1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R142-95. 95-05-12 K. Cottongim B Corrected figure 1 to move the side view of case outlines X and Z to the right side of the top view for the correct orientation. Figure 1; removed the min limit for the D dimens
2、ion of 2.880 inches (73.15 mm) for the case outline Z. Redrew entire document. -sld 98-07-01 K. Cottongim C Update drawing boilerplate. Editorial changes throughout. 03-07-18 Raymond Monnin D Add device type 02. Add paragraph 1.5 and note 2. Table I, add footnotes 1/ and 2/. Update paragraph 4.3.5 f
3、or RHA. Updates throughout. 07-06-05 Robert M. Heber E Added footnote 1 to table II, under group C end-point electricals. Updated drawing paragraphs. -sld 09-08-10 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N
4、/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael Jones THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, LINEAR, 12-VOLT, DUAL CHAN
5、NEL, DC/DC CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-05-13 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-93071 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E380-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,
6、-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outline
7、s and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 93071 01 H X X Federal RHA Device Device Ca
8、se Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked
9、with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 MTR2812D/883, MTR2812DF/883 DC-DC converter, 30 W, 12 V output 02 SMTR2812D, SMTR2812DF DC-DC
10、converter, 30 W, 12 V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Lis
11、ting (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where
12、non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but ma
13、y not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the a
14、cquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case
15、 outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 10 Dual-in-line Z See figure 1 10 Flange mount Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
16、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage range -0.5 V dc to +5
17、0 V dc Power dissipation (PD) . 12 W Output power . 30.975 W Lead soldering temperature (10 seconds) . +300C Storage temperature range -65C to +150C 1.4 Recommended operating conditions. Input voltage range +16 V dc to +40 V dc Case operating temperature range (TC) . -55C to +125C 1.5 Radiation feat
18、ures. Maximum total dose available (dose rate = 9 rad(Si)/s): Device type 02 (RHA levels P, L and R) 100 krad (Si) 2/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specif
19、ied herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits
20、. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/
21、or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, h
22、owever, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ These parts may be do
23、se rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition C, tested at 9 rad(Si)/s. Provided by IHSNot for ResaleNo reprod
24、uction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for
25、device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may e
26、liminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable devi
27、ce class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal
28、 connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance
29、characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table
30、 II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data.
31、In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data shou
32、ld include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certif
33、icate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance.
34、 A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers
35、Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93071 DEFENSE SUPPLY CENTER COLUM
36、BUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V dc no external sync, CL= 0 unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output v
37、oltage VOUTIOUT= 1.25 A dc, (+VOUT) 1 01, 02 +11.88 +12.12 V dc 2,3 +11.64 +12.36 P,L,R 1, 2, 3 02 +11.44 +12.74 IOUT= 1.25 A dc, (-VOUT) 1 01, 02 -11.82 -12.18 2,3 -11.58 -12.42 P,L,R 1, 2, 3 02 -11.39 -12.80 Output current IOUTVIN= 16 V dc, 28 V dc, and to 40 V dc, sum of both outputs 1,2,3 01, 02
38、 0.0 2500 mA P,L,R 1, 2, 3 02 0.0 2500 Output ripple voltage VRIPIOUT= 1.25 A B.W. = 10 kHz to 2 MHz 1 01 80 mV p-p 2,3 120 1 02 120 2, 3 150 P,L,R 1, 2, 3 02 160 Line regulation VRLINEVIN= 16 V dc to 40 V dc, IOUT= 1.25 A (+VOUT) 1,2,3 01, 02 50 mV P,L,R 1,2,3 02 60 VIN= 16 V dc to 40 V dc, IOUT= 1
39、.25 A (-VOUT) 1, 2, 3 01, 02 150 P,L,R 1, 2, 3 02 200 Load regulation VRLOADIOUT= 0 to 1.25 A, (+VOUT) 1,2,3 01, 02 50 mV P,L,R 1,2,3 02 60 IOUT= 0 to 1.25 A , (-VOUT) 1, 2, 3 01, 02 150 P,L,R 1, 2, 3 02 200 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking pe
40、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28
41、V dc 0.5 V dc no external sync, CL= 0 unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input current IINIOUT= 0, Inhibit (pin 2) = 0 1,2,3 01, 02 8 mA P,L,R 1, 2, 3 02 10 IOUT= 0, Inhibit (pin 2) = open 1, 2, 3 01, 02 75 P,L,R 1, 2, 3 02 85 Input ripple current IRIPIOUT=
42、1.25 A, B.W. = 10 kHz to 10 MHz 1, 2, 3 01, 02 50 mA p-p P,L,R 1, 2, 3 02 60 Efficiency Eff IOUT= 1.25 A 1 01 79 % 2, 3 76 1 02 77 2, 3 75 P,L,R 1, 2, 3 02 74 Isolation ISO Input to output or any pin to case (except pins 6, 7, and 8) at 500 V dc, TA= +25C 1 01, 02 100 M P,L,R 1 02 100 Capacitive loa
43、d 3/ 4/ CLNo effect on dc performance, TA= +25C 4 01, 02 500 F P,L,R 4 02 500 Power dissipation, load fault PDShort circuit 1 01, 02 10 W 2,3 12 P,L,R 1, 2,. 3 02 12 Switching frequency FSIOUT= 1.25 A 4,5,6 01, 02 550 650 kHz P,L,R 4, 5, 6 02 525 675 External sync range 5/ FSYNCIOUT= 1.25 A, TTL lev
44、el to pin 9 4,5,6 01, 02 500 675 kHz P,L,R 4, 5, 6 02 500 675 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI
45、SION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V dc no external sync, CL= 0 unless otherwise specified Group A subgroups Device type Limits Unit Output response to step transient load
46、changes 6/ VTLOAD50 percent load to/from 100 percent load, Balanced loads 4,5,6 01, 02 -300 +300 mV pk P,L,R 4, 5, 6 02 -400 +400 Recovery time, step transient load changes 4/ 6/ 7/ TTLOAD50 percent load to/from 100 percent load, Balanced loads 4,5,6 01, 02 200 s P,L,R 4, 5, 6 02 300 Output response
47、 to transient step line changes 4/ 8/ VTLINEInput step from 16 V dc to 40 V dc, IOUT= 1.25 A 4,5,6 01, 02 -400 +400 mV pk P,L,R 4, 5, 6 02 -500 +500 Input step from 40 V dc to 16 V dc, IOUT= 1.25 A 4, 5, 6 01, 02 -400 +400 P,L,R 4, 5, 6 02 -500 +500 Recovery time, transient step line changes 4/ 7/ T
48、TLINEInput step from 16 V dc to 40 V dc, IOUT= 1.25 A 4,5,6 01, 02 300 s P,L,R 4, 5, 6 02 300 Input step from 40 V dc to 16 V dc, IOUT= 1.25 A 4,5,6 01, 02 300 P,L,R 4, 5, 6 02 300 Turn-on overshoot 4/ VtonOSIOUT = 1.25 A 4,5,6 01 120 mV pk 4, 5, 6 02 150 P,L,R 4, 5, 6 02 200 Turn-on delay 9/ TonDIOUT = 1.25 A 4,5,6 01, 02 5 ms P,L,R 4, 5, 6 02 6 Load fault recovery 4/ TrLFIOUT = 1.25 A 4,5,6 01, 02 5 ms P,L,R 4, 5, 6 02 8 1/ Post irradiation testing sh
