1、NOTICE OF REVISION (NOR)THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.1. DATE(YYMMDD)97-07-24Form ApprovedOMB No. 0704-0188Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewinginstructions, searching exi
2、sting data sources, gathering and maintaining the data needed, and completing and reviewing thecollection of information. Send comments regarding this burden estimate or any other aspect of this collection of information,including suggestions for reducing this burden, to Department of Defense, Washi
3、ngtion Headquarters Services, Directorate forInformation Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office ofManagement and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.PLEASE DO NOT RETURNYOUR COMPLETED FORM TO EIT
4、HER OF THESE ADDRESSES. RETURN COMPLETED FORM TO THE GOVERNMENTISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THISFORM.2. PROCURINGACTIVITY NO.3. DODAAC4. ORIGINATORb. ADDRESS (Street, City, State, Zip Code)Defense Supply Center Columbus5. CAGE CODE672686
5、. NOR NO.5962-R379-97a. TYPED NAME (First, Middle Initial,Last)3990 East Broad StreetColumbus, OH 43216-50007. CAGE CODE672688. DOCUMENT NO.5962-965989. TITLE OF DOCUMENTMICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, 32-STAGE STATICLEFT/RIGHT SHIFT REGISITER, MONOLITHIC SILICON10. REVISION LETTER1
6、1. ECP NO.No users listed.a. CURRENTBb. NEWC12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIESAll13. DESCRIPTION OF REVISIONSheet 1: Revisions ltr column; add “C“.Revisions description column; add “Changes in accordance with NOR 5962-R379-97“.Revisions date column; add “97-07-24“.Revision level
7、 block; add “C“.Rev status of sheets; for sheets 21 change from “B“ to “C”.Rev status of sheets; for sheets 22 change from “B“ to “C”.Sheet 21: NOR 5962-R209-97 sheet 7 of Appendix A for Die Physical Dimensions for Die Thickness change from “21 +/-1 mils” to “20 +/1 mils”Revision Level Block: change
8、 from “B” to “C”Sheet 22: NOR 5962-R209-97 sheet 8 of Appendix A for Interface Materials for Glassivation Type change from “Phosphorous doped SIO2” to “PSG “ for Assembly Related Information for Substrate Potential change from “ Tied to VSS” to “Floating or Tied to VDD “Revision Level Block: change
9、from “B” to “C”14. THIS SECTION FOR GOVERNMENT USE ONLYa. (X one)X (1) Existing document supplemented by the NOR may be used in manufacture.(2) Revised document must be received before manufacturer may incorporate this change.(3) Custodian of master document shall make above revision and furnish rev
10、ised document.b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENTDSCC-VAc. TYPED NAME (First, Middle Initial, Last)d. TITLEChief, Custom Microelectronicse. SIGNATURERAYMOND MONNINf. DATE SIGNED(YYMMDD)97-07-2415a. ACTIVITY ACCOMPLISHING REVISIONDSCC-VAb. REVISION COMPLETED (Signature)RONALD COUC
11、Hc. DATE SIGNED(YYMMDD)97-07-24DD Form 1695, APR 92 Previous editions are obsolete.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NOTICE OF REVISION (NOR)THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.1. DATE(YYMMDD)97-03-
12、14Form ApprovedOMB No. 0704-0188Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing instructions, searching existing data sources,gathering and maintaining the data needed , and completing and reviewing the collection of informat
13、ion. Send comments regarding this burden estimate or any otheraspect of thi s collection of information, including suggestions for reducing this burden, to Department of Defense, Washingtion Headquarters Services, Directoratefor Information Operations and Reports, 1215 Jefferson Davis Highway, Suite
14、 1204, Arlington, VA 22202-4302, and to the Office of Management and Budget,Paperwork Reduction Project (0704-0188), Washington, DC 20503.PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THES E ADDRESSED. RETURN COMPLETED FORM TO THE GOVERNMENT ISSUINGCONTRACTING OFFICER FOR THE CONTRACT/ PROCU
15、RING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM.2. PROCURINGACTIVITY NO.3. DODAAC4. ORIGINATORb. ADDRESS (Street, City, State, Zip Code)Defense Supply Center, Columbus3990 East Broad StreetColumbus, OH 43216-50005. CAGE CODE672686. NOR NO.5962-R209-97a. TYPED NAME (First, Middle Initial,Last)7. C
16、AGE CODE672688. DOCUMENT NO.5962-965989. TITLE OF DOCUMENTMICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, 32-STAGESTATIC LEFT/RIGHT SHIFT REGISTER, MONOLITHIC SILICON 10. REVISION LETTER11. ECP NO.No users listeda. CURRENTAb. NEWB12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIESAll13. DESCRIP
17、TION OF REVISIONSheet 1: Revisions ltr column; add “B“.Revisions description column; add “Changes in accordance with NOR 5962-R209-97“.Revisions date column; add “97-03-14“.Revision level block; add “B“.Rev status of sheets; for sheets 1, 4, and 16 through 22, add “A“.Sheet 4: Add new paragraph whic
18、h states; “3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.“Revision level block; add “B“.Sheet 16 through 22: Add attached appendix A.CONTINUED ON NEXT SHEET14. THIS SECTION FOR GOVERNMENT USE ONLYa. (X one) X (1) Existing document supplemented by
19、the NOR may be used in manufacture.(2) Revised document must be received before manufacturer may incorporate this change.(3) Custodian of master document shall make above revision and furnish revised document.b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENTDSCC-VACc. TYPED NAME (First, Middle
20、 Initial, Last)MONICA L. POELKINGd. TITLECHIEF, CUSTOM MICROELECTRONICS TEAMe. SIGNATUREMONICA L. POELKINGf. DATE SIGNED(YYMMDD)97-03-1415a. ACTIVITY ACCOMPLISHING REVISIONDSCC-VACb. REVISION COMPLETED (Signature)TIN H. LEc. DATE SIGNED(YYMMDD)97-03-14DD Form 1695, APR 92 Previous editions are obsol
21、ete.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMILITARY DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSDAYTON, OHIO 43216-5000SIZEA 5962-96598REVISION LEVELBSHEET16DESC FORM 193AJUL 94APPENDIX AAPPENDIX A FORMS A PART OF SMD 5962-96598Document No
22、: 5962-96598Revision: BNOR No: 5962-R209-97Sheet: 2 of 810. SCOPE10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the QualifiedManufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturersapp
23、roved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices usingchip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting ofmilitary high reliability (device class Q) and space appli
24、cation (device Class V) are reflected in the Part or Identification Number(PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.10.2 PIN. The PIN shall be as shown in the following example:5969 R 96598 01 V 9 A | | | | | | | | | | | | | | | |Federal RH
25、A Device Device Die DieStock class designator type class code Detailsdesignator (see 10.2.1) (see 10.2.2) designator (see 10.2.4)_ _/ (see 10.2.3) /Drawing Number10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. Adash (-) indicates a
26、non-RHA die.10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:Device type Generic number Circuit function01 40100B Radiation Hardened, CMOS, 32-stage static Left/Right shift register.Provided by IHSNot for ResaleNo reproduction or networking permitted without l
27、icense from IHS-,-,-STANDARDMILITARY DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSDAYTON, OHIO 43216-5000SIZEA 5962-96598REVISION LEVELBSHEET17DESC FORM 193AJUL 94APPENDIX AAPPENDIX A FORMS A PART OF SMD 5962-96598Document No: 5962-96598Revision: ANOR No: 5962-R209-97Sheet: 3 of 810.2.3 Device class design
28、ator.Device class Device requirements documentationQ or V Certification and qualification to the die requirements of MIL-PRF-38535.10.2.4 Die Details. The die details designation shall be a unique letter which designates the dies physical dimensions,bonding pad location(s) and related electrical fun
29、ction(s), interface materials, and other assembly related information, for eachproduct and variant supplied to this appendix.10.2.4.1 Die Physical dimensions.Die Types Figure number01 A-110.2.4.2 Die Bonding pad locations and Electrical functions.Die Types Figure number01 A-110.2.4.3 Interface Mater
30、ials.Die Types Figure number01 A-110.2.4.4 Assembly related information.01 A-110.3 Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details.20. APPLICABLE DOCUMENTS20.1
31、 Government specifications, standards, bulletin, and handbooks. Unless otherwise specified, the followingspecifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index ofSpecifications and Standards specified in the solicitation, form a part of
32、 this drawing to the extent specified herein.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMILITARY DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSDAYTON, OHIO 43216-5000SIZEA 5962-96598REVISION LEVELBSHEET18DESC FORM 193AJUL 94APPENDIX AAPPENDIX A
33、FORMS A PART OF SMD 5962-96598Document No: 5962-96598Revision: ANOR No: 5962-R209-97Sheet: 4 of 8SPECIFICATIONMILITARYMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSMIL-STD-883 - Test Methods and Procedures for Microelectronics.HANDBOOKMILITARYMIL-HDBK-103 - L
34、ist of Standardized Military Drawings (SMDs).(Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisitionfunctions should be obtained from the contracting activity or as directed by the contracting activity).20.2 Order of precedenc
35、e. In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing shall take precedence.30. REQUIREMENTS30.1 Item Requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified
36、 herein or as modified in the device manufacturers Quality Management (QM) plan. Themodification in the QM plan shall not effect the form, fit or function as described herein.30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as specifiedin M
37、IL-PRF-38535 and the manufacturers QM plan, for device classes Q and V and herein.30.2.1 Die Physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1.30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical fu
38、nctions shall be asspecified in 10.2.4.2 and on figure A-1.30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1.30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1.Provid
39、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMILITARY DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSDAYTON, OHIO 43216-5000SIZEA 5962-96598REVISION LEVELBSHEET19DESC FORM 193AJUL 94APPENDIX AAPPENDIX A FORMS A PART OF SMD 5962-96598Document No: 5962-965
40、98Revision: ANOR No: 5962-R209-97Sheet: 5 of 830.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.5 of the body ofthis document.30.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein,
41、 theelectrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of thisdocument.30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficientto make the packaged die capable of
42、meeting the electrical performance requirements in table I.30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to acustomer, shall be identified with the wafer lot number, the certification mark, the manufacturers identification and the PI
43、N listedin 10.2 herein. The certification mark shall be a QM” or Q” as required by MIL-PRF-38535.30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (se
44、e 60.4 herein). The certificate ofcompliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that themanufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein.30.7 Certificate of conform
45、ance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535shall be provided with each lot of microcircuit die delivered to this drawing.40. QUALITY ASSURANCE PROVISIONS40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures sha
46、ll be in accordancewith MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modifications in the QMplan shall not effect the form, fit or function as described herein.40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-3853
47、5, and as defined in themanufacturers QM plan. As a minimum it shall consist of:a) Wafer Lot acceptance for Class V product using the criteria defined within MIL-STD-883 TM 5007.b) 100% wafer probe (see paragraph 30.4).c) 100% internal visual inspection to the applicable class Q or V criteria define
48、d within MIL-STD-883 TM2010 or the alternate procedures allowed within MIL-STD-883 TM5004.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMILITARY DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSDAYTON, OHIO 43216-5000SIZEA 5962-96598REVISION LEVELBSHE
49、ET20DESC FORM 193AJUL 94APPENDIX AAPPENDIX A FORMS A PART OF SMD 5962-96598Document No: 5962-96598Revision: ANOR No: 5962-R209-97Sheet: 6 of 840.3 Conformance inspection.40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiationassured (see 30.5 herein). RHA levels for
