DLA SMD-5962-89778 REV A-2006 MICROCIRCUIT LINEAR VOLTAGE CONTROLLED OSCILLATOR MONOLITHIC SILICON《硅单片 电控振荡器 线性微型电路》.pdf

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DLA SMD-5962-89778 REV A-2006 MICROCIRCUIT LINEAR VOLTAGE CONTROLLED OSCILLATOR MONOLITHIC SILICON《硅单片 电控振荡器 线性微型电路》.pdf_第1页
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 06-12-05 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A

2、 PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING A

3、PPROVAL DATE 92-03-24 MICROCIRCUIT, LINEAR, VOLTAGE CONTROLLED OSCILLATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-89778 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E096-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

4、-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MI

5、L-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89778 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follo

6、ws: Device type Generic number Circuit function 01 1648M Voltage controlled oscillator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CD

7、FP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Power supply voltage at VCC= 0 V, (VEE) . -8.0 V dc to 0 V dc Input voltage (VIN) at VEE= 5.2 V: (VINat AGC pin) -5.2 V dc t

8、o -3.4 V dc (VINat TANK pin) 0 V dc to VEEOutput source current, continuous (IO) . 39 mA Power dissipation (PD) at VCC= 5.0 V . 215 mW Output frequency (fMAX) . 225 MHz (typical) Storage temperature range . -55C to +165C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +1

9、65C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) : Case C 28C/W Case D 22C/W Case 2 . 20C/W Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 D

10、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage at VEE= GND (VCC) +5.0 V dc Supply voltage at VCC= GND (VEE) -5.2 V dc Peak to peak TANK voltage 400 mW Output duty cycle 50 % Ambient operating

11、 temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are thos

12、e cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Ou

13、tlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Or

14、der Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and

15、regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qual

16、ified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-

17、PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark

18、 in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall

19、 be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STA

20、NDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I a

21、nd shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF

22、-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the d

23、evice. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the

24、QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source

25、of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to t

26、his drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentati

27、on. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO

28、N LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Power supply current ICCInputs and outputs open, VCC= 5.0 V, VEE= 0 V, TA= +25C 1 01 40 mA IEE

29、Inputs and outputs open, VEE= -5.2 V, VCC= 0 V, TA= +25C -41 High input voltage VIHBIL= -5.0 mA, VCC= 5.0 V 1 01 1.85 V 2 1.60 3 2.70 VIHAIL= -5.0 mA, VEE= -5.2 V 1 -3.35 2 -3.60 3 -3.13 Low input voltage VILBIL= -5.0 mA, VCC= 5.0 V 1 01 1.35 V 2 1.10 3 1.57 VILAIL= -5.0 mA, VEE= -5.2 V 1 -3.85 2 -4

30、.10 3 -3.63 Logic “1” output voltage VOHBTANK pin = +1.35 V, OUTPUT pin = -5 mA, VCC= 5.0 V, VEE= 0 V, TA= +25C 1 01 4.04 4.25 V VOHATANK pin = -3.85 V, OUTPUT pin = -5 mA, VEE= -5.2 V, VCC= 0 V, TA= +25C -0.96 -0.75 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or netw

31、orking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unl

32、ess otherwise specified Group A subgroups Device type Limits Unit Min Max Logic “1” output voltage VOHBTANK pin = +1.10 V, OUTPUT pin = -5 mA, VCC= 5.0 V, VEE= 0 V, TA= +125C 2 01 4.16 4.40 V VOHATANK pin = -4.10 V, OUTPUT pin = -5 mA, VEE= -5.2 V, VCC= 0 V, TA= +125C -0.84 -0.60 VOHBTANK pin = +1.5

33、7 V, OUTPUT pin = -5 mA, VCC= 5.0 V, VEE= 0 V, TA= -55C 3 3.92 4.13 VOHATANK pin = -3.63 V, OUTPUT pin = -5 mA, VEE= -5.2 V, VCC= 0 V, TA= -55C -1.08 -0.87 Logic “0” output voltage VOLBTANK pin = +1.85 V, OUTPUT pin = -5 mA, VCC= 5.0 V, VEE= 0 V, TA= +25C 1 01 3.20 3.43 V VOLATANK pin = -3.35 V, OUT

34、PUT pin = -5 mA, VEE= -5.2 V, VCC= 0 V, TA= +25C -1.85 -1.62 VOLBTANK pin = +1.60 V, OUTPUT pin = -5 mA, VCC= 5.0 V, VEE= 0 V, TA= +125C 2 3.23 3.51 VOLATANK pin = -3.60 V, OUTPUT pin = -5 mA, VEE= -5.2 V, VCC= 0 V, TA= +125C -1.82 -1.54 See footnotes at end of table. Provided by IHSNot for ResaleNo

35、 reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions

36、 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Logic “0” output voltage VOLBTANK pin = +2.07 V, OUTPUT pin = -5 mA, VCC= 5.0 V, VEE= 0 V, TA= -55C 3 01 3.13 3.38 V VOLATANK pin = -3.13 V, OUTPUT pin = -5 mA, VEE= -5.2 V, VCC= 0 V, TA= -55C -1.92 -1.67

37、Bias voltage TANK pin = +1.35 V, VCC= 5.0 V, VEE= 0 V, TA= +25C 1 01 1.45 1.75 V TANK pin = -3.85 V, VEE= -5.2 V, VCC= 0 V, TA= +25C -3.75 -3.45 TANK pin = +1.10 V, VCC= 5.0 V, VEE= 0 V, TA= +125C 2 1.20 1.50 TANK pin = -4.10 V, VEE= -5.2 V, VCC= 0 V, TA= +125C -4.00 -3.70 TANK pin = +1.57 V, VCC= 5

38、.0 V, VEE= 0 V, TA= -55C 3 1.67 1.97 TANK pin = -3.63 V, VEE= -5.2 V, VCC= 0 V, TA= -55C -3.53 -3.23 Maximum frequency of oscillation fMAXVCC= 5.0 V, TA= +25C, VEE= 0 V, VPP= 400 mV, duty cycle = 50 % 4 01 200 MHz Functional test 7, 8 01 1/ All voltages are referenced to ground. See figure 3. Provid

39、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outlines C and D 2 Terminal number T

40、erminal symbol 1 VCC1NC 2 NC VCC13 OUTPUT NC 4 NC OUTPUT 5 AGC NC 6 NC NC 7 VEE1NC 8 VEE2AGC 9 NC NC 10 BIAS POINT VEE111 NC NC 12 TANK VEE213 NC NC 14 VCC2BIAS POINT 15 - NC 16 - NC 17 - NC 18 - TANK 19 - NC 20 - VCC2FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or ne

41、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 Terminal symbol Description VCC1Positive supply voltage 1. NC No connection. OUTPUT Output. AGC Auto

42、matic gain control limits the current through the emitter-coupled pair of transistors and allows optimum frequency response of the oscillator. VEE1Negative supply voltage 1. VEE2Negative supply voltage 2. BIAS POINT Gives power to the TANK circuit which is controlled by the AGC. TANK Oscillator cont

43、rol which causes circuit to oscillate given frequency. VCC2Positive supply voltage 2. FIGURE 1. Terminal connections Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLU

44、MBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 10 DSCC FORM 2234 APR 97 FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321

45、8-3990 REVISION LEVEL A SHEET 11 DSCC FORM 2234 APR 97 NOTES: 1. Use high impedance probe ( 1.0 M must be used). Inductor (L) = 40 nH 1 percent and capacitor (C) = 10 pF 1 percent. 2. The 1200 resistor and the scope termination impedance constitute a 25:1 attenuator probe. Coaxial cable shall be CT-

46、070-50 or equivalent. 3. Bypass only that supply opposite ground. FIGURE 3. Test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89778 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO

47、N LEVEL A SHEET 12 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior

48、 to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable

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