1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to reflect current requirements. -rrp 01-11-16 R. Monnin B Redrawn. Update paragraphs to MIL-PRF-38535 requirements. - drw 13-06-13 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2
2、3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Dan Wonnell DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Sandra Rooney APPROVED BY Mic
3、hael A. Frye MICROCIRCUIT, DIGITAL-LINEAR, FAST, SERIAL, 16-BIT, A/D CONVERTER, MULTICHIP SILICON DRAWING APPROVAL DATE 96-01-16 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-95592 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E462-13 Provided by IHSNot for ResaleNo reproduction or networking per
4、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95592 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device clas
5、ses Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the
6、 following example: 5962 - 95592 01 M E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the
7、 MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device t
8、ype identifies the circuit function as follows: Device type Generic number Circuit function 01 AD677 16-bit, 100 kSPS, serial, A/D converter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requireme
9、nts documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline is as designated in MIL-STD-1835
10、as follows: Outline letter Descriptive designator Terminals Package style E CDIP2-T16 16 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networ
11、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95592 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ VCCto VEE-0.3 V dc to +26.4 V dc VDDto DGND . -0.3 V dc to +7 V dc VCCto AGND .
12、-0.3 V dc to +18 V dc VEEto AGND -18 V dc to +0.3 V dc AGND to DGND . 0.3 V dc Digital inputs (CAL, SAMPLE, CLK) to DGND . 0 V dc to +5.5 V dc Analog inputs (VIN, VREF, AGND SENSE) to AGND . (VCC+ 0.3 V) to (VEE 0.3 V) Power dissipation (PD): VREF= 10 V 630 mW VREF= 5 V 530 mW Thermal resistance, ju
13、nction-to-case (JC) . 15C/W Thermal resistance, junction-to-ambient (JA) 80C/W Storage temperature range -65C to +150C Lead temperature (soldering, 10 sec) +300C 1.4 Recommended operating conditions. 2/ Ambient operating temperature range (TA) -55C to +125C Positive analog supply voltage (VCC) . 11.
14、4 V dc to 12.6 V dc Negative analog supply voltage (VEE) -11.4 V dc to 12.6 V dc Digital supply voltage (VDD) . 4.5 V dc to 5.5 V dc Analog reference voltage (VREF) 5 V dc to 10 V dc Analog input voltage range (VIN) -VREFto VREFAnalog ground sense voltage -0.1 V dc to 0.1 V dc 2. APPLICABLE DOCUMENT
15、S 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE
16、 SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of
17、 Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the
18、 event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rati
19、ng may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ AGND and DGND tied at ADC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5
20、962-95592 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manu
21、facturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein
22、. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance
23、with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limi
24、ts are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shal
25、l be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this
26、 option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V sh
27、all be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order t
28、o supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Mar
29、itime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of c
30、onformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notificat
31、ion to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acq
32、uiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing sh
33、all be in microcircuit group number H (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95592 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM
34、2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C, VCC= +12 V, VEE= -12 V, VDD= +5 V, VREF= 10 V, VIH= 2.0 V, VIL= 0.8 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Logic input high voltage VIH1, 2, 3 01 2.0 V Logic inp
35、ut low voltage VIL1, 2, 3 01 0.8 V Logic input current ILINVIH= 5 V, VIL= 0 V 1, 2, 3 01 -10 +10 A Logic output high voltage VOHIOH= 0.5 mA 1, 2, 3 01 2.4 V Logic output low voltage VOLIOL= 1.6 mA 1, 2, 3 01 0.4 V Power supply current ICCVREF= 10 V, device converting 1, 2, 3 01 24 mA IEE-24 IDD5 ICC
36、VREF= 5 V, device converting 20 IEE-20 IDD5 Power dissipation PDVREF= 10 V 1, 2, 3 01 630 mW VREF= 5 V 530 Integral nonlinearity INL all codes 1 01 1.5 LSB 2, 3 2.0 Differential nonlinearity DNL all codes 1/ 1, 2, 3 01 16 Bits Bipolar zero error BPZEcode = 32767.5 1 01 3.0 LSB 2, 3 4.0 Negative full
37、-scale error ANcode = 0.5 1 01 3.0 LSB 2, 3 4.0 Positive full-scale error APcode = 65535.5 1 01 3.0 LSB 2, 3 4.0 Voltage reference input VREF1, 2, 3 01 5 10 V Signal-to-noise + distortion S/(N+D) fIN= 1 kHz 2/ 4, 5, 6 01 89 dB Total harmonic distortion THD fIN= 1 kHz 2/ 4, 5, 6 01 -95 dB Conversion
38、time tCsee figure 2 9, 11 01 10 s 10 13.3 CLK period tCLKsee figure 2 9, 11 01 480 ns 10 670 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95592 DLA LAND AND MARITIME COLUMBUS
39、, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics continued. Test Symbol Conditions -55C TA +125C, VCC= +12 V, VEE= -12 V, VDD= +5 V, VREF= 10 V, VIH= 2.0 V, VIL= 0.8 V Group A subgroups Device type Limits Unit unless otherwise specified
40、 Min Max Calibration time tCTsee figure 2 9, 10, 11 01 85532 tCLKSampling time (included in tC) tSsee figure 2 9, 10, 11 01 2 s CAL to BUSY delay tCALBsee figure 2 9, 10, 11 01 50 ns Last CLK to SAMPLE delay tLCSsee figure 2 9, 10, 11 01 2.1 s SAMPLE to BUSY delay tSBsee figure 2 9, 10, 11 01 75 ns
41、CLK high tCHsee figure 2 9, 10, 11 01 50 ns CLK low tCLsee figure 2 9, 10, 11 01 50 ns 1STCLK delay tFCDsee figure 2 9, 10, 11 01 50 ns SCLK low tSCLsee figure 2 9, 10, 11 01 35 ns CLK to BUSY delay tCBsee figure 2 9, 10, 11 01 350 ns CLK to SDATA valid tCDsee figure 2 9, 10, 11 01 50 200 ns CLK to
42、SCLK high tCSHsee figure 2 9, 10, 11 01 75 350 ns SDATA to SCLK high tDSHsee figure 2 9, 10, 11 01 35 ns Sample low tSLsee figure 2 9, 10, 11 01 100 ns CAL HIGH tCALHsee figure 2 9, 10, 11 01 50 ns 1/ Minimum resolution for which “no missing codes” is guaranteed. 2/ VIN= 0.05 dB, fIN= 1 kHz, all mea
43、surements referred to a 0 dB (20 Vp-p) input signal. The full Nyquist bandwidth is used for all values. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95592 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 RE
44、VISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline E Terminal number Terminal symbol 1 SAMPLE 2 CLK 3 SDATA 4 DGND 5 VCC6 NC 7 NC 8 AGND 9 AGND SENSE 10 VIN11 VREF12 VEE13 VDD14 SCLK 15 BUSY 16 CAL NC = No connect FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo
45、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95592 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Note: Shaded portions of input signals are optional. For best performance, it is recommende
46、d that these signals be held low except when explicitly shown high. FIGURE 2. Timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95592 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION L
47、EVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall no
48、t affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices pr
