1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements . Editorial changes throughout. - gap 10-01-25 Charles F. Saffle The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8
2、 9 PMIC N/A PREPARED BY Monica L. Poelking DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Ray Monnin APPROVED BY Michael A. Frye MI
3、CROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, BUFFER/LINE DRIVER, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-10-04 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-88722 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E435-09 Provided by IHSNot for ResaleNo reproduction or networking permitted with
4、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircui
5、ts in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88722 01 L X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the c
6、ircuit function as follows: Device type Generic number Circuit function 01 54F30244 Octal high current buffer/line and backplane driver, with open collector outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Term
7、inals Package style K GDFP2-F24 or CDFP3-F24 24 dual-in-line package L GDIP3-T24 or CDIP4-T24 24 flat package 3 CQCC1-N28 28 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc minimum to +7
8、.0 V dc maximum Input voltage range . -1.2 V dc to +7.0 V dc Input current range -30 mA to +5.0 mA Voltage applied to output in HIGH output state . -0.5 V to +VCCCurrent applied to output in LOW output state +260 mA Storage temperature range . -65C to +150C Maximum power dissipation +550 mW Lead tem
9、perature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +150C 1.4 Recommended operating conditions. Supply voltage (VCC) . +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level inpu
10、t voltage (VIL) . 0.8 V dc Minimum high level output voltage (VOH) . 4.5 V Maximum low level output current (IOL) . 130 mA Case operating temperature range (TC) -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI
11、NG SIZE A 5962-88722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent
12、 specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method S
13、tandard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla
14、.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing i
15、n this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
16、 Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan
17、 and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the P
18、IN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A
19、 and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and switching waveforms. Test
20、 circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical tes
21、t requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-
22、88722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked.
23、 For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to M
24、IL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to
25、be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein.
26、 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
27、 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection.
28、 Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a.
29、 Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, bi
30、ases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional
31、 at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. E
32、lectrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Limits Unit Min Max High level output current IOHVCC= 4.5 V, VIL= 0.8 V VIH= 2.0 V, VOH= 4.5 V 1, 2, 3 0.25 mA Low level output voltage VOLVCC= 4.5 V, VIL= 0.8 V, VIH= 2.0 V IOL1=
33、 130 mA 1/ 1, 2, 3 0.55 V IOL= 100 mA 50 Input clamp voltage VIKVCC= 4.5 V, IIK= -18 mA 1, 2, 3 -1.2 V High level input current IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 20 A IIH2 VCC= 0.0 V, VIN= 7.0 V 100 Low level input current IILVCC= 5.5 V, VIN= 0.5 V 1, 2, 3 -20 A Supply current ICCHVCC= 5.5 V, VIN=
34、5.5 V 1, 2, 3 27 mA ICCLVCC= 5.5 V, VIN= 0.0 V 100 Propagation delay time, Dn to Qn tPLH1VCC= 5.0 V RL= 500 5% CL= 50 pF 10% See figure 3 9 4.0 14.5 ns 10, 11 4.0 15.0 tPHL19 3.0 9.0 ns 10, 11 3.0 9.5 Propagation delay time, OE$ $ $ $ $to Qn tPLH24.0 14.0 ns 10, 11 4.0 14.5 tPHL29 3.5 9.0 ns 10, 11
35、3.5 10.5 1/ IOL1is the current necessary to guarantee the HIGH to LOW transition in a 30 transmission line on the incident wave. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88722 DEFENSE SUPPLY CENTER COL
36、UMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Case outlines L and K 3 Terminal number Terminal symbols 1 Q0 NC 2 Q1 Q0 3 Q2 Q1 4 Q3 Q2 5 GND Q3 6 GND GND 7 GND GND Inputs Output 8 GND NC OE$ $ $ $ $n Dn Qn 9 Q4 GND L L L 10 Q5 GND L H H 11 Q6 Q4 H X OFF 12 Q7 Q5 H =
37、High level voltage 13 D7 Q6 L = Low level voltage 14 D6 Q7 X = Irrelevant 15 D5 NC 16 D4 D7 17 OE$ $ $ $ $1 D6 FIGURE 2. Truth table. 18 VCC1D519 VCC2D4 20 OE$ $ $ $ $0 OE$ $ $ $ $1 21 D3 VCC122 D2 NC 23 D1 VCC224 D0OE$ $ $ $ $0 25 D3 26 D2 27 D1 28 D0 FIGURE 1. Terminal connections. Provided by IHS
38、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. RT= ZOUTof pul
39、se generators. 3. Input pulse characteristics: PRR = 1 MHz, tTLH= tTHL= 2.5 ns, duty cycle = 50%. 4. The switch is closed for open collector outputs. FIGURE 3. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAN
40、DARD MICROCIRCUIT DRAWING SIZE A 5962-88722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrica
41、l parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspect
42、ion. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, met
43、hod 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test cond
44、ition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordanc
45、e with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A
46、 5962-88722 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to th
47、is drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Co
48、nfiguration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawi
