1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R213-92. 92-06-19 M. A. Frye B Changes to table I. Editorial changes throughout. - drw 98-11-04 Raymond Monnin C Change to the input bias current test and input resistance test in table I. rrp 99-08-13 Raymond
2、Monnin D Add footnote to table I. Editorial changes throughout. drw 01-11-14 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER
3、COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, HIGH SPEED 8-BIT A/D CONVERTER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF
4、DEFENSE DRAWING APPROVAL DATE 90-02-16 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-89654 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E074-02 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted wi
5、thout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcirc
6、uits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89654 01 X X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device types. The device types identify the
7、circuit function as follows: Device type Generic number Circuit function 01 AD9012S 8 Bit A/D 02 AD9012T 8 Bit A/D 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-i
8、n-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Positive supply voltage (VS+) +6 V dc Negative supply voltage (VS-) -6 V dc Analog input voltage -2.1 V dc to +0.5 V dc Power dissipation
9、(PD) (TA= +25C): Case outline X 2.5 W Case outline 3 1.8 W Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case outline
10、X 60C/W Case outline 3 80C/W ENCODE input voltage 0 V to +5 V dc OVERFLOW INH input voltage . 0 V to -5.2 V dc Reference input voltage (+VREF-VREF) . -3.5 to +0.1 V dc 1/ Reference midpoint current. 4 mA Digital output current . 30 mA Differential reference voltage 2.1 V dc 1/ +VREF -VREFunder all c
11、ircumstances. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions
12、. Ambient operating temperature range (TA) . -55C to +125C Positive supply voltage (VS+) +5 V dc Negative supply voltage (VS-) -5.2 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing t
13、o the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - In
14、tegrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings.
15、MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conf
16、lict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking pe
17、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-385
18、35, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed
19、as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, f
20、it, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, a
21、nd physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 System timing diagram and load circuit. The system timing diagram and load circuit shall be as specified on figure 2. 3.
22、2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4
23、Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.
24、2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/
25、compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.
26、6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that
27、 the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notificati
28、on of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentat
29、ion shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 5 DSCC
30、FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input bias current IBAnalog input = 0 V 1, 2, 3 All 200 A Input resistance RIN1 All 25 k Reference ladder resistance R
31、 1 All 40 110 Overflow inhibit 0 V input current IIN1, 2, 3 All 250 A High level output voltage VOH2/ 1, 2, 3 All 2.4 V Low level output voltage VOL2/ 1, 2, 3 All 0.4 V Positive supply current +ICCVS+ = +5.0 V 3/ 1 All 45.0 mA 2, 3 48.0 Negative supply current -ICCVS- = -5.2 V 3/ 1 All 179 mA 2, 3 1
32、91 Conversion rate FS4 All 75 MSPS Encode pulse width (low) tPWL4/ 4 All 2.5 ns Encode pulse width (high) tPWH4 All 2.5 Signal-to-noise ratio SNR 5/ 4 All 46 dB Differential linearity DNL 4 01 0.75 LSB 02 0.5 6/ 5, 6 01 1.0 02 0.75 Integral linearity INL 4 01 1.0 LSB 02 0.5 6/ 5, 6 All 1.2 Top of re
33、ference ladder 1 All 15 mV 2, 3 18 Bottom of reference ladder 4 All 10 mV 6/ 5, 6 13 High level input voltage VIH6/ 4, 5, 6 All 2.0 V Low level input voltage VIL6/ 4, 5, 6 All 0.8 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
34、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A su
35、bgroups Device type Limits Unit Min Max High level input current IIH6/ 4, 5, 6 All 250 A Low level input current IIL6/ 4, 5, 6 All 400 A Power supply rejection ratio PSRR 3/, 7/ 4 All 2.5 mV/V Input capacitance CIN8/ 4 All 18 pF Output delay tPD2/, 9/, 10/ 9 All 4.0 11.0 ns Output rise time tr2/, 10
36、 All 8.0 Output fall time tf2/, 10/ 9 All 4.3 ns In-band harmonics Analog input signal = 1.23 MHz 11/ 4 All 48 dB 1/ VS+ = 5.0 V, VS- = -5.2 V, differential reference voltage = 2.0 V. 2/ Outputs terminated with two equivalent LS00 type loads. 3/ Supplies should remain stable within 5 % for normal op
37、eration. 4/ ENCODE signal rise/fall times should be less than 30 ns for normal operation. 5/ RMS signal to RMS noise, including harmonics with 1.23 MHz analog input signal. 6/ Subgroups 5 and 6 if not tested shall be guaranteed to the limits specified. 7/ Measured at -5.2 V 5 % and +5.0 V 5 %. 8/ Su
38、bgroup 4 (CINmeasurement) shall be measured only for the initial test and after process or design changes which may affect input capacitance. 9/ Measured from ENCODE into data out for LSB only. 10/ Guaranteed by design. Not tested. 11/ Measured at 75 MSPS encode rate. Harmonic data based on worst ca
39、se harmonics. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Device types 01 and 02 Case outlines
40、 X and 3 Terminal number Terminal symbol 1 DIGITAL VS+ 2 OVERFLOW INH 3 HYSTERESIS 4 +VREF5 ANALOG INPUT 6 ANALOG GROUND 7 ENCODE 8 DIGITAL VS+ 9 ANALOG GROUND 10 ANALOG INPUT 11 -VREF12 REF mid 13 DIGITAL VS+ 14 DIGITAL VS- 15 D1 (LSB) 16 D217 D3 18 D419 D5 20 DIGITAL GROUND 21 ANALOG VS- 22 ANALOG
41、 VS- 23 DIGITAL GROUND 24 D625 D7 26 D8 (MSB) 27 OVERFLOW 28 DIGITAL VS- FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 432
42、16-5000 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 FIGURE 2. System timing diagram and load circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 432
43、16-5000 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be
44、conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, or C. The test circuit shall be maintained by the manufacturer under document revision level control and shall be mad
45、e available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test
46、parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) I
47、nterim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 4 Group A test requirements (method 5005) 1, 2, 3, 4, 5*, 6*, 9 Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. * Subgroups 5 and 6 if not tested shall be
48、 guaranteed to the limits specified in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596
