1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R131-95. 95-05-10 K. A. Cottongim B Corrected figure 1 to move the side view of case outline X and Z to the right side of the top view for the correct orientation. Removed the min limit for the D dimension of 2
2、.880 inches (73.15 mm) for the case outline Z. Redrew entire document. -sld 98-09-18 K. A. Cottongim C Paragraph 4.2.a.2, correct from TCto TA. Update drawing boilerplate. Editorial changes throughout. 03-07-16 Raymond Monnin D Added footnote 1 to table II, under group C end-point electricals. Updat
3、ed drawing paragraphs. -sld 09-09-08 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING C
4、HECKED BY Michael Jones THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, LINEAR, 12-VOLT, DUAL CHANNEL, DC/DC CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-10-21 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268
5、 5962-94660 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E383-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94660 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2
6、234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardn
7、ess assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 94660 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) /
8、 Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit func
9、tion as follows: Device type Generic number Circuit function 01 MHD2812D/883, MHD2812DF/883 DC-DC converter, 15 W, 12 V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of M
10、IL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applicatio
11、ns. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limite
12、d temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of th
13、at class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufac
14、turers internal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 10 Dual-in-line Z See figure 1 10 Flange m
15、ount Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94660 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish shall be a
16、s specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage range -0.5 V dc to +50 V dc Power dissipation (PD), short circuit . 10 W Output power . 15.5 W Lead soldering temperature (10 seconds) . +300C Storage temperature range -65C to +150C 1.4 Recommended operating conditions. In
17、put voltage range +16 V dc to +40 V dc Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwis
18、e specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface
19、Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization
20、 Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicab
21、le laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or net
22、working permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94660 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classe
23、s D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, mod
24、ify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2
25、 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections
26、shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electric
27、al test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the m
28、anufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot s
29、ample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (
30、DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirement
31、s of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance
32、with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall app
33、ly: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify
34、 the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table
35、II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94660 DEFENSE SUPPLY CENTER COLUMBUS C
36、OLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C VIN= 28 V dc 0.5 V dc no external sync, CL= 0 unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output voltage VOUT
37、IOUT= 0.625 A dc, (main) 1 01 +11.88 +12.12 V dc 2,3 +11.64 +12.36 IOUT= 0.625 A dc, (dual) 1 -11.82 -12.18 2,3 -11.58 -12.42 Output current IOUTVIN= 16 V dc, 28 V dc, and to 40 V dc, sum of both outputs 1,2,3 01 0.0 1250 mA Output ripple voltage VRIPIOUT= 0.625 A B.W. = 10 kHz to 2 MHz 1 01 80 mV p
38、-p 2,3 120 Line regulation VRLINEVIN= 16 V dc to 40 V dc, IOUT= 0.625 A (main) 1,2,3 01 50 mV VIN= 16 V dc to 40 V dc, IOUT= 0.625 A (dual) 150 Load regulation VRLOADIOUT= 0 to 0.625 A , (main) 1,2,3 01 50 mV IOUT= 0 to 0.625 A , (dual) 150 Input current IINIOUT= 0, Inhibit (pin 2) = 0 1,2,3 01 8 mA
39、 IOUT= 0, Inhibit (pin 2) = open 1, 2, 3 01 75 Input ripple current IRIPIOUT= 0.625 A, B.W. = 10 kHz to 10 MHz 1, 2, 3 01 50 mA p-p Efficiency Eff IOUT= 0.625 A 1 01 79 % 2, 3 76 Isolation ISO Input to output or any pin to case (except pins 6, 7, and 8) at 500V dc, TA= +25C 1 01 100 M Capacitive loa
40、d 1/ 2/ CLNo effect on dc performance, TA= +25C 4 01 500 F See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94660 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO
41、N LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued Test Symbol Conditions -55C TC +125C VIN= 28 V dc 0.5 V dc no external sync, CL= 0 unless otherwise specified Group A subgroups Device type Limits Unit Min Max Power dissipation, load fault PDShort ci
42、rcuit 1,2,3 01 10 W Switching frequency FSIOUT= 0.625 A 4,5,6 01 550 650 kHz External sync range 3/ FSYNCIOUT= 0.625 A, TTL level to pin 9 4,5,6 01 500 675 kHz Output response to step transient load changes 4/ VTLOAD50 percent load to/from 100 percent load, Balanced loads 4,5,6 01 -300 +300 mV pk Re
43、covery time, step transient load changes 2/ 4/ 5/ TTLOAD50 percent load to/from 100 percent load, Balanced loads 4,5,6 01 200 s Output response to transient step line changes 2/ 6/ VTLINEInput step from 16 V dc to 40 V dc, IOUT= 0.625 A 4,5,6 01 -400 +400 mV pk Input step from 40 V dc to 16 V dc, IO
44、UT= 0.625 A -400 +400 Recovery time, transient step line changes 2/ 5/ TTLINEInput step from 16 V dc to 40 V dc, IOUT= 0.625 A 4,5,6 01 300 s Input step from 40 V dc to 16 V dc, IOUT= 0.625 A 300 Turn-on overshoot 2/ VtonOSIOUT = 0.625 A 4,5,6 01 120 mV pk Turn-on delay 7/ TonDIOUT = 0.625 A 4,5,6 0
45、1 5 ms Load fault recovery 2/ 5/ TrLFIOUT = 0.625 A 4,5,6 01 5 ms 1/ Capacitive load may be any value from 0 to the maximum limit without compromising dc performance. 2/ Parameter shall be tested as part of device characterization and after design and process changes; therefore, the parameters shall
46、 be guaranteed to the limits specified in table I. 3/ A TTL level waveform (VIH= 4.5 V minimum, VIL= 0.8 V maximum) with a 50 percent 10 percent duty cycle applied to the sync pin (pin 9) within the sync range frequency shall cause the converters switching frequency to become synchronous with the fr
47、equency applied to the sync input pin (pin 9). 4/ Load step transition time 10 microseconds maximum. 5/ Recovery time is measured from the initiation of the transient until VOUThas returned to within 1 percent of VOUT final value. 6/ Input step transition time greater than 10 microseconds. 7/ Turn-o
48、n delay time measurement is either for a step application of power at the input or the removal of a ground signal from the inhibit pin (pin 2) while power is applied to the input. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94660 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Case outline X. Symbol Milli
