1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Add case outline Y. Make changes to 1.2.2, 1.2.4, 1.3, 1.4, table I, figure 1, and figure 2. 95-06-16 M. A. FRYE B Add case outline Z. Make changes to 1.2.4, 1.3, figure 2, and table II. Update boilerplate to meet current requ
2、irements. rrp 00-12-26 R. MONNIN C Drawing updated to reflect current requirements. - ro 03-04-01 R. MONNIN REV SHET REV C SHET 15 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY MARCIA B. KELLEHER DEFENSE SUPPLY CENTER COLUMBUS STANDA
3、RD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, POSITIVE, ADJUSTABLE, STEP-DOWN SWITCHING AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL
4、 DATE 93-03-30 VOLTAGE REGULATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-91671 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E320-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networkin
5、g permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91671 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliabilit
6、y (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is
7、as shown in the following example: 5962 - 91671 01 Q E X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked d
8、evices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device typ
9、e(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LM1575-ADJ Positive, adjustable, step-down switching voltage regulator 02 LM1575HVADJ Positive, adjustable, step-down switching voltage regulator, high voltage 1.2.3 Device class designa
10、tor. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appe
11、ndix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line X See figure 1 4 Flange mount Y See figur
12、e 1 5 Single row flange mount Z GDFP1-G16 16 Flat pack with gull wing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
13、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91671 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Input voltage (VIN): Device type 01 . 45 V Device type 02 . 63 V ON /OFF pin input voltage -0.3 V
14、 to +VINOutput voltage to ground (steady state) -1 V Power dissipation (PD) Internally limited Storage temperature range . -65C to +150C Junction temperature (TJ) +150C Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC): Case E . 1.7C/W at 1 W Case X . 3.3C/W at
15、 1 W Case Y . 3.8C/W at 1 W Case Z 3.0C/w at 0.5 W Thermal resistance, junction-to-ambient (JA): Case E . 67C/W at 0.5 W, no air flow 28C/W at 0.5 W, 500 LFPM Case X . 45C/W at 0.5 W, no air flow 10C/W at 0.5 W, 500 LFPM Case Y . 68C/W at 0.5 W, no air flow 16C/W at 0.5 W, 500 LFPM Case Z 121C/W at
16、0.5 W, no air flow 73C/W at 0.5 W, 500 LFPM 1.4 Recommended operating conditions. Input voltage (VIN): Device type 01 . 8 V to 40 V Device type 02 . 8 V to 60 V Output voltage range (VOUT) . 1.23 V to 37 V Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Governmen
17、t specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications an
18、d Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standar
19、dization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for Resal
20、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91671 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircui
21、ts. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the
22、 references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall b
23、e in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accorda
24、nce with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A
25、 and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.3 Electric
26、al performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test r
27、equirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-H
28、DBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall b
29、e in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M sh
30、all be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certif
31、icate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers
32、 product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SI
33、ZE A 5962-91671 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max SYSTEM PARAMET
34、ERS Feedback voltage VFBVOUT= VFB, TA= +25C 1 All 1.217 1.243 V 0.2 V ILOAD 1 A, 2/ 8 V +VIN 40 V, 1 1.205 1.255 VOUT= VFB2, 3 1.193 1.267 0.2 V ILOAD 1 A, 2/ 8 V +VIN 60 V, 1 02 1.205 1.261 VOUT= VFB2, 3 1.193 1.273 DEVICE PARAMETERS Feedback bias current IBVOUT= VFB1 All 100 nA 2, 3 500 Saturation
35、 voltage VSATIOUT= 1 A 3/ 1 All 1.2 V 2, 3 1.4 Current limit ICLPeak current, 3/ 1 All 1.7 3.0 A tON 3 s 2, 3 1.3 3.2 Output leakage current ILEAK+VIN= 35 V, 4/ TA= +25C, output = 0 V 1 All 2 mA +VIN= 35 V, 4/ TA= +25C, output = -1 V 30 Quiescent current IQ4/ 1 All 10 mA 2, 3 12 Standby quiescent cu
36、rrent ISTBYON/OFF pin = 5 V “OFF” 1 All 200 A 2, 3 500 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91671 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LE
37、VEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max DEVICE PARAMETERS - Continued Oscillator frequency fO4 All 47 58 kHz 5, 6 43 62 Maximu
38、m duty cycle DC TA= +25C 5/ 9 All 93 % ON /OFF CONTROL ON /OFF pin logic input level VIHVOUT= 0 V 1 All 2.2 V 2, 3 2.4 VILVOUT= 5 V 1 1.0 2, 3 0.8 ON /OFF pin input current IIHON/OFF pin = 5 V “OFF”, TA= +25C 1 All 30 A IILON/OFF pin = 5 V “OFF”, TA= +25C 10 1/ Unless otherwise specified, +VIN= 12 V
39、 and ILOAD= 200 mA. 2/ System parameters: External components such as the catch diode, inductor, input and output capacitors affect switching regulator system performance. 3/ OUTPUT pin sourcing current. No diode, inductor or capacitor connected to output. 4/ FEEDBACK pin removed from output and con
40、nected to 12 V to force the output transistor OFF. 5/ FEEDBACK pin removed from output and connected to 0 V. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with
41、each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A 3.9 Veri
42、fication and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcirc
43、uit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596
44、2-91671 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Case outline X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91671 DEF
45、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 Case outline X continued. Dimensions Symbol Inches Millimeters Notes Min Max Min Max A .285 .305 7.24 7.75 A1 - .085 - 2.16 a .460 .480 11.68 12.19 b .038 .043 .97 1.09 3, 5 D .880 .915 22.35 23.24 D
46、1 .760 .775 19.30 19.69 e .460 .480 11.68 12.19 2 F .060 .070 1.52 1.78 G1 .490 .510 12.45 12.95 L .420 .500 10.67 12.70 L1 - .025 - .64 5 p .151 .161 3.84 4.09 3 q 1.177 1.197 29.90 30.40 R .490 .510 12.45 12.95 3 R1 .168 .178 4.27 4.52 3 18 18 72 72 N 4 4 Note 1, 4 NOTES: 1. The U.S. government pr
47、eferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. 2. These dimensions should be measured at point
48、s .050 inch (1.27 mm) + .005 inch (0.13 mm) - .000 inch (0.00 mm) below seating plane. When gauge is not used, measurement will be made at the seating plane. 3. Two places. 4. The seating plane of the header shall be flat within .001 inch (0.03 mm) concave to .004 inch (0.10 mm) convex inside a .930 inch (23.62 mm) diameter circle on the center of the header and flat within .001 inch (0.03 mm) conca
