1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A In accordance with N.O.R. 5962-R232-92. 92-07-09 M. A. FRYE B In accordance with N.O.R. 5962-R235-93. 93-11-08 M. A. FRYE C In accordance with N.O.R. 5962-R008-95. 94-10-18 M. A. FRYE D Make changes to SSBW and GFR tests as specified under table
2、I. Redrawn. - ro 98-01-06 R. MONNIN E Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. - ro 03-12-11 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PR
3、EPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, WIDEBAND, HIGH SLEW RATE, OPERATIONAL AM
4、PLIFIER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-03-23 MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-90994 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E022-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided
5、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90994 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assu
6、rance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) level
7、s are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90994 01 M P X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA d
8、esignator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-
9、) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 CLC404 Wideband, high slew rate, operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identif
10、ying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38
11、535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-P
12、RF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90994 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absol
13、ute maximum ratings. 1/ Supply voltage (VS) . 7 V dc Output current (IOUT) 70 mA Differential input voltage (VID) 10 V dc Common mode input voltage (VCM) . 5 V dc Power dissipation (PD) 1.25 W Junction temperature (TJ) . +175C Storage temperature range . -65C to +150C Lead temperature (soldering, 10
14、 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) . 100C/W 1.4 Recommended operating conditions. Supply voltage (VS) 5 V dc Gain range (AV) +2 to +21 and -1 to -20 Ambient operating temperature range (TA) -55C to +125C 2. APPLIC
15、ABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defens
16、e Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL
17、-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available fr
18、om the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, howeve
19、r, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for Resal
20、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90994 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for de
21、vice classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device
22、 class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V
23、or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and post irradiation parameter
24、 limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the
25、subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN n
26、umber is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device clas
27、s M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6
28、Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer i
29、n order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirement
30、s of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided wit
31、h each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 V
32、erification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microc
33、ircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A
34、5962-90994 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Input bias curre
35、nt (noninverting) +IIN1,2 01 -22 +22 A 3 -44 +44 Input bias current (inverting) -IIN1 01 -18 +18 A 2 -22 +22 3 -40 +40 Input offset voltage VIO1 01 -5.0 +5.0 mV 2 -10.0 +10.0 3 -9.0 +9.0 Average +input bias current drift TC(+IIN) 3/ 2 01 -200 +200 nA/C 3 -275 +275 Average -input bias current drift T
36、C(-IIN) 3/ 2 01 -200 +200 nA/C 3 -275 +275 Average offset voltage drift TC(VIO) 3/ 2,3 01 -50 +50 V/C Supply current ISNo load, quiescent 1,2,3 01 -12 +12 mA Power supply rejection ratio PSRR +VS= +4.5 V to +5.0 V, 1 01 48 dB -VS= -4.5 V to -5.0 V 2,3 45 Common mode rejection ratio CMRR VCM= 1.0 V 3
37、/ 4 01 46 dB 5,6 44 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90994 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97
38、 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Output current +IOUT3/ 1,2 01 +50 mA 3 +30 -IOUT1,2 -50 3 -30 Output impedance at dc ROUT3/ 1,2 01 0.2 3 0.3 Input resis
39、tance +RIN3/ 1 01 500 k 2 1000 3 250 Input capacitance CINSee 4.4.1c, TA= +25C 4 01 2 pF Output voltage swing +VOUTRL= 100 4,5 01 +2.7 V 6 +2.3 -VOUT4,5 -2.7 6 -2.3 Small signal bandwidth SSBW -3 dB bandwidth, 4 01 140 MHz VOUT40 MHz, 4 4/ 01 0.5 dB VOUT 2 VPP5,6 3/ 0.7 Gain flatness rolloff GFR At
40、0.1 MHz to 75 MHz 4 4/ 01 1.1 dB VOUT 2 VPP5 3/ 1.3 6 3/ 1.0 Linear phase deviation 3/ LPD At 75 MHz, 4,6 01 1.0 Degree VOUT 2 VPP5 1.2 2 nd harmonic distortion HD2 2 VPPat 20 MHz, 4 01 -45 dBc VOUT= 2 VPP5 3/ -45 6 3/ -40 3 rd harmonic distortion HD3 2 VPPat 20 MHz, 4 01 -50 dBc VOUT= 2 VPP5,6 3/ -
41、50 Slew rate 3/ SR AV= +2, measured at 1 V, CL 10 pF, VOUT= 3 V 4,5,6 01 2000 V/s See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90994 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,
42、OHIO 43216-5000 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Rise and fall time 3/ TRS 2 V step, CL 10 pF 9,11 01 2.4 n
43、s 10 2.9 TRL 5 V step, CL 10 pF 9,11 2.6 10 3.2 Settling time 3/ tS2 V step at 0.2 % of the fixed value, CL 10 pF 9,10,11 01 15 ns Overshoot 3/ OS 2 V step, CL 10 pF 9 01 12 % 10,11 15 1/ Unless otherwise specified, VS= 5 V dc, load resistance (RL) = 100 , AV= +6, feedback resistance (RF) = 500 , an
44、d gain settling resistance (RG) = 100 . 2/ The algebraic convention, whereby the most negative value is a minimum and the positive a maximum, is used in this table. 3/ If not tested, shall be guaranteed to the limits specified in table I herein. 4/ Group A tested only. Provided by IHSNot for ResaleN
45、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90994 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 Device type 01 Case outline P Terminal number Terminal symbol 1 NC 2 INPUT- 3 IN
46、PUT+ 4 -VS5 NC 6 OUTPUT 7 +VS8 NC NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90994 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEV
47、EL E SHEET 10 DSCC FORM 2234 APR 97 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the Q
48、M plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformanc
