1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add absolute maximum ratings. Add device 02 (5-volt version). Convert to Standard Military Drawing. 87-04-14 N. A. HAUCK B Change page 5, table I test conditions for Reverse dynamic impedance. Delete long term stability test page 5, table I. Chan
2、ge drawing CAGE no. to 67268. Change VR4test limits. 87-10-07 R. R. EVANS C Table I, long term stability test, conditions column, delete “TA= 25C” and substitute “TA= 25C 0.1C, IR= 1 mA”, delete “ppm” in units column and substitute “ppm/khr”. 6.4, Approved sources of supply, delete vendor CAGE 27014
3、 for military drawing part number 8418001XX, vendor similar part number LM136A-2.5/883B. Changes in accordance with N.O.R 5962-R037-93. 92-12-10 M. A. FRYE D Add device type 03. -ro 03-02-07 R. MONNIN E Make correction to marking paragraph 3.5. Drawing updated to reflect current requirements. -rrp 0
4、5-06-15 R. MONNIN F Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 12-01-25 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARE
5、D BY DONALD R. OSBORNE DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCENZO APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR,
6、 PRECISION VOLTAGE REFERENCES, SHUNT REGULATORS, MONOLITHIC SILICON DRAWING APPROVAL DATE 85-11-14 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 84180 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E127-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
7、STANDARD MICROCIRCUIT DRAWING SIZE A 84180 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, ap
8、pendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84180 01 X A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type G
9、eneric number Circuit function 01 LM136A 2.5 V precision voltage reference 02 LM136A 5.0 V precision voltage reference 03 LM136A 2.5 V precision voltage reference 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Termin
10、als Package style X See figure 1 3 Can 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Reverse current 15 mA Forward current 10 mA Storage temperature range . -60C to +150C Lead temperature (soldering, 10 seconds) . 300C Junction tempera
11、ture (TJ) . 150C Thermal resistance, junction-to-case (JC) . 80C/W Thermal resistance, junction-to-ambient (JA) 440C/W 1.4 Recommended operating conditions. Ambient operating temperature range (TA) -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
12、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84180 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of thi
13、s drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-
14、STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at
15、 https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing take
16、s precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices a
17、nd as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturer
18、s approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications
19、 shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MI
20、L-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the e
21、lectrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described i
22、n table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN dev
23、ices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
24、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84180 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device typ
25、e Limits Unit Min Max Reverse breakdown voltage VR1VADJ= Open 1 01,03 2.465 2.515 V 2,3 2.44 2.54 1 02 4.935 5.029 2,3 4.88 5.08 VR2VADJ= 0.7 V 1 01,03 2.39 2.49 2,3 2.29 2.49 VADJ= 1.5 V 1 02 5.4 6.6 2,3 5.6 6.8 VR3VADJ= 1.9 V 1,2,3 01,03 2.49 2.69 VADJ= 2.5 V 1 02 4.6 5.4 2,3 4.8 5.6 VR4VADJ= 3.5
26、V 1 02 2.4 4.6 2,3 2.8 4.8 Reverse breakdown voltage change VR400 A IR 10 mA 1 01,03 6 mV 2,3 10 0.6 mA IR 15 mA 1 02 -12 +12 2,3 -20 +20 Adjust current IADJVADJ= 0.7 V 1,2,3 01,03 -125 +125 A VADJ= 1.5 V, TA= +25C 1 02 -260 +260 VADJ= 2.5 V, TA= +25C -260 +260 VADJ= 3.5 V, TA= +25C -260 +260 See fo
27、otnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84180 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance charact
28、eristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Reverse dynamic impedance ZRDf = 45 Hz to 1,000 Hz 2/ 4 01,03 0.6 ohm 5,6 1 IR= 1 mA 4,5,6 02 1.6 Temperature stability 3/ VSTABVR= Adj = 2.490 V, see figure 3 1,2
29、,3 01,03 18 mV VR= Adj = 5 V, see figure 3, TA= -55C, +125C 2,3 02 36 Long term stability 3/ SLTTA= +25C 0.1C, IR= 1 mA 1 01 20 ppm/khr 1/ Unless otherwise specified, IR= mA. 2/ Reverse dynamic impedance may be tested at any frequency between 45 Hz to 1,000 Hz. 3/ If not tested, shall be guaranteed
30、to the limits specified in table I herein. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA pri
31、or to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each
32、 lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity ret
33、ain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA
34、WING SIZE A 84180 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 Symbol Inches Millimeters Min Max Min Max A .085 .105 2.159 2.667 b1 .016 .019 0.406 0.482 D .209 .219 5.308 5.562 D1 .178 .195 4.521 4.953 e .100 2.54 e1 .050 1.27 F - .040 - 1.016 k .03
35、6 .046 0.914 1.168 k1 .028 .048 0.711 1.219 L .500 - 12.70 - 45 45 N 3 3 NOTE: The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pou
36、nd units, the inch-pound units shall take precedence. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84180 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FOR
37、M 2234 APR 97 FIGURE 2. Terminal connections. FIGURE 3. Temperature coefficient adjustment. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84180 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SH
38、EET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality c
39、onformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquirin
40、g activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II
41、herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following
42、additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. c. The VR(temperature cycle) test of subgroups 1, 2, and 3 shall be omitted. 4.3.2 Groups C and D in
43、spections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
44、 available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as p
45、ermitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84180 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical tes
46、t requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 4 Group A test requirements (method 5005) 1, 2, 3, 4, 5, 6 Groups C and D end-point el
47、ectrical parameters (method 5005) 1 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government micr
48、ocircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shal
