1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Redraw. Update drawing to current requirements. drw 10-02-09 Charles F. Saffle REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Sandra Rooney DEFENSE SUPPLY CENTER COLUMBUS COLUMB
2、US, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Sandra Rooney APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL-LINEAR, 16-BIT, DUAL DIGITAL TO ANALOG CONVERTER, MONOLIT
3、HIC SILICON DRAWING APPROVAL DATE 95-12-15 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-95616 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E158-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95616 DE
4、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outline
5、s and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95616 01 M X A Federal stock class designator RHA
6、designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA des
7、ignator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circ
8、uit function 01 SP9320B Dual, 16-bit, D/A converter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 complia
9、nt, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline is as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figur
10、e 1 28 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5
11、962-95616 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VDD) to ground -0.3 V dc to +17.0 V dc Digital input voltage to ground -0.3 V dc to VDD+ 0.3 V dc VREF Aor VREF Bto ground . 25 V dc Powe
12、r dissipation (PD) to +75C 250 mW Derates above +75C by 6 mW/C Junction temperature (TJ) . +150C Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds) . +300C 1.4 Recommended operating conditions. Supply voltage range (VDD) +14.25 V dc to +15.75 V dc Ambient operating temperatur
13、e range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in th
14、e solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPAR
15、TMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D
16、, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption h
17、as been obtained. _ 1/ Do not apply voltages higher than VDDor less than ground potential on any terminal other than VREF Aor VREF B. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95616 DEFENSE SUPPLY CENTE
18、R COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality
19、Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, cons
20、truction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein
21、and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Block diagram. The block diagram shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirr
22、adiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requireme
23、nts shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is
24、not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall
25、 be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certifica
26、te of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order t
27、o be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-
28、PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lo
29、t of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review
30、for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment
31、 for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 56 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95616 DEFENSE SUPPL
32、Y CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C VDD= +15 V dc Group A subgroups Device type Limits Unit unless otherwise specified Min Max Resolution RES 01 16 Bits Input h
33、igh voltage VIH1/ 1, 2, 3 01 2.4 V Input low voltage VIL1/ 1, 2, 3 01 0.8 V Input current IIN2/ 1, 2, 3 01 10.0 A Reference input voltage range VREF3/ 1, 2, 3 01 25 V Offset error OE TA= +25C 4/ 1 01 50 mV Offset drift OE/ T TA= +125C, -55C 4/ 2, 3 01 1 ppm/CGain accuracy AE TA= +25C 5/ 1 01 0.2 % F
34、SR Gain drift AE/ T TA= +125C, -55C 6/ 2, 3 01 10 ppm/CIntegral linearity error INL TA= +25C 7/ 1 01 4 LSB Integral linearity error drift INL/ T TA= +125C, -55C 7/ 2, 3 01 1 ppm/CDifferential linearity error DNL TA= +25C 8/ 1 01 5 LSB Differential linearity error drift DNL/ T TA= +125C, -55C 8/ 2, 3
35、 01 1 ppm/CFunctional test FT See 4.4.1b 7, 8 01 Supply current IDD1, 2, 3 01 10 mA 1/ Inputs must not exceed VDDor go below -0.3 V dc. 2/ Inputs are MOS gates. IINis typically less than 1 A at TA= +25C. 3/ Guaranteed by design, but not tested. 4/ Unipolar; using the internal feedback resistor with
36、nulled external amplifier on a constant +25C ambient (offset doubles every 10C). 5/ Gain accuracy and stability assume the use of the internal feedback resistor. 6/ Device type 01 is designed to be used in those applications where current output is virtual ground. Example: the summing junction of an
37、 operational amplifier in the inverting mode. The internal feedback resistor must be used to achieve temperature tracking. 7/ Integral linearity is measured as the arithmetic peak value of the magnitudes of the greatest positive deviation and the greatest negative deviation from the theoretical valu
38、e of any given input combination. 8/ Differential linearity is the deviation of an output step from the theoretical value of 1 LSB for any two adjacent digital input codes.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING
39、SIZE A 5962-95616 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Case outline X Symbol Millimeters Inches Min Max Min Max A 2.36 3.02 0.093 0.119 b 0.41 0.51 0.016 0.020 b1 1.02 1.52 0.040 0.060 c 0.23 0.30 0.009 0.012 D 35.20 35.92 1.386 1.41
40、4 E 15.24 15.75 0.600 0.620 e 2.41 2.67 0.095 0.105 eA 15.24 BSC 0.600 BSC e3 32.89 33.15 1.295 1.305 L 4.45 TYP 0.175 TYP S 1.27 0.050 Q 1.02 1.52 0.040 0.060 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case o
41、f problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. 3. Identification area; a notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The
42、 manufacturers identification shall not be used as a pin one identification mark. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95616 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43
43、218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline X Terminal number Terminal symbol 1 Analog Ground 2 IOUT A3 RFB A4 VREF A5 Digital Ground 6 Bit 1 (MSB) 7 Bit 2 8 Bit 3 9 Bit 4 10 Bit 5 11 Bit 6 12 Bit 7 13 Bit 8 14 Bit 9 15 Bit 10 16 Bit 11 17 Bit 12 18 Bit 13 19
44、Bit 14 20 Bit 15 21 Bit 16 22 DACA /DACB 23 CS 24 WR 25 VDD(+5 V dc) 26 VREF B27 RFB B28 IOUT BFIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95616 DEFENSE SUPPLY CENTER COLUM
45、BUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 DAC A / DAC B WR CS Function 0 0 0 DAC A enabled 1 0 0 DAC B enabled X 1 X No data transfer X X 1 Device not selected FIGURE 3. Truth table. FIGURE 4. Block diagram. Provided by IHSNot for ResaleNo reproduction or networkin
46、g permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95616 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures
47、 shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-
48、PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condi
