DLA SMD-5962-89647 REV B-2009 MICROCIRCUIT LINEAR HIGH SPEED LOW POWER OPERATIONAL AMPLIFIER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. -ro 02-05-28 R. MONNIN B Update drawing as part of 5 year review. -rrp 09-05-18 J. RODENBECK REV SHET REV SHET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A

2、PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED, LOW POWER, OPERATI

3、ONAL AMPLIFIER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-01-19 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89647 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E004-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

4、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in acco

5、rdance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89647 01 P X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit fun

6、ction as follows: Device type Generic number Circuit function 01 AD847S High speed, low power, operational amplifier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dua

7、l-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. (Unless otherwise specified, TA= +25C) Positive supply voltage (+VS) +18 V dc Negative supply voltage (-VS) -18 V dc Differential input voltage 6.0 V dc Input common mode voltage

8、. VSJunction temperature (TJ) +175C Storage temperature range -65C to +150C Power dissipation (PD) 1.1 W 1/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 110C/W 1.4 Recommended operating condit

9、ions. Positive supply voltage range (+VS) . +4.5 V dc to +15 V dc Negative supply voltage range (-VS) -4.5 V dc to -15 V dc Common mode input voltage (VCM) . 12 V dc Ambient operating temperature range(TA) . -55C to +125C 1/ Derate linearity above TA= +25C at 7.3 mW/C. Provided by IHSNot for ResaleN

10、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks.

11、The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufa

12、cturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard M

13、icrocircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this

14、 drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accord

15、ance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38

16、535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications sha

17、ll not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The de

18、sign, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance

19、 characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table

20、II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire

21、 SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance

22、indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89647 DEFE

23、NSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Input offset voltage VIOVCM= 0 V

24、, VS= 5 V 1 01 1.0 mV 2,3 4.0 Input bias current +IIBVCM= 0 V, VS= 5 V, 1 01 +5.0 A VS= 15 V 2,3 +7.5 -IIB1 +5.0 2,3 +7.5 Input offset current IIOVCM= 0 V, 1 01 300 nA VS= 5 V, 15 V 2,3 400 Common mode input 3/ voltage range +IVR VCM= +2.5 V, VS= 5 V 1,2,3 01 +2.5 V -IVR VCM= -2.5 V, VS= 5 V -2.5 +I

25、VR VCM= +12 V, VS= 15 V +12 -IVR VCM= -12 V, VS= 15 V -12 Open loop gain +AVOLVOUT= +2.5 V, 1 01 2.0 V/mV VS= 5 V, RL= 500 2,3 1.0 VOUT= +10 V, 1 3.0 VS= 15 V, RL= 1 k 2,3 1.5 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS

26、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups

27、Device type Limits 2/ Unit Min Max Open loop gain -AVOLVOUT= -2.5 V, 1 01 2.0 V/mV VS= 5 V, RL= 500 2,3 1.0 VOUT= -10 V, 1 3.0 VS= 15 V, RL= 1 k 2,3 1.5 Common mode rejection ratio +CMRR VCM= +2.5 V, VS= 5 V 1 01 80 dB VCM= +12 V, VS= 15 V 1 80 2,3 75 -CMRR VCM= -2.5 V, VS= 5 V 1 80 VCM= -12 V, VS=

28、15 V 1 80 2,3 75 Output current 4/ IOUTVOUT= 2.5 V, VS= 5 V, TA= +25C 4 01 13 mA VOUT= 10 V, VS= 15 V, TA= +25C 20 Output voltage swing +VOUTVS= 5 V, RL= 500 1 01 +3.0 V 2,3 +2.5 VS= 5 V, RL= 150 1 +2.5 VS= 15 V, RL= 1 k 1,2,3 +12 VS= 15 V, RL= 500 1 +10 See footnotes at end of table. Provided by IH

29、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test

30、Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxOutput voltage swing -VOUTVS= 5 V, RL= 500 1 01 -3.0 V 2,3 -2.5 VS= 5 V, RL= 150 1 -2.5 VS= 15 V, RL= 1 k 1,2,3 -12 VS= 15 V, RL= 500 1 -10 Quiescent power supply current ICCVOUT= 0 V, IO

31、UT= 0 mA, 1 01 5.7 mA VS= 5 V 2,3 7.8 VOUT= 0 V, IOUT= 0 mA, 1 6.3 VS= 15 V 2,3 8.4 Power supply rejection ratio PSRR VS= 5 V to 15 V 1 01 75 dB 2,3 72 Quiescent power 5/ consumption PQVOUT= 0 V, IOUT= 0 mA, 1 01 57 mW VS= 5 V 2,3 78 VOUT= 0 V, IOUT= 0 mA, 1 189 VS= 15 V 2,3 252 Differential input 4

32、/ resistance RINVCM= 0 V, TA= +25C, VS= 5 V, 15 V 4 01 80 k See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISI

33、ON LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxSlew rate 4/ 6/ +SR VOUT= -2.5 V to +2.5 V, RL= 500 , AV= 1 V/V, 4 01 120 V/s VS=

34、5 V, measured from 10 % to 90 % point, rising edge 5,6 90 -SR VOUT= +2.5 V to -2.5 V, RL= 500 , AV= 1 V/V, 4 90 VS= 5 V, measured from 90 % to 10 % point, falling edge 5,6 65 +SR VOUT= -5 V to +5 V, RL= 1 k, AV= 1 V/V, 4 200 VS= 15 V, measured from 10 % to 90 % point, rising edge 5,6 130 -SR VOUT= +

35、5 V to -5 V, RL= 1 k, AV= 1 V/V, 4 145 VS= 15 V, measured from 90 % to 10 % point, falling edge 5,6 120 Gain bandwidth 4/ product GBWP VOUT= 100 mV, RL= 500 , VS= 5 V, TA= +25C 4 01 25 MHz VOUT= 100 mV, RL= 1 k, VS= 15 V, TA= +25C 40 Full power 4/ 7/ bandwidth FPBW VPK= 2.5 V, RL= 500 , VS= 5 V, TA=

36、 +25C 4 01 5.7 MHz VPK= 10 V, RL= 1 k, VS= 15 V, TA= +25C 2.8 Closed loop stable 4/ gain CLSG VS= 5 V, 15 V, RL= 1 k 4,5,6 01 1.0 V/V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A

37、5962-89647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxRise tim

38、e 4/ 8/ trVOUT= 0 V to +200 mV, AV= +1, RL= 1 k, VS= 15 V 4,5,6 01 10 ns Fall time 4/ 8/ tfVOUT= 0 V to -200 mV, AV= +1, RL= 1 k, VS= 15 V 4,5,6 01 10 ns Settling time 4/ tsAV= -1 V/V, RL= 1 k, VS= 15 V, TA= +25C, 10 V step at 0.1% of the fixed value 4 01 150 ns AV= -1 V/V, RL= 1 k, VS= 15 V, TA= +2

39、5C, 10 V step at 0.01% of the fixed value 200 Overshoot 4/ +OS VOUT= 0 V to +200 mV, AV= +1, RL= 1 k, VS= 15 V, TA= +25C 4 01 30 % -OS VOUT= 0 V to -200 mV, AV= +1, RL= 1 k, VS= 15 V, TA= +25C 30 1/ Unless otherwise specified, for dc tests, RS 100 , RL 100 k, VOUT= 0 V, and CL 10 pF. Unless otherwis

40、e specified, for ac tests, AV= 1 V/V, RL= 1 k, and CL 10 pF. 2/ The limiting terms “min“ (minimum) and “max“ (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 3/ This test is guaranteed by testing CMRR.

41、 4/ If not tested, shall be guaranteed to the limits specified in table I herein. 5/ Quiescent power consumption is based on quiescent supply current test maximum (no load at the output). 6/ Slew rate test limits are guarantee after 5 minutes of warm-up. 7/ Full power bandwidth = SR / (2 x x VPK). 8

42、/ Rise and fall times measured between 10 percent and 90 percent point. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9

43、DSCC FORM 2234 APR 97 Device type 01 Case outline P Terminal number Terminal symbol 1 NULL 2 -INPUT 3 +INPUT 4 -VS5 NC 6 OUTPUT 7 +VS8 NULL NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI

44、CROCIRCUIT DRAWING SIZE A 5962-89647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-

45、HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of

46、 conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent,

47、and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 10

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