1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 09-11-03 C. SAFFLE REV SHET REV SHET REV STATUS REV A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY MARCIA B. KELLEHER DEFENSE SUPPLY CENTER COLUMB
2、US COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, 2-CHANNEL MULTIPLEXED VIDEO AMPLIFIER, MONOL
3、ITHIC SILICON DRAWING APPROVAL DATE 93-04-27 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-93117 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E025-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93117 D
4、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlin
5、es and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93117 01 M E A Federal stock class designator RHA
6、 designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA des
7、ignator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number
8、Circuit function 01 TL040 2 channel multiplexed video amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD
9、-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Packag
10、e style E GDIP1-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without
11、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93117 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) 14 V 2/ Input voltage range . -0.2 V to VCC+ 0.2 V GND 0 V Storage tempe
12、rature range . -65C to +150C Lead temperature, 1.6 mm (1/16 inch) from case for 60 seconds, E package +300C Power dissipation (PD) (TA 25C) E and 2 packages . 1375 mW 3/ Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 1.4 Recommended operating condition
13、s. Supply voltage (VCC) 10.8 V to 13.2 V GND 0 V Common mode input voltage (differential input) (VIC) with RL = 2 k . 5 V to 7 V 4/ High level input voltage (VIH), SELECT input . 2 V minimum Low level input voltage (VIL), SELECT input: TA= +25C 0.8 V maximum TA= -55C to +125C 0.7 V maximum Output si
14、nk current (differential outputs), (ISINK) with RL= . 1.5 mA maximum 5/ Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the ex
15、tent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Meth
16、od Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.
17、dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect r
18、eliability. 2/ All voltage value except for differential voltage are with respect to ground terminals. 3/ Derating factor is 11 mW/C for TA 25C. 4/ Tested with equivalent test condition VCC= 6 V 1 V, GND = -6 V 1 V, RAB= 0. 5/ Tested with equivalent test condition VCC= 6 V, GND = -6 V, RAB= 0. Provi
19、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93117 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict bet
20、ween the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requiremen
21、ts for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements f
22、or device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes
23、 Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on fi
24、gure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3
25、.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marke
26、d. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in a
27、ccordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be
28、 a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate
29、of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers produ
30、ct meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class
31、 M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any
32、change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at
33、the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
34、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93117 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Device type Limits 1/ Unit VCC= 12 V, RAB=
35、0 unless otherwise specified Min Max Large signal differential voltage amplification AVDRL= 2 k 2/ 4 01 300 600 V/V 5, 6 300 800Common mode output voltage VOCRL= 2/ 1, 2, 3 01 1.5 3.5 V Maximum peak to peak output voltage swing VOPPRL= 2 k 2/ 4, 5, 6 01 3 V Input offset current IIORL= 2/ 1, 2, 3 01
36、3 A Input bias current IIBRL= 2/ 1, 2, 3 01 17 A Differential output voltage VODRL= , VID= 0, 2/ 1, 2, 3 01 1 V Input resistance, differential inputs riRL= 3/ 1, 2, 3 01 2 k Common mode rejection ratio CMRR VIC= 5 V to 7 V, 4/ RL= 2 k 4, 5, 6 01 60 dB Supply voltage rejection ratio, ( VCC/ VIO) kSVR
37、VCC= 10.8 V to 13.2 V, 5/ RL= 2 k 4, 5, 6 01 50 dB High level input current, select input IIHVIH= 2.0 V, RL= 1, 2, 3 01 0.4 mA Low level input current, select input IILVIL= 0.4 V, RL= 1, 2, 3 01 -20 A Propagation delay time, differential inputs tpdRL= 2 k, VO= 1 V 3/ 9, 10,11 01 35 ns Output rise ti
38、me trRL= 2 k, VO= 1 V 3/ 9, 10,11 01 50 ns Supply current ICCVCC= 13.2 V, RL= , outputs open 1, 2, 3 01 15 mA Bias output voltage RL= 1, 2, 3 01 5 7 V 1/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conve
39、ntional current flow out of a device terminal. 2/ Tested with equivalent test condition VCC= 6 V, GND = -6 V, RAB= 0. 3/ This parameter is guaranteed but not tested. 4/ Tested with equivalent test condition VCC= 6 V 1 V, GND = -6 V 1 V, RAB= 0. 5/ Tested with equivalent test condition VCC= 6 V 0.6 V
40、, GND = -6 V 0.6 V, RAB= 0. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93117 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case ou
41、tlines E 2 Terminal number Terminal symbol 1 1 IN+ NOT CONNECTED 2 1 IN- 1 IN+ 3 GAIN ADJUST 1A 1 IN- 4 GAIN ADJUST 1B GAIN ADJUST 1A 5 BIAS OUTPUT NOT CONNECTED 6 SELECT GAIN ADJUST 1B 7 GND BIAS OUT 8 OUT+ SELECT 9 OUT- GND 10 GND OUT+ 11 VCCNOT CONNECTED 12 VCC(R) OUT- 13 GAIN ADJUST 2A GND 14 GA
42、IN ADJUST 2B VCC15 2 IN- VCC(R) 16 2 IN+ NOT CONNECTED 17 - GAIN ADJUST 2A 18 - GAIN ADJUST 2B 19 - 2 IN- 20 - 2 IN+ FIGURE 1. Terminal connections. Select Channel L 1 ( 1 IN+ / 1 IN- ) H 2 ( 2 IN+ / 2 IN- ) H = High voltage level L = Low voltage level FIGURE 2. Truth table. Provided by IHSNot for R
43、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93117 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, s
44、ampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures
45、 shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accord
46、ance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer u
47、nder document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C
48、, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be
