -55C -1.920 V Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SI
12、ZE A 78009 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified
13、 herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Mi
14、crocircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicks
15、earch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedenc
16、e. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as speci
17、fied herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved
18、program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not
19、affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535
20、, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagr
21、am shall be as specified on figure 3 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78009 DEFE
22、NSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating te
23、mperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with
24、 the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or
25、“QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certifi
26、cate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38
27、535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the
28、option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE
29、A 78009 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Cases E, F, and 2 Quiesce
30、nt tests 1/ 2/ VIH VIL High level output voltage VOH Outputs terminated -0.780 -1.850 1 All -0.930 -0.780 V -0.630 -1.820 -0.825 -0.630 through 100 to 2 V -0.880 -1.920 2 3 -1.080 -0.880 VIH VIL Low level output voltage VOL VCC = 0.0 V VEE = -3.2 V -0.780 -1.850 1 All -1.850 -1.620 V -0.630 -1.820 -
31、1.820 -1.545 3/ -0.880 -1.920 2 3 -1.920 -1.655 VIH VIL High level threshold output voltage VOHA -1.105 -1.475 1 All -0.950 V -1.000 -1.400 -0.845 -1.255 -1.510 2 3 -1.100 VIH VIL Low lever threshold output voltage VOLA -1.105 -1.475 1 All -1.600 V -1.000 -1.400 -1.525 -1.255 -1.510 2 3 -1.635 Power
32、 supply drain current 4/ IEE VEE = -3.2 V, VCC = 0.0 V, VIH = -0.780 V at +25C 1 2, 3 All -21 -24 mA High level input current IIH -0.630 V at +125C -0.880 V at -55C 1 2, 3 All 95 165 A 1 -1.35 -1.23 2 -1.24 -1.12 Reference voltage VBB VEE = -3.2 V, VCC = 0.0 V 3 All -1.44 -1.32 V Input leakage curre
33、nt ICBO VEE = -3.2 V, VCC = 0.0 V, 4/ VIL = -1.850 V at +25C 1 All -1.0 A 2 -1.0 -1.820 V at +125C -1.920 V at -55C 3 -1.5 Functional Tests See 4.3.1c 7, 8 All See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICR
34、OCIRCUIT DRAWING SIZE A 78009 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit M
35、in Max Cases E, F, and 2 AC tests Transition time tTLH VEE = -3.2 V, 9 All 1.1 3.3 ns VCC = +2.0 V, 10 1.0 4.4 CL 5 pF, 11 1.0 3.9 tTHL RL = 100, 9 All 1.1 3.3 ns See figure 4 10 1.0 4.4 11 1.0 3.9 Propagation delay time, tPLH 9 All 1.0 2.9 ns inputs to outputs 10 1.0 4.0 11 1.0 3.5 9 1.0 2.9 tPHL 1
36、0 All 1.0 4.0 ns 11 1.0 3.5 1/ The quiescent limits are determined after a device has reached thermal equilibrium. This is defined as the reading taken with the device in a socket with 500 LFPM of +25C, +125C, or -55C (as applicable) air blowing on the unit in a transverse direction with power appli
37、ed for at least 4 minutes before the reading is taken. This method was used for theoretical limit establishment only. 2/ The T test method creates the limits and test conditions to be used after an increased ambient temperature has been stabilized by external thermal sources. This adjusted temperatu
38、re simulates the quiescent method by increasing the specified case temperature (+25C, +125C, -55C) with a T. The T is theoretically determined based on power dissipation and thermal characteristics of the device and package used. 3/ The high and low level output current varies with temperature, and
39、shall be calculated using the following formulas: IOH = (-2 V - VOH)/100 and IOL = (-2 V - VOL)/100. 4/ The IEE and ICBO limits, although specified in the minimum column, shall not be exceeded in magnitude, as a maximum value. Provided by IHSNot for ResaleNo reproduction or networking permitted with
40、out license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78009 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Case outlines E F 2 Terminal number Terminal symbol 1 VCC1 CIN NC 2 OUTA OUTC VCC1 3 AOUT COUT OUTA 4 INA VCC2 AOUT 5 AIN VCC1 INA
41、 6 OUTB OUTA NC 7 BOUT AOUT AIN 8 VEE INA OUTB 9 INB AIN BOUT 10 BIN OUTB VEE 11 VBB BOUT NC 12 INC VEE INB 13 CIN INB BIN 14 OUTC BIN VBB 15 COUT VBB INC 16 VCC2 INC NC 17 - - - - - - CIN 18 - - - - - - OUTC 19 - - - - - - COUT 20 - - - - - - VCC2 NC = No connection FIGURE 1. Terminal connections.
42、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78009 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Noninverting input A, B, and C Inverting input A, B, and
43、C Output A, B, and C Output A, B, and C L H L H H L H L L VBB L H H VBB H L VBB H L H VBB L H L H = High voltage level L = Low voltage level VBB = Reference voltage FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
44、om IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78009 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. Pulse generator characteristics: PRR = 1 MHz, tTHL = tTLH = 2.0 0.2 ns (20% to 80%), duty cycle = 50%. 2. The 50 resistor in series wi
45、th the 50 coax constitutes the 100 load. FIGURE 4. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78009 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL
46、D SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to qual
47、ity conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition D or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring
48、activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subg
