1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change code ident number to 67268. Separate fmaxsubgroups 10 and 11, page 4, table I. Editorial changes throughout. 87-10-06 R. P. Evans B Update drawing to current requirements. Editorial changes throughout. - gap 07-04-12 Robert M. Heber CURREN
2、T CAGE CODE IS 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiC
3、enzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, UP/DOWN COUNTER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-05-19 MONOLITHIC SILICON AMSC N/A REVI
4、SION LEVEL B SIZE A CAGE CODE 14933 5962-86876 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E156-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 R
5、EVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the followin
6、g example: 5962-86876 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS668 Synchronous, four-bit up/down counter 1.2.2 Case
7、 outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat pack 2 CQCC1-N20 20 leadless square chip carrier 1.2.3 Lead finish. The lead fini
8、sh is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage . +7.0 V dc Input voltage +7.0 V dc Storage temperature range -65C to +150C Power dissipation 1/ 187 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . (See M
9、IL-STD-883) Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage (VCC) +4.5 V to 5.5 V Case operating temperature range (TC) . -55C to +125C Maximum low level input voltage (VIL) 0.7 V Minimum high level input voltage (VIH) . 2.0 V _ 1/ Must withstand the added PDdu
10、e to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE
11、DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF
12、 DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 -
13、 List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphi
14、a, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtai
15、ned. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualifi
16、ed manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality
17、Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to ident
18、ify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal co
19、nnections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Counting sequence. The counting sequence shall be as specified on figure 4. 3.3
20、 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups
21、 specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION
22、 LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasibl
23、e due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replace
24、d with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 here
25、in). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as requir
26、ed in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring acti
27、vity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF
28、-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C,
29、or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with t
30、he intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for R
31、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -5
32、5C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, IOH= -400 A VIL= 0.7 V, VIH= 2.0 V 1, 2, 3 2.5 V Low level output voltage VOLVCC= 4.5 V, VIH= 2.0 V VIL= 0.7 V, IOL= 4 mA 1, 2, 3 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA
33、 1, 2, 3 -1.5 V High level input current A, B, C, D, P, D/U 1, 2, 3 0.1 mA Clock, T 1, 2, 3 0.1 mA IIH1VCC= 5.5 V VIN= 7.0 V Load 1, 2, 3 0.2 mA A, B, C, D, P, D/U 1, 2, 3 20 A Clock, T 1, 2, 3 20 A IIH2VCC= 5.5 V VIN= 2.7 V Load 1, 2, 3 40 A Low level input current A, B, C, D, P, D/U 1, 2, 3 -0.4 m
34、A Clock, T 1, 2, 3 -0.4 mA IILVCC= 5.5 V VIN= 0.4 V Load 1, 2, 3 -0.8 mA Short-circuit output current IOSVCC= 5.5 V VOUT= 0.0 V 1/ 1, 2, 3 -20 -100 mA Supply current ICCVCC= 5.5 V 2/ 1, 2, 3 34 mA Functional tests See 4.3.1c 7 9 40 ns tPLH110, 11 56 9 60 Propagation delay from Clock input to RCO out
35、put tPHL1VCC= 5.0 V, RL= 2 k 5%, CL= 15 pF 10% 10, 11 84 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION
36、LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max 9 27 ns tPLH210, 11 38 9 27 Propagation delay from Clock input to any Q output tPHL210, 11 38 9 17
37、ns tPLH310, 11 24 9 45 Propagation delay from ENT input to RCO output tPHL310, 11 63 9 35 ns tPLH410, 11 49 9 40 Propagation delay from D/U input to RCO output tPHL410, 11 56 9 25 MHz Maximum clock frequency fMAXVCC= 5.0 V, RL= 2 k 5%, CL= 15 pF 10% 10, 11 15 1/ Not more than one output should be sh
38、orted at a time, and duration of the short-circuit condition should not exceed one second. 2/ ICCis measured after applying a momentary 4.5 V, then ground, to the clock input with all other inputs grounded and the outputs open. Provided by IHSNot for ResaleNo reproduction or networking permitted wit
39、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Cases E and F Case 2 FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted
40、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 CLK LOAD ENP ENT D/U Function X X X X No change H X X X X No change L X X X X No change L X X X Load H L L H Count up H
41、 L L L Count down = High to low transition of clock = Low to high transition of clock X = Dont care H = Logic high level L = Logic low level FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5
42、962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY
43、CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 The above illustrates: 1. Load (preset) to BCD seven 2. Count up to eight, nine (maximum), zero, one, and two 3. Inhibit 4. Count down to one, zero (minimum), nine, eight, and seven FIGURE 4. Counting sequence.
44、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86876 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 11 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-
45、883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C and D end-point electrical p
46、arameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the limits specified in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B,
47、C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. 4.3.2 Gr
48、oups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
