1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. -rrp 01-09-26 R. Monnin B Redrawn. Paragraphs updated to MIL-PRF-38535 requirements. - drw 13-02-06 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5
2、6 7 8 9 PMIC N/A PREPARED BY Sandra Rooney DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Sandra Rooney APPROVED BY Michael A. Fr
3、ye MICROCIRCUIT, LINEAR, CMOS, DUAL SPST ANALOG SWITCH, MONOLITHIC SILICON DRAWING APPROVAL DATE 95-05-17 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-95629 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E259-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
4、rom IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95629 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space applicati
5、on (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95629
6、 01 Q C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA lev
7、els and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 DG200A Dual SPST analog switch 1.2.3 Device class designator. The device class
8、designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows: Outline letter Descriptive des
9、ignator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line I MACY1-X10 10 Metal can 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
10、 MICROCIRCUIT DRAWING SIZE A 5962-95629 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (between V+ and V-) . 44 V dc Digital input voltage (VIN) . V- -2 V dc to V+ +2 V dc Analog input voltage (VS) . V- -
11、2 V dc to V+ +2 V dc Current (any terminal except S or D) . 30 mA dc Continuous current, S or D 30 mA dc Peak current, S or D (pulsed at 1 ms, 10 percent duty cycle maximum) . 100 mA dc Storage temperature range -65C to +150C Power dissipation (PD) . 750 mW 2/ Lead temperature (soldering, 10 seconds
12、) +275C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +150C V+ to ground +25 V V- to ground . -25 V 1.4 Recommended operating conditions. Positive supply voltage (V+) +15 V dc Negative supply voltage (V-) -15 V dc Minimum digital high level input voltage (VIH
13、) +2.4 V dc Maximum digital low level input voltage (VIL) . +0.8 V dc Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent
14、 specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method S
15、tandard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/
16、quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in thi
17、s document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ For cas
18、e C derate at 10 mW/C above TA= +75C. For case I, derate at 6 mW/C above TA= +75C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95629 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET
19、4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not
20、 affect the form, fit, or function as described herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outlines. The case outlines shall be in accordance wit
21、h 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits
22、are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall b
23、e marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this op
24、tion, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. 3.6 Certificate of compliance. Fo
25、r device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply
26、 for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of micro
27、circuits delivered to this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95629 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical per
28、formance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Analog signal range VS3/ 1, 2, 3 01 15 V Drain-source ON resistance RDS(ON)VD= 10 V, VIN= 0.8 V, ID= - 1 mA 1, 3 01 70 2 100 Off input leakage current IS(
29、OFF)VIN= 2.4 V, VS= 14 V, VD= + 14 V 1 01 2 nA 2, 3 100 Off output leakage current ID(OFF)VIN= 2.4 V, VS= 14 V, VD= + 14 V 1 01 2 nA 2, 3 100 On leakage current ID(ON)VIN= 0.8 V, VD= VS= 14 V 1 01 2 nA 2, 3 200 Low level input voltage VIL1, 2, 3 01 0.8 V High level input voltage VIH1, 2, 3 01 2.4 V
30、Low level input leakage current IILVIN= 0 V 1 01 0.5 A 2 10 High level input leakage current IIHVIN= 2.4 V, 15 V 1 01 0.5 A 2 1.0 Off isolation VISOTA= +25C, f = 200 kHz, Vgen= 1 VP-P, See 4.4.1c 4/ 4 01 60 dB Crosstalk between channels VCTTA= +25C, f = 200 kHz, Vgen= 1 VP-P, See 4.4.1c 4/ 4 01 60 d
31、B Switch ON time tONRL= 1 k, CL= 100 pF, VIH= +3 V, VIL= 0 V 9, 10, 11 01 1000 ns Switch OFF time tOFFRL= 1 k, CL= 100 pF, VIH= +3 V, VIL= 0 V 9 01 425 ns 10, 11 650 Positive supply current I+ VIN= 0 V 1, 2 01 1.5 mA 3 2.0 VIN= 2.4 V 1, 2 1.5 3 2.0 Negative supply current I- VIN= 0 V 1, 2 01 -1.5 mA
32、 3 -2.0 VIN= 2.4 V 1, 2 -1.5 3 -2.0 1/ Unless otherwise specified, V+ = +15 V dc and V- = -15 V dc. 2/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 3/ G
33、uaranteed, if not tested, to the limits specified. 4/ Tested initially and after any design changes which may affect these parameters. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95629 DLA LAND AND MARITI
34、ME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C I Terminal number Terminal symbols 1 IN2IN12 NC IN23 GND GND 4 NC S25 S2D26 D2V- 7 V- VREF8 VREFD19 D1S110 S1V+ 11 NC - 12 V+ - 13 NC - 14 IN1- NC = No connect FIGURE 1. Terminal connections. P
35、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95629 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device clas
36、ses Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. For device classes Q and
37、V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternative
38、s shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to t
39、he acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II
40、herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Ins
41、pections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, a
42、nd E inspections and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (VISOand VCTtests) shall be measured only for the initial test and after process o
43、r design changes which may affect these parameters. Subgroup 4 consists of five devices being tested at TA= +25C with no failures allowed. If not more than one failure is found a second sample of five devices is permitted with no further failures. Provided by IHSNot for ResaleNo reproduction or netw
44、orking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95629 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table II
45、I) Device class Q Device class V Interim electrical parameters (see 4.2) - - - - - - Final electrical parameters (see 4.2) 1, 2, 3, 9 1/ 1, 2, 3, 9 1/ Group A test requirements (see 4.4) 1, 2, 3, 4, 9, 10, 11 2/ 1, 2, 3, 4, 9, 10, 11 2/ Group C end-point electrical parameters (see 4.4) 1 1, 2, 3, 9,
46、 10, 11 Group D end-point electrical parameters (see 4.4) 1 1 Group E end-point electrical parameters (see 4.4) - - - - - - 1/ PDA applies to subgroup 1. 2/ For subgroup 4, five devices shall be tested, with no failures allowed. If not more than one failure is found a second sample of five devices i
47、s permitted with no further failures. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approv
48、ed alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturers TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specifie
