1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes made IAW NOR 5962-R184-93. 93-06-21 Monica L. Poelking B Changes made IAW NOR 5962-R017-94. 93-11-02 Monica L. Poelking C Changes made IAW NOR 5962-R076-95. 95-03-03 Monica L. Poelking D Changes made IAW NOR 5962-R159-98. 98-08-05 Raymond
2、 L. Monnin E Make corrections to Figure 1. Terminal connections and to footnotes on Figure 2. Truth table. Update drawing to MIL-PRF-38535 requirements. CFS 00-12-21 Thomas M. Hess F Update the boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-04-23 Thomas M. Hess G Correct
3、title to reflect actual function of the process technology. Update the boilerplate paragraphs to the current MIL-PRF-38535 requirements. - MAA 10-04-12 Thomas M. Hess REV SHET REV G G G G G SHEET 15 16 17 18 19 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13
4、14 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Tim H. Noh APPROVED BY Monica L. Poelking MI
5、CROCIRCUIT, DIGITAL, Bi-CMOS, OCTAL PI-BUS TRANSCEIVER, MONOLITHIC SILICON DRAWING APPROVAL DATE 92-12-30 AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 67268 5962-92317 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E273-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license
6、from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92317 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) a
7、nd space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following exa
8、mple: 5962 - 92317 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 sp
9、ecified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identif
10、y the circuit function as follows: Device type Generic number Circuit function 01 DS1776 Octal Pi-bus transceiver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor
11、self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outl
12、ine letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by I
13、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92317 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC)
14、-0.5 V dc to +7.0 V dc VX, VOHoutput level control voltage (A outputs) . -0.5 V dc to +7.0 V dc A0 - A7, B0 - B7 input voltage (VIN) -0.5 V dc to +5.5 V dc OEBnnullnullnullnullnullnullnull, OEA, LEnullnullnullnullinput voltage (VIN) . -0.5 V dc to +7.0 V dc Input current (IIN) -40 mA to +5 mA Voltag
15、e applied to output in high voltage state (VOUT) -0.5 V to +VCCA0 - A7 current applied to output in low output state (IOUT) 40 mA B0 - B7 current applied to output in low output state (IOUT) 200 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD): Case outline X . 1000
16、 mW Case outline 3 . 740 mW Lead temperature (soldering, 10 seconds). +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ). +175C Thermal resistance, junction-to-ambient (JA): Case outline X . +50.4C/W Case outline 3 . +67.5C/W Case operating temperature (TC)
17、. -55C to +125C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH): 3/ B0 - B7 1.60 V All others . 2.0 V Maximum low level input voltage (VIL): 3/ B0 - B7 1.45 V All others . 0.8 V Maximum input clamp current (IIK): A0 - A7
18、-40 mA All others . -18 mA Maximum high level output current (IOH): A0 - A7 100 A Maximum low level output current (IOL): A0 - A7 20 mA B0 - B7 100 mA Case operating temperature range (TC) . -55C to +125C Minimum setup time, A to LEnullnullnullnull(tsH), (tsL) . 7 ns Minimum hold time, A to LEnullnu
19、llnullnull(thH), (thL) . 0.0 ns Minimum LEnullnullnullnullpulse width low (twL) . 12 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature ma
20、y be exceeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ Tested Go/No-Go. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
21、STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92317 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
22、 this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS M
23、IL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online
24、 at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specifi
25、ed, the issues of these documents cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 17 - A Standardized Description Test Procedure for Characterization of LATCH-UP in CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or
26、from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applic
27、able laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management
28、(QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, a
29、nd physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Te
30、rminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test
31、 circuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92317 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 3.3 El
32、ectrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical tes
33、t requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages w
34、here marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MI
35、L-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as require
36、d in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance sha
37、ll be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for dev
38、ice classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-385
39、35, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affec
40、ts this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
41、 reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROC
42、IRCUIT DRAWING SIZE A 5962-92317 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Conditions 2/ -55C TC+125C +4.5 V VCC +5.5 V unless otherwise specified
43、 Device type and device VCCGroup A subgroups Limits 4/ Unit class 3/ Min Max High level output voltage, An 3006 VOH1For all inputs affecting output under test VIN= VIHor VILVIH= 1.60 V VIL= 1.45 V For all other inputs VIN= VCCor GND IOH= -3 mA VX= 4.5 V All M 4.5 V 1, 2, 3 2.5 4.5 V VOH2For all inpu
44、ts affecting output under test VIN= VIHor VILVIH= 1.60 V VIL= 1.45 V For all other inputs VIN= VCCor GND IOH= -4 mA VX= 4.5 V All M 4.5 V 1, 2, 3 2.5 4.5 Low level output voltage, An 3007 VOL1For all inputs affecting output under test VIN= VIHor VILVIH= 1.60 V VIL= 1.45 V For all other inputs VIN= V
45、CCor GND IOL= 20 mA VX= VCCAll M 4.5 V 1, 2, 3 0.5 V Low level output voltage, Bn 3007 VOL2For all inputs affecting output under test VIN= VIHor VILVIH= 2.0 V VIL= 0.8 V For all other inputs VIN= VCCor GND IOL= 100 mA VX= VCCAll M 4.5 V 1, 2, 3 1.15 V VOL3For all inputs affecting output under test V
46、IN= VIHor VILVIH= 2.0 V VIL= 0.8 V For all other inputs VIN= VCCor GND IOL= 4 mA VX= VCCAll M 5.5 V 1, 2, 3 0.4 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92317 DEFENSE SUP
47、PLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Conditions 2/ -55C TC+125C +4.5 V VCC +5.5 V unless otherwise specified Device type and device VCCGroup
48、 A subgroups Limits 4/ Unit class 3/ Min Max High level input voltage, all inputs except Bn VIH1All M 4.5 V 1, 2, 3 2.0 V High level input voltage, Bn VIH2All M 4.5 V 1, 2, 3 1.60 V Low level input voltage, all inputs except Bn VIL1All M 4.5 V 1, 2, 3 0.8 V Low level input voltage, Bn VIL2All M 4.5 V 1, 2, 3 1.45 V High level output current, An IOH1VIN= VIHor VILVOH= VCC- 2.0 V All M 4.5 V 1, 2, 3 -3.0 mA High level output current, Bn IOH2VIH= 2.0 V, VIL= 0.8 V VOH= 2.1 V All M 5.5 V 1, 2, 3 100.0 A Low level output current, An IOL1VIN= VIHor VILVOL= 0.5 V All M 4.5 V 1, 2, 3 20.0 mA Low
