1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE F8859. Add device class V criteria. Change to table I. Correct terminal connections for device type 02. Editorial changes throughout. GAP 00-01-25 Raymond Monnin B Add case outline X. Add delta limits for class V devices. Editoria
2、l changes throughout. GAP 00-07-31 Raymond Monnin C Update boilerplate to MIL-PRF-38535 requirements. Make change to VOHdelta limit in table III. JAK 01-01-10 Thomas M. Hess D Add device type 03. Add section 1.5, radiation features. Make changes to waveforms in figure 4. Add appendix A, microcircuit
3、 die. Update the boilerplate to include radiation hardness assured requirements. Editorial changes throughout. TVN 05-07-15 Thomas M. Hess E Correct wafer thickness in appendix A. LTG 07-03-08 Thomas M. Hess F Update radiation features in section 1.5. Add table IB and paragraphs 4.4.4.1 - 4.4.4.2. U
4、pdate boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 12-02-22 Thomas M. Hess REV SHEET REV F F F F F F F F F F SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Jamiso
5、n DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANC
6、ED CMOS, DUAL D-TYPE POSITIVE EDGE TRIGGERED FLIP-FLOP, MONOLITHIC SILICON DRAWING APPROVAL DATE 87-12-03 REVISION LEVEL F SIZE A CAGE CODE 67268 5962-88520 SHEET 1 OF 24 DSCC FORM 2233 APR 97 5962-E201-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-
7、,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88520 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space applicati
8、on (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device
9、classes M and Q: 5962 - 88520 01 C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / / Drawing number For device class V: 5962 F 88520 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (
10、see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked
11、 devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC74 Dual D-
12、type positive edge-triggered flip-flop 02 54AC11074 Dual D-type positive edge-triggered flip-flop 03 54AC74 Dual D-type positive edge-triggered flip-flop 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the d
13、evice class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 c
14、ompliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88520 DLA LAN
15、D AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or C
16、DFP2-F14 14 Flat pack X CDFP3-F14 14 Flat pack 2 CQCC1-N20 20 Leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V
17、 dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIK, IOK) . 20 mA DC output current (IOUT) . 50 mA DC VCCor GND current (per pin) . 50 mA 4/ Maximum power dissipation (PD) . 500 mW Storage temp
18、erature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds): Case outline X . +260C Other case outlines (except case outline X) +245C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 5/ 1.4 Recommended operating conditions. 2/ 3/ 6/ Suppl
19、y voltage range (VCC) +2.0 V dc to +6.0 V dc Input voltage range (VIN) 0.0 V dc to VCCOutput voltage range (VOUT). 0.0 V dc to VCCCase operating temperature range (TC) . -55C to +125C Input rise or fall time rate (t/V): VCC= 3.6 V to 5.5 V . 0 to 8 ns/V Minimum setup time, Dn to CPn (ts): TC= +25C:
20、VCC= 3.0 V . 4.0 ns VCC= 4.5 V . 3.0 ns TC= -55C and +125C: VCC= 3.0 V . 5.0 ns VCC= 4.5 V . 4.0 ns Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88520 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISI
21、ON LEVEL F SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions - Continued 2/ 3/ 6/ Minimum hold time, Dn to CPn (th): TC= +25C: VCC= 3.0 V . 0.5 ns VCC= 4.5 V . 0.5 ns TC= -55C and +125C: VCC= 3.0 V . 0.5 ns VCC= 4.5 V . 0.5 ns Minimum pulse width, CPn (tw): TC= +25C: VCC= 3.0 V . 5.
22、5 ns VCC= 4.5 V . 5.0 ns TC= -55C and +125C: VCC= 3.0 V . 8.0 ns VCC= 4.5 V . 5.5 ns Minimum pulse width, nCD or nSD (tw): TC= +25C: VCC= 3.0 V . 6.0 ns VCC= 4.5 V . 5.0 ns TC= -55C and +125C: VCC= 3.0 V . 8.0 ns VCC= 4.5 V . 5.5 ns Minimum recovery time, nCD or nSD to CPn (trec): TC= +25C: VCC= 3.0
23、 V . 0.5 ns VCC= 4.5 V . 0.5 ns TC= -55C and +125C: VCC= 3.0 V . 0.5 ns VCC= 4.5 V . 0.5 ns Maximum clock frequency (fMAX): TC= +25C: VCC= 3.0 V . 100 MHz VCC= 4.5 V . 140 MHz TC= -55C and +125C: VCC= 3.0 V . 100 MHz VCC= 4.5 V . 140 MHz 1.5 Radiation features. Device type 03: Maximum total dose ava
24、ilable (dose rate = 50 300 rads (Si)/s) 300 krads (Si) No SEL occurs at effective LET (see 4.4.4.2) 93 MeV-cm2/mg 7/ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unl
25、ess otherwise specified, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For devices with multiple VCCor GND pins, this value represents the total VCCor GND current. 5/
26、Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 6/ Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data retention impl
27、ies no input transition and no stored data loss with the following conditions: VIH 70% VCC, VIL 30% VCC, VOH 70% VCC -20 A, VOL 30% VCC 20 A. 7/ Limits obtained during technology characterization/qualification, guaranteed by design or process, but not production tested unless specified by the custom
28、er through the purchase order or contract. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88520 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 2. APPLICABLE DO
29、CUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF D
30、EFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - L
31、ist of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Gov
32、ernment publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 20 - Standard for Descript
33、ion of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of precedence. In the event of a conflic
34、t between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requi
35、rements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements
36、 for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, const
37、ruction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 and figure 1 herein. 3.2.2 Terminal connections. The term
38、inal connections shall be as specified on figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88520 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 3.2.3 T
39、ruth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.2.6 Radiation exposure circuit. The radia
40、tion exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, th
41、e electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
42、tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
43、option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certific
44、ation/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of c
45、ompliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
46、 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the
47、 requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3
48、.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
